HLMP-CWxx
T-13/4 Precision Optical Performance
White LED Lamps
Data Sheet
HLMP-CW15, HLMP-CW16, HLMP-CW23, HLMP-CW24,
HLMP-CW30, HLMP-CW31, HLMP-CW70, HLMP-CW72
Description
Features
These high intensity white LED lamps are based on
InGaN material technology. A blue LED die is coated by
a phosphor to produce white. The typical resulting color
is described by the coordinates x = 0.32, y = 0.32 using
the 1931 CIE Chromaticity Diagram.
• Highly luminous white emission
These T-13⁄4 lamps are untinted, nondiffused, and incorporate precise optics producing well defined spatial radiation
patterns at specific viewing cone angle.
• Small area illumination
• 15°, 23°, 30°, and 70° viewing angle
Applications
• Indoor Electronic signs and signals
• Legend backlighting
• General purpose indicators
Benefit
• Reduced power consumption, higher reliability, and increased optical/mechanical design flexibility compared
to incandescent bulbs and other alternative white light
sources
CAUTION: These devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling
and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Device Selection Guide
Part Number
Viewing Angle
Typ.
Min. Luminous Intensity
Iv (mcd) @ 20 mA
Min.
Max.
Standoff Leads
Package Dimension
HLMP-CW15-TW0xx
15°
2500
7200
No
A
HLMP-CW15-TW0xx
15°
2500
7200
No
A
HLMP-CW15-UV0xx
15°
3200
5500
No
A
HLMP-CW15-VWBxx
15°
4200
7200
No
A
HLMP-CW15-VY0xx
15°
4200
12000
No
A
HLMP-CW15-VYBxx
15°
4200
12000
No
A
HLMP-CW15-VYGxx
15°
4200
12000
No
A
HLMP-CW15-VYKxx
15°
4200
12000
No
A
HLMP-CW16-R00xx
15°
1500
-
Yes
B
HLMP-CW16-TW0xx
15°
2500
7200
Yes
B
HLMP-CW16-VY0xx
15°
4200
12000
Yes
B
HLMP-CW23-SV0xx
23°
1900
5500
No
A
HLMP-CW23-SVKxx
23°
1900
5500
No
A
HLMP-CW23-TW0xx
23°
2500
7200
No
A
HLMP-CW24-SV0xx
23°
1900
5500
Yes
B
HLMP-CW24-TW0xx
23°
2500
7200
Yes
B
HLMP-CW30-PS0xx
30°
880
2500
No
A
HLMP-CW30-RU0xx
30°
1500
4200
No
A
HLMP-CW30-STBxx
30°
1900
3200
No
A
HLMP-CW30-SV0xx
30°
1900
5500
No
A
HLMP-CW31-M00xx
30°
520
-
Yes
B
HLMP-CW31-PS0xx
30°
880
2500
Yes
B
HLMP-CW31-SV0xx
30°
1900
5500
Yes
B
HLMP-CW70-LMBxx
70º
400
680
No
A
HLMP-CW70-LP0xx
70º
400
1150
No
A
HLMP-CW72-LP0xx
70º
400
1150
Yes
B
Notes:
1. Tolerance for each intensity limit is ±15%.
2. Please refer to AN 5352 for detail information on features of stand-off and non stand-off LEDs.
Package Dimensions
5.00 ± 0.20
(0.197 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
d
1.14 ± 0.20
(0.045 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
0.70 (0.028)
MAX.
2.35 (0.093)
MAX.
31.60
MIN.
(1.244)
CATHODE
FLAT
CATHODE
LEAD
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
PACKAGE DIMENSION A
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS.
1.50 ± 0.15
(0.059 ± 0.006)
0.70 (0.028)
MAX.
CATHODE
LEAD
1.00 MIN.
(0.039)
31.60 MIN.
(1.244)
1.00 MIN.
(0.039)
CATHODE
FLAT
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
PACKAGE DIMENSION B
HLMP-CW16
HLMP-CW24
HLMP-CW31
HLMP-CW72
d = 12.6 ± 0.25 d = 12.52 ± 0.25 d = 11.96 ± 0.25 d = 12.52 ± 0.25
(0.496 ± 0.010) (0.493 ± 0.010) (0.471 ± 0.010) (0.493 ± 0.010)
Part Numbering System
HLMP – C Wxx - x x x xx
Mechanical Option
00: Bulk
DD: Ammo Pack
Color Bin Option
0: Full color bin distribution
B: Color bins 2 & 3
G: Color bins 2, 3 & 4
K: Color bins 2 & 4
Maximum Intensity Bin Limit
0: No maximum intensity bin limit
Others: Refer to Device Selection Guide
Minimum Intensity Bin Limit
Refer to Device Selection Guide
Viewing Angle and Standoff Option
15: 15° without standoffs
16: 15° with standoffs
23: 23° without standoffs
24: 23° with standoffs
30: 30° without standoffs
31: 30° with standoffs
70: 50° without standoffs
72: 50° with standoffs
Note: Please refer to AB 5337 for complete information about part numbering system.
Absolute Maximum Ratings
TA = 25˚C
Parameter
Value
Units
DC Forward Current[1]
30
mA
Peak Forward Current[2]
100
mA
Power Dissipation
111
mW
Reverse Voltage (IR = 10 µA)
5
V
LED Junction Temperature
110
oC
Operating Temperature Range
–40 to +80
oC
Storage Temperature Range
–40 to +100
oC
Notes:
1. Derate linearly as shown in Figure 5.
2. Duty factor 10% Frequency 1 kHz.
Electrical Characteristics
TA = 25°C
Forward Voltage,
VF (V) @ IF = 20 mA
Typ.
Max.
Reverse Breakdown,
VR (V) @ IR = 10 µA
Min.
Capacitance, C (pF),
VF = 0, f = 1 MHz
Typ.
Thermal Resistance
RθJ-PIN (°C/W)
Typ.
3.2
5
70
240
3.7
Optical Characteristics
TA = 25°C
Part Number
Typical Chromaticity
Coordinates[1]
X
Y
Viewing Angle
2θ1/2 Degrees[2]
Typ.
HLMP-CW3x-xxxxx
0.32
0.32
30
HLMP-CW2x-xxxxx
0.32
0.32
23
HLMP-CW1x-xxxxx
0.32
0.32
15
HLMP-CW7x-xxxxx
0.32
0.32
50
Notes:
1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.
2. θ1/2 is the off-axis angle where the luminous intensity is 1⁄2 the peak intensity.
35
0.8
0.6
0.4
0.2
0
380
480
580
680
30
25
20
15
10
5
0
780
1.5
RELATIVE LUMINOUS INTENSITY
FORWARD CURRENT – mA
RELATIVE LUMINOUS INTENSITY
1.0
0
1
Figure 1. Relative intensity vs. wavelength
MAXIMUM FORWARD CURRENT - mA
Y-COORDINATES
1 mA
5 mA
0.010
10 mA
0.005
15 mA
20 mA
0
25 mA
-0.005
30 mA
-0.010
-0.004
-0.002
0
4
Figure 2. Forward current vs. forward voltage
0.025
0.015
3
FORWARD VOLTAGE – V
WAVELENGTH – nm
0.020
2
0.002
0.004
35
30
25
20
15
10
5
0
0 10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE - °C
X-COORDINATES
(X,Y) VALUES @ 20 mA REFERENCE TO (0,0)
Figure 4. Chromaticity shift vs. current
Figure 5. Maximum forward current vs. temperature
RELATIVE INTENSITY
1
0.5
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT – DEGREES
Figure 6a. CW1x spatial radiation pattern
60
90
1.2
0.9
0.6
0.3
0
0
10
20
FORWARD CURRENT – mA
Figure 3. Relative lv vs. forward current
30
RELATIVE LUMINOUS INTENSITY
1
0.5
0
-90
-60
-30
0
30
60
90
60
90
60
90
ANGULAR DISPLACEMENT – DEGREES
Figure 6b. CW2x spatial radiation pattern
RELATIVE LUMINOUS INTENSITY
1
0.5
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT – DEGREES
Figure 6c. CW3x spatial radiation pattern
RELATIVE LUMINOUS INTENSITY
1
0.5
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT – DEGREES
Figure 6c. CW7x spatial radiation pattern
Intensity Bin Limits
Color Bin Limit Table
(mcd at 20 mA)
Rank
Limits (Chromaticity Coordinates)
Bin
Min.
Max.
L
400
520
1
x
y
0.330
0.360
0.330
0.318
0.356
0.351
0.361
0.385
M
520
680
N
680
880
2
x
y
0.287
0.295
0.296
0.276
0.330
0.318
0.330
0.339
P
880
1150
3
x
y
0.264
0.267
0.280
0.248
0.296
0.276
0.283
0.305
Q
1150
1500
R
1500
1900
4
x
y
0.283
0.305
0.287
0.295
0.330
0.339
0.330
0.360
S
1900
2500
T
2500
3200
U
3200
4200
V
4200
5500
W
5500
7200
X
7200
9300
Y
9300
12000
Z
12000
16000
Tolerance for each bin limit is ± 0.01.
Note:
Bin categories are established for classification of products. Products may not be available in all
bin categories. Please contact your Avago representative for information on currently available
bins.
Color Bin Limits with Respect to CIE
1931 Chromaticity Diagram
0.40
Y-COORDINATE
Tolerance for each bin limit is ± 15%.
0.35
4
1
BLACK
BODY
CURVE
2
0.30
3
0.25
0.20
0.26
0.30
0.34
0.38
X-COORDINATE
Relative Light Output vs. Junction Temperature
RELATIVE LIGHT OUTPUT
( NORMALIZED AT TJ = 25ºC)
10
1
0.1
-40
-20
0
20
40
60
TJ - JUNCTION TEMPERATURE - °C
80
100
Precautions:
Note:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms
a mechanical ground which prevents mechanical
stress due to lead cutting from traveling into LED
package. This is highly recommended for hand solder
operation, as the excess lead length also acts as small
heat sink.
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The
closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59mm. Soldering the LED using soldering iron tip
closer than 1.59mm might damage the LED.
1.59mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED configuration
CATHODE
InGaN Device
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED
lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
TEMPERATURE (°C)
Flux: Rosin flux
200
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
150
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
100
50
PREHEAT
0
10
20
30
40
50
60
TIME (MINUTES)
70
80
90
100
Ammo Packs Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
20.50 ± 1.00
(0.807 ± 0.039)
9.125 ± 0.625
(0.3593 ± 0.0246)
18.00 ± 0.50
(0.7087 ± 0.0197)
A
12.70 ± 0.30
(0.50 ± 0.0118)
0.70 ± 0.20
(0.0276 ± 0.0079)
A
VIEW A–A
ALL DIMENSIONS IN MILLIMETERS (INCHES).
Note: The ammopacks drawing is applicable to option -DD & -ZZ and regardless of standoff or non standoff.
10
∅
4.00 ± 0.20 TYP.
(0.1575 ± 0.008)
Packaging Box Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
A
+
O
AG ES
AV LOGI
DE
NO
HO –
CH
AT
E
OD
AN
TE
C
ANODE LEAD LEAVES
THE BOX FIRST.
C
ER
TH
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BE
LA
Note: For InGaN device, the ammo pack packaging box contains ESD logo.
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1T) Lot: Lot Number
STANDARD LABEL LS0002
RoHS Compliant
e1 max temp 250C
(Q) QTY: Quantity
LPN
CAT: Intensity Bin
(9D) MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
REV:
(V) Vendor ID
DeptID:
(1P) Item: Part Number
Made In: Country of Origin
11
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e1 max temp 250C
PART #: Part Number
LOT#: Lot Number
MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin
and VF bin)
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED
OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION,
MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO
OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4125EN
AV02-0214EN - April 4, 2008
