HLMP-CW72-LP0XX

HLMP-CW70, HLMP-CW72 T-1 3/4 Precision Optical Performance White LED Data Sheet Description This high intensity white LED lamp is based on InGaN material technology. A blue LED die is coated by phosphor to produce white. The typical resulting color is described by the coordinates x = 0.32, y = 0.32 using the 1931 CIE Chromaticity Diagram. This T- 1 3/4 lamp is untinted, diffused, and incorporate precise optics which produce well defined spatial radiation patterns at specific viewing cone angle. Applications • Electronic Signs and Signals • Small Area Illumination • Legend Backlighting • General Purpose Indicators Features • Highly Luminous White Emission • 70° viewing angle Benefit • Reduced Power Consumption, Higher Reliability, and Increased Optical/Mechanical Design Flexibility Compared to Incandescent Bulbs and Other Alternative White Light Sources Package Dimensions A. .35 max .093 1.1±0.0 .05±.008 0.70 max .08 0.50±0.10 sq. typ. .00±.00 ø 5.80±0.0 .8±.008 5.00±0.0 note#1 .197±.008 cathode lead 1.00 min .039 .5±0.38 .100±.015 8.71±0.0 .33±.008 31.60 min 1. cathode flat B. 1.1±0.0 .05±.008 NOTES: 1. MEASURED JUST ABOVE FLANGE. 1.50±0.15 .059±.006 ø 0.70 max .08 0.50±0.10 sq. typ. .00±.00 .5±0.38 .100±.015 cathode lead 31.60 min 1. 1.00 min .039 8.71±0.0 .33±.008 5.80±0.0 .8±.008 5.00±0.0 note#1 .197±.008 1.5±0.5 .93±.010 cathode flat Notes: 1. All dimensions are in millimeters / inches. 2. Expoxy meniscus may extend about 1mm (0.040”) down the leads. CAUTION : These devices are Class 1 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Device Selection Guide Part Number HLMP-CW70-LP0xx HLMP-CW72-LP0xx Min Luminous Intensity Iv (mcd) @ 20mA 400 400 Max Luminous Intensity Iv (mcd) @ 20mA 1150 1150 Standoff Option No Yes Package Dimension A B Tolerance for intensity limit is ± 15% Part Numbering System HLMP – CW7x - x x x xx Mechanical Option 00: Bulk DD: Ammo Pack Color Bin Option 0: Full color bin distribution Maximum Intensity Bin Limit 0: No maximum intensity bin limit Minimum Intensity Bin Limit Refer to Device Selection Guide Viewing Angle and Standoff Option 70 : 70 without standoffs 7 : 70 with standoffs Absolute Maximum Ratings (TA = 25°C) Parameters DC forward current [1] Peak forward current [2] Power dissipation Reverse Voltage (IR = 10µA) LED junction temperature Operating temperature range Storage temperature range Notes: 1. Derate linearly as shown in Figure 5. 2. Duty factor 10%, 1 KHz. Value 30 100 120 5 110 -40 to +85 -40 to +100 Unit mA mA mW V oC oC oC Electrical Characteristics (TA = 25°C) Forward Voltage, VF (V) @ IF = 20 mA Typ. 3.6 Max. 4.0 Reverse Breakdown, VR (V) @ IR = 10mA Min. 5 Capacitance, C (pF), VF = 0,f = 1 MHz Typ. 70 Thermal Resistance RqJ-PIN (°C/W) Typ. 240  Optical Characteristics (TA = 25°C) Typical Chromaticity Coordinates [1] X Y 0.32 0.32 Viewing Angle 2q1/2 (Degrees) [2] Typ. 70 Notes: 1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 2. 1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. 30 1.0 Relative Luminous Intensity Forward Current (mA) 80 580 Wavelength (nm) 680 780 0.8 0.6 0. 0. 0.0 380 0 10 0 0 1  Forward Voltage (V) 3  Figure 1. Relative Intensity vs Wavelength 1. 1. Relative Luminous Intensity 1.0 0.8 0.6 0. 0. 0.0 0 10 0 Forward Current (mA) 30 Figure 2. Forward Current vs Forward Voltage 0.05 (X,Y) VALUES @ 0mA REFERENCE TO (0,0) 0.00 0.015 Y-Coordinates 0.010 0.005 0 -0.005 -0.010 -0.00 5mA 30mA -0.00 0 X-Coordinates 0.00 0.00 15mA 0mA 10mA 1mA 5mA Figure 3. Relative Iv vs. Forward Current Figure 4. Chromaticity shift vs. current 30 Maximum Forward Current (mA) Relative Luminous Intensity 5 0 15 10 5 0 0 0 0 60 80 Ambient Temperature (˚C) 100 RqJ-A=780˚C/W RqJ-A=585˚C/W 1.0 0.5 0.0 -90 -60 -30 0 30 60 Angular Displacement (Degree) 90 Figure 5. Maximum Fwd. Current vs Temperature Figure 6. Spatial Radiation Pattern 3 Intensity Bin Limits (mcd at 20 mA) Bin K L M N P Q R S T U V W Intensity (mcd) at 20 mA Min 310 400 520 680 880 1150 1500 1900 2500 3200 4200 5500 Max 400 520 680 880 1150 1500 1900 2500 3200 4200 5500 7200 Color Bin Limit Tables Limits (Chromaticity Coordinates) 1 X Y 2 X Y 3 X Y 4 X Y 0.330 0.360 0.287 0.295 0.264 0.267 0.283 0.305 0.330 0.318 0.296 0.276 0.280 0.248 0.287 0.295 0.356 0.351 0.330 0.318 0.296 0.276 0.330 0.339 0.361 0.385 0.330 0.339 0.283 0.305 0.330 0.360 Tolerance for each bin limit is ± 0.01 Tolerance for each bin limit is ± 15%. Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram 0.0 0.35 Y-coordinate   1 0.30 3 0.5 Blac k Body Curv e 0.0 0.6 0.3 X- coor dinate 0.3 0.38 Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago Technologies representative for information on currently available  Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Condition: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering condition: Wave Soldering Pre-heat temperature Preheat time Peak temperature Dwell time 105 °C Max. 30 sec Max 250 °C Max. 3 sec Max. Manual Solder Dipping 260 °C Max. 5 sec Max • Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through holes size for LED component leads. LED component lead size 0.457 x 0.457mm (0.025 inch) 0.508 x 0.508mm (0.028 inch) Diagonal 0.646 mm (0.038 to 0.042 inch) 0.718 mm (0.041 to 0.045 inch Plated through hole diameter (0.018 x 0.018inch) 0.976 to 1.078 mm (0.020 x 0.020inch) 1.049 to 1.150mm Note: Refer to application note AN1027 for more information on soldering LED components. Recommended Wave Soldering Profile TURBULENT WAVE 50 LAMINAR WAVE HOT AIR KNIFE 00 BOTTOM SIDE OF PC BOARD TEMPERATURE - ˚C 150 FLUXING 100 TOP SIDE OF PC BOARD 50 30 PREHEAT 10 0 30 0 50 TIME - SECONDS 60 70 80 90 100 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150 C (100 C PCB) SOLDER WAVE TEMPERATURE = 5 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.5 IN.) AIR KNIFE ANGLE = 0 SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. 0 5 For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. 5989-4123EN - May 9, 2006