HLMP-CW78-LP0DD

Agilent HLMP-CW78, HLMP-CW79, T-1 3/4 Precision Optical Performance White LED Data Sheet Description This high intensity white LED lamp is based on InGaN material technology. A blue LED die is coated by phosphor to produce white. The typical resulting color is described by the coordinates x = 0.32, y = 0.32 using the 1931 CIE Chromaticity Diagram. This T- 1 3/4 lamp is untinted, diffused, and incorporate precise optics which produce well defined spatial radiation patterns at specific viewing cone angle. Features Benefit • ESD class 3 • Reduced Power Consumption, Higher Reliability, and Increased Optical/Mechanical Design Flexibility Compared to Incandescent Bulbs and Other Alternative White Light SourcesPackage Dimension Applications • Highly Luminous White Emission • 70o viewing angle • New InGaN flip chip die technology with protective diode. • Electronic Signs and Signals • Small Area Illumination • Legend Backlighting • General Purpose Indicators Package Dimensions Package Dimension of HLMP-CW78 2.35 max .093 1.14±0.20 .045±.008 ø5.80±0.20 .228±.008 0.50±0.10 sq. typ. .020±.004 0.70 max .028 5.00±0.20 note#1 .197±.008 2.54±0.38 .100±.015 cathode lead 8.71±0.20 .343±.008 1.00 min .039 cathode flat 31.60 min 1.244 Package Dimension of HLMP-CW79 1.14±0.20 .045±.008 8.71±0.20 .343±.008 NOTES: 1. MEASURED JUST ABOVE FLANGE. 1.50±0.15 .059±.006 0.70 max .028 ø5.80±0.20 .228±.008 0.50±0.10 sq. typ. .020±.004 2.54±0.38 .100±.015 5.00±0.20 note#1 .197±.008 cathode lead 12.52±0.25 .493±0.010 31.60 min 1.244 1.00 min .039 cathode flat Device Selection Guide Luminous Intensity (mcd) @ 20mA Part Number Typ. Viewing Angle Standoff Leads Minimum Typical HLMP-CW78-LP0xx 70° 400 670 No HLMP-CW79-LP0xx 70° 400 670 Yes Notes: 1. Tolerance for luminous intensity measurement is +/- 15% 2. The luminous intensity is measured on the mechanical axis of the lamp package. 3. The optical axis is closely aligned with the package mechanical axis. Part Numbering System H L M P - C W XX - X X X XX Mechanical Option 00: Bulk DD: Ammo Pack Straight Leads Color Bin Options 0: Full color bin distribution Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle 78: 70 without standoff 79: 70 ˚ with standoff Color Options W: White Package Options C: T-1 3/4 2 Absolute Maximum Ratings (TA = 25°C) Parameter Value Units DC Forward Current [1] 30 mA Peak Forward Current 100 mA Average Forward Current 30 mA Power Dissipation 120 mW LED Junction Temperature 130 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 5. 2. Duty factor 30%, frequency 1kHz Electrical/Optical Characteristics (TA = 25oC) Parameters Symbol Forward voltage Minimum Typical Maximum Units Test Condition VF 3.4 4.0 V IF = 20 mA Capacitance C 53 pF VF=0, f=1 MHz Reverse Voltage [1] VR 0.6 V IR = 10 µA Thermal resistance RθJ-PIN 240 oC/W LED Junction to cathode lead Viewing Angle [2] 2θ1/2 70 Degree IF = 20 mA Chromaticity Coordinate [3] X Y 0.31 0.32 IF = 20 mA Notes: 1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA 2. 2θ1/2 is the off-axis angle where the luminous intensity is ½ the on axis intensity 3. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 3 30 1.0 Forward Current (mA) Relative Intensity 0.8 0.6 0.4 0.2 10 0 0.0 380 480 580 Wavelength (nm) 680 0 780 Figure 1. Relative Intensity vs. Wavelength Maximum Forward Current (mA) 1.2 0.9 0.6 0.3 0.0 0 1 2 Forward Voltage (V) 3 4 Figure 2. Forward Current vs. Forward Voltage 1.5 Relative Luminous Intensity 20 10 20 DC Forward Current (mA) 30 RθJ-A = 585˚ C/W 25 20 RθJ-A = 780˚ C/W 15 10 5 0 0 30 Figure 3. Relative lv vs. Forward Current 35 20 40 60 Ambient Temperature (C) 80 100 Figure 4. Maximum Forward Current vs. Temperature 0.020 1.0 1mA Relative Luminous Intensity 0.015 Y-Coordinates 5mA 0.010 10mA 15mA 0.005 20mA 0 -0.005 25mA 30mA -0.010 -0.004 -0.002 0 X-Coordinates 0.002 Figure 5. Chromaticity Coordinate Change over Forward Current 4 0.004 0.8 0.6 0.4 0.2 0.0 -90 -60 -30 0 30 60 Angular Displacement (Degree) Figure 6. Radiation Pattern 90 Intensity Bin Limits (mcd at 20 mA) Bin Min. Max. L 400 520 M 520 680 N 680 880 P 880 1150 Color Bin Limit Tables Limits (Chromaticity Coordinates) Rank Tolerance for each bin limit is ± 15%. 1 x y 0.330 0.360 0.330 0.318 0.356 0.351 0.361 0.385 2 x y 0.287 0.295 0.296 0.276 0.330 0.318 0.330 0.339 3 x y 0.264 0.267 0.280 0.248 0.296 0.276 0.283 0.305 4 x y 0.283 0.305 0.287 0.295 0.330 0.339 0.330 0.360 Tolerance for each bin limit is ± 0.01 Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Agilent representative for information on currently available Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram 0.40 0.35 1 Y-coordinate 4 Black Body Curve 2 0.30 3 0.25 0.20 0.26 0.3 0.34 0.38 X-coordinate 5 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Condition: • Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended PC board plated through holes • Recommended soldering condition: Wave Soldering Manual Solder Dipping Pre-heat temperature 105 °C Max. − Preheat time 30 sec Max − Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max LED component ead size Diagonal Plated through hole diameter 0.457 x 0.457mm (0.018 x 0.018inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508mm (0.020 x 0.020inch) 0.718 mm (0.028 inch) 1.049 to 1.150mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. Recommended Wave Soldering Profile LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 200 TEMPERATURE - ˚C BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 150 FLUXING CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150 C (100 C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 100 50 30 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 0 10 20 30 40 50 TIME - SECONDS 6 60 70 80 90 100 www.agilent.com/ semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright 2005 Agilent Technologies, Inc. October 31, 2005 Obsoletes 5989-0460EN 5989-4154EN