HLMP-CXXX

HLMP-Cxxx T-13/4 (5 mm) Extra Bright Precision Optical Performance InGaN LED Lamps Data Sheet HLMP-CB11, HLMP-CB12, HLMP-CM11, HLMP-CM12, HLMP-CE11, HLMP-CE12, HLMP-CB26, HLMP-CB27, HLMP-CM26, HLMP-CM27, HLMP-CE26, HLMP-CE27, HLMP-CB36, HLMP-CB37, HLMP-CM36, HLMP-CM37, HLMP-CE36, HLMP-CE37 Description These high intensity blue, green, and cyan LEDs are based on the most efficient and cost effective InGaN material technology. The 470 nm typical dominant wave–length for blue and 525 nm typical wavelength for green is well suited to color mixing in full color signs. The 505 nm typical dominant wavelength for cyan is suitable for traffic signal application. These LED lamps are untinted, non-diffused, T-13/4 packages incorporating second generation optics which produce well-defined spatial radiation patterns at specific viewing cone angles. These lamps are made with an advanced optical grade epoxy, offering superior temperature and moisture resistance in outdoor signal and sign applications. The high maximum LED junction temperature limit of +110° C enables high temperature operation in bright sunlight conditions. Features • • • • • • Well defined spatial radiation pattern High luminous output Available in blue, green, and cyan color Viewing angle: 15°, 23° and 30° Standoff or non-standoff leads Superior resistance to moisture Applications • • • • Traffic signals Commercial outdoor advertising Front panel backlighting Front panel indicator CAUTION: Devices are Class I ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions Package A 2.35 (0.093) MAX. 1.14 ± 0.20 (0.045 ± 0.008) ∅ 5.80 ± 0.20 (0.228 ± 0.008) 0.70 (0.028) MAX. 2.54 ± 0.38 (0.100 ± 0.015) 4.90 ± 0.20 (0.193 ± 0.008) 8.61 ± 0.20 (0.339 ± 0.008) CATHODE LEAD CATHODE FLAT 31.60 MIN. (1.244) Package B 1.14 ± 0.20 (0.045 ± 0.008) 1.50 ± 0.15 (0.059 ± 0.006) 0.70 (0.028) MAX. 4.90 ± 0.20 NOTE 1 (0.192 ± 0.008) ∅ 5.80 ± 0.20 (0.228 ± 0.008) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 2.54 ± 0.38 (0.100 ± 0.015) 8.61 ± 0.20 (0.339 ± 0.008) DIMENSION H CATHODE LEAD 1.00 MIN. (0.039) CATHODE FLAT 31.60 MIN. (1.244) DIMENSION H: 15° = 10.80 ± 0.25 mm (0.425 ± 0.01 INCH) 23° = 10.00 ± 0.25 mm (0.394 ± 0.01 INCH) 30° = 11.27 ± 0.25 mm (0.444 ± 0.01 INCH) NOTES: 1. MEASURED JUST ABOVE FLANGE. 2. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 3. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. 4. IF HEAT SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE. 2 Device Selection Guide Typical Viewing Angle, 2q1/2 (Degree) 15 15 15 15 15 15 15 15 23 23 23 23 23 23 23 23 30 30 30 30 30 30 30 30 30 30 30 30 Intensity (cd) at 20 mA Min. Max. 2.5 3.2 2.5 9.3 12.0 9.3 7.2 7.2 1.9 2.5 1.9 7.2 9.3 7.2 5.5 5.5 1.15 1.5 1.5 1.5 1.5 7.2 7.2 7.2 7.2 7.2 5.5 5.5 7.2 5.5 7.2 27.0 21.0 27.0 21.0 21.0 5.5 4.2 5.5 21.0 16.0 21.0 16.0 16.0 3.2 2.5 2.5 4.2 2.5 21.0 12.0 21.0 12.0 12.0 16.0 16.0 Package Dimension A A B A A B A B A A B A A B A B A A A B B A A B B B A B Part Number HLMP-CB11-TW0xx HLMP-CB11-UVAxx HLMP-CB12-TW0xx HLMP-CM11-Y20xx HLMP-CM11-Z1Cxx HLMP-CM12-Y20xx HLMP-CE11-X10xx HLMP-CE12-X10xx HLMP-CB26-SV0xx HLMP-CB26-TUDxx HLMP-CB27-SV0xx HLMP-CM26-X10xx HLMP-CM26-YZCxx HLMP-CM27-X10xx HLMP-CE26-WZ0xx HLMP-CE27-WZ0xx HLMP-CB36-QT0xx HLMP-CB36-RSAxx HLMP-CB36-RSBxx HLMP-CB37-RU0xx HLMP-CB37-RSDxx HLMP-CM36-X10xx HLMP-CM36-XYCxx HLMP-CM37-X10xx HLMP-CM37-XYCxx HLMP-CM37-XYDxx HLMP-CE36-WZ0xx HLMP-CE37-WZ0xx Color Blue Blue Blue Green Green Green Cyan Cyan Blue Blue Blue Green Green Green Cyan Cyan Blue Blue Blue Blue Blue Green Green Green Green Green Cyan Cyan Standoff No No Yes No No Yes No Yes No No Yes No No Yes No Yes No No No Yes Yes No No Yes Yes Yes No Yes Lens Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Notes: 1. Tolerance for luminous intensity measurement is ±15%. 2. The luminous intensity is measured on the mechanical axis of the lamp package. 3. The optical axis is closely aligned with the package mechanical axis. 4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper safety equipment. 5. 2q1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity. 3 Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk DD: Ammo Pack Color Bin Options 0: Full Color Bin Distribution A: Color Bin 1 and 2 B: Color Bin 2 and 3 C: Color Bin 3 and 4 D: Color Bin 4 and 5 Maximum Intensity Bin 0: No Maximum Intensity Bin Limitation Others: Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Viewing Intensity Bin 11: 15° Without Standoff 12: 15° With Standoff 26: 23° Without Standoff 27: 23° With Standoff 36: 30° Without standoff 37: 30° With Standoff Color B: Blue 470 nm M: Green 525 nm E: Cyan 505 nm Package C: T-13/4 (5 mm) Round Lamp 4 Absolute Maximum Rating at TA = 25°C Parameters DC Forward Current [1] Peak Pulsed Forward Current[2] Power Dissipation LED Junction Temperature Operating Temperature Range Storage Temperature Range Notes: 1. Derate linearly as shown in Figure 2. 2. Duty factor 10%, frequency 1 KHz. Value 30 100 116 130 –40 to +85 –40 to +100 Unit mA mA mW °C °C °C Electrical/Optical Characteristics TA = 25oC Blue Parameters Forward Voltage Reverse Voltage[1] Thermal Resistance Dominant Wavelength[2] Peak Wavelength Symbol VF VR RqJ-PIN ld lPEAK 460 5.0 240 470 480 464 520 Min. Typ. Max. 3.2 3.85 5.0 240 525 540 516 Green Min. Typ. Max. 3.3 3.85 5.0 240 490 505 508 501 Cyan Min. Typ. Max. 3.2 3.85 Units V V oC/W Test Condition IF = 20 mA IR = 10 µA LED Junction to Anode Lead IF = 20 mA Peak of Wavelength of Spectral Distribution at IF = 20 mA Wavelength Width at Spectral Distribution Power Point at IF = 20 mA nm nm Spectral Half Width Dl1/2 23 32 30 nm Luminous Efficacy[3] hv 74 484 319 lm/W Emitted Luminous Power/Emitted Radiant Power Notes: 1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA. 2. The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp. 3. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. 5 1.0 CYAN 0.8 IF MAX. – MAXIMUM FORWARD CURRENT – mA 35 30 25 RθJ-A = 780 °C/W 20 15 10 5 0 RELATIVE INTENSITY BLUE 0.6 GREEN 0.4 0.2 0 380 430 480 530 580 630 680 0 10 20 30 40 50 60 70 80 90 WAVELENGTH – nm TA – AMBIENT TEMPERATURE – °C Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. ambient temperature. 35 30 1.035 RELATIVE DOMINANT WAVELENGTH 1.030 CYAN 1.025 1.020 GREEN 1.015 1.010 1.005 1.000 0.995 0.990 0 5 10 15 20 25 30 BLUE FORWARD CURRENT – mA 25 20 15 10 5 0 0 1.0 2.0 3.0 4.0 FORWARD VOLTAGE – V DC FORWARD CURRENT – mA Figure 3. Forward current vs. forward voltage. Figure 4. Relative dominant wavelength vs. DC forward current. 1.6 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 DC FORWARD CURRENT – mA Figure 5. Relative intensity vs. DC forward current. 6 1 NORMALIZED INTENSITY 0.5 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT – DEGREES Figure 6. Spatial radiation pattern for Cx11 and Cx12. 1 NORMALIZED INTENSITY 0.5 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT – DEGREES Figure 7. Spatial radiation pattern for Cx26 and Cx27. 1 NORMALIZED INTENSITY 0.5 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT – DEGREES Figure 8. Spatial radiation pattern for Cx36 and Cx37. 7 Intensity Bin Limit Table Intensity (mcd) at 20 mA Bin N P Q R S T U V W X Y Z 1 Min 680 880 1150 1500 1900 2500 3200 4200 5500 7200 9300 12000 16000 Max 880 1150 1500 1900 2500 3200 4200 5500 7200 9300 12000 16000 21000 Blue Color Bin Table Bin 1 2 3 4 5 Min Dom 460.0 464.0 468.0 472.0 476.0 Max Dom 464.0 468.0 472.0 476.0 480.0 Xmin 0.1440 0.1818 0.1374 0.1766 0.1291 0.1699 0.1187 0.1616 0.1063 0.1517 Tolerance for each bin limit is ±0.5 nm. Ymin 0.0297 0.0904 0.0374 0.0966 0.0495 0.1062 0.0671 0.1209 0.0945 0.1423 Xmax 0.1766 0.1374 0.1699 0.1291 0.1616 0.1187 0.1517 0.1063 0.1397 0.0913 Ymax 0.0966 0.0374 0.1062 0.0495 0.1209 0.0671 0.1423 0.0945 0.1728 0.1327 Green Color Bin Table Bin 1 2 3 4 5 Min Dom 520.0 524.0 528.0 532.0 536.0 Max Dom 524.0 528.0 532.0 536.0 540.0 Xmin 0.0743 0.1650 0.1060 0.1856 0.1387 0.2068 0.1702 0.2273 0.2003 0.2469 Tolerance for each bin limit is ±0.5 nm. Ymin 0.8338 0.6586 0.8292 0.6556 0.8148 0.6463 0.7965 0.6344 0.7764 0.6213 Xmax 0.1856 0.1060 0.2068 0.1387 0.2273 0.1702 0.2469 0.2003 0.2659 0.2296 Ymax 0.6556 0.8292 0.6463 0.8148 0.6344 0.7965 0.6213 0.7764 0.6070 0.7543 Tolerance for each bin limit is ± 15%. Cyan Color Bin Table Bin 1 2 3 4 7 8 Min Dom 490.0 495.0 500.0 505.0 498.0 503.0 Max Dom 495.0 500.0 505.0 510.0 503.0 508.0 Xmin 0.0454 0.1318 0.0345 0.1164 0.0082 0.1057 0.0039 0.1027 0.0132 0.1092 0.0040 0.1028 Tolerance for each bin limit is ±0.5 nm. Ymin 0.2945 0.306 0.4127 0.3889 0.5384 0.4769 0.6548 0.5584 0.4882 0.4417 0.6104 0.5273 Xmax 0.1164 0.0235 0.1057 0.0082 0.1027 0.0039 0.1097 0.0139 0.1028 0.0040 0.1056 0.0080 Ymax 0.3889 0.4127 0.4769 0.5384 0.5584 0.6548 0.6251 0.7502 0.5273 0.6104 0.6007 0.7153 8 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25° C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: Wave Soldering 105 °C Max. 30 sec Max. 250 °C Max. 3 sec Max. Manual Solder Dipping – – 260 °C Max. 5 sec Max. Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time Note: Refer to application note AN1027 for more information on soldering LED components. TURBULENT WAVE 250 TEMPERATURE – °C LAMINAR WAVE HOT AIR KNIFE BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 200 150 FLUXING CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. 100 50 30 0 10 PREHEAT 20 30 40 50 60 70 80 90 100 TIME – SECONDS Figure 9. Recommended wave soldering profile. 9 For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3337EN 5989-4115EN June 26, 2006