HLMP-CY11-WZ0DD

HLMP-CYxx Precision Optical Performance 5mm Round Warm White LED Lamps Data Sheet Description These high intensity white LED lamps are based on InGaN material technology. A blue LED die is coated by phosphor to produce white. The typical resulting color is described by the coordinates x= 0.41, y = 0.39 using the CIE 1931 Chromaticity Diagram. These T-1¾ lamps are untinted, non-diffused, and incorporate precise optics which produce welldefined spatial radiation patterns at specific viewing cone angle. Features • Well defined spatial radiation pattern • High luminous white emission • Viewing angle: 15°, 23°, 30° and 50° • Standoff or non-standoff leads Package Dimensions Package Dimension A 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) Package Dimension B 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) DIMENSION H 2.35 (0.093) MAX. 0.70 (0.028) MAX. 31.60 MIN. (1.244) 1.14 ± 0.20 (0.045 ± 0.008) 1.50 ± 0.15 (0.059 ± 0.006) 0.70 (0.028) MAX. 31.60 MIN. (1.244) CATHODE LEAD DIMENSION H: 15°: 12.24 ± 0.25mm (0.482 ± 0.01 inches) 23°: 12.50 ± 0.25mm (0.492 ± 0.01 inches) 30°: 12.00 ± 0.25mm (0.472 ± 0.01 inches) CATHODE LEAD 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 1.00 MIN. (0.039) 1.00 MIN. (0.039) CATHODE FLAT 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) 0.50 ± 0.10 (0.020 ± 0.004) SQ. TYP. CATHODE FLAT 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate during handling and processing. Refer to Application Note AN-1142 for additional details.  HLMP-CY46/47 Package drawing Package Dimension C 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) Package Dimension D 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) DIMENSION H 0.70 (0.028) MAX. 31.60 MIN. (1.244) 2.35 (0.093) MAX. 1.14 ± 0.20 (0.045 ± 0.008) 1.50 ± 0.15 (0.059 ± 0.006) 0.70 (0.028) MAX. 31.60 MIN. (1.244) DIMENSION H: 50°: 11.98 ± 0.25mm (0.4715 ± 0.01 inches) CATHODE LEAD CATHODE LEAD 1.00 MIN. (0.039) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 1.00 MIN. (0.039) 0.50 ± 0.10 (0.020 ± 0.004) SQ. TYP. CATHODE FLAT 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) CATHODE FLAT 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) Note: 1. All dimensions are in millimeters/ inches. 2. Epoxy meniscus may extend about 1mm (0.040”) down the leads. 3. If heat sinking application is required, the terminal for heat sink is anode. Device Selection Guide Part Number HLMP-CY-WZ0DD HLMP-CY-WZ0DD HLMP-CY6-VY0DD HLMP-CY7-VY0DD HLMP-CY36-UX0DD HLMP-CY37-UX0DD HLMP-CY46-TW0DD HLMP-CY47-TW0DD Typical Viewing Angle (˚) 5 5 3 3 30 30 50 50 Luminous Intensity (mcd) at 20mA Min. 5500 5500 400 400 300 300 500 500 Max. 6000 6000 000 000 9300 9300 5500 5500 Standoff No Yes No Yes No Yes No Yes Package Dimension A B A B A B C D Tolerance for each intensity limit is ± 15%.  Part Numbering System HLMP - C Y xx - x x x xx Packaging Option DD: Ammopacks Color Bin Selection 0: Open distribution Maximum Intensity Bin 0: No maximum intensity limit Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle 11/12: 15° package 26/27: 23° package 36/37: 30° package 46/47: 50° package Color: Y: Warm White Package C: 5mm round Lamps Absolute Maximum Rating TA = 25°C Parameter DC Forward Current Peak Forward Current Power Dissipation Reverse Voltage LED Junction Temperature Operating Temperature Range Storage Temperature Range Notes: 1. Derate linearly as shown in Figure 2 2. Duty Factor 10%, frequency 1kHz. White 30 00[] 6 5 (IR = 0 μA) 0 -40 to +85 -40 to +00 Unit mA mA mW V °C °C °C Optical/ Electrical Performance at 25°C Parameter Forward Voltage Reverse Voltage Thermal Resistance Chromaticity Coordinate Symbol VF VR RθJ-PIN X y Min .8 5.0 40 0.4 0.39 Typ 3. Max 3.8 Units V V ˚C/W Test Condition IF = 0 mA IR = 0 µA LED junction to anode lead IF = 0 mA Notes: 1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA 2. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 3 1.0 0.8 0.6 0.4 0.2 0.0 IF max. - MAXIMUM FORWARD CURRENT - mA 380 480 580 WAVELENGTH - nm 680 780 35 30 25 20 15 10 5 0 0 20 40 60 80 100 RELATIVE INTENSITY T A - AMBIENT TEMPERATURE - °C Figure 1. Relative Intensity vs. Wavelength Figure 2. Forward current vs Ambient Temperature 1.6 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 1.2 Y-COORDINATE 1 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 DC FORWARD CURRENT - mA 35 0.003 0.002 0.001 0 -0.001 10mA -0.002 -0.003 -0.004 20mA 0 0.002 0.004 30mA -0.006 -0.004 -0.002 5mA X-COORDINATE Figure 3. Relative Intensity vs Forward Current Figure 4. Chromaticity shift vs forward current 35 30 FORWARD CURRENT - mA 25 20 15 10 5 0 0 1 2 FORWARD VOLTAGE - V 3 4 Figure 5. Forward current vs forward voltage 4 Radiation Pattern 1 NORMALIZED INTENSITY NORMALIZED INTENSITY -90 -60 -30 0 30 60 90 0.8 0.6 0.4 0.2 0 1 0.8 0.6 0.4 0.2 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 ANGULAR DISPLACEMENT - DEGREES Figure 6. Radiation pattern for HLMP-CY11/12 1 NORMALIZED INTENSITY Figure 7. Radiation pattern for HLMP-CY26/27 1 NORMALIZED INTENSITY 0.8 0.6 0.4 0.2 0 0 30 60 90 120 150 180 0.8 0.6 0.4 0.2 0 0 30 60 90 120 150 180 ANGULAR DISPLACEMENT - DEGREES ANGULAR DISPLACEMENT - DEGREES Figure 8. Radiation pattern for HLMP-CY36/37 Figure 9. Radiation pattern for HLMP-CY46/47 5 Intensity Bin Limit Table at 20mA Intensity (mcd) at 20 mA Bin T U V W X Y Z Min 500 300 400 5500 700 9300 000 Max 300 400 5500 700 9300 000 6000 Color bin limits Rank   3 Chromaticity Coordinates Limits X Y X Y X Y 0.360 0.3850 0.3988 0.46 0.4390 0.430 0.3988 0.46 0.4390 0.430 0.4970 0.4466 0.38 0.3580 0.49 0.375 0.4588 0.3838 0.3545 0.3408 0.38 0.3580 0.49 0.375 0.360 0.3850 0.3988 0.46 0.4390 0.430 Tolerance for each bin limit is ± 0.01 Tolerance for each bin limit is ± 15% Avago Warm white binning on CIE 1931 Chromaticity Diagram 0.500 0.450 Bin 3 0.400 Bin 1 Bin 2 y 0.350 Black Body 0.300 0.300 0.350 0.400 x 0.450 0.500 0.550 6 Precautions: Lead Forming: • The leads of an LED lamp may be performed or cut to length prior to insertion and soldering on PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress that induced into the LED package. Otherwise, cut the leads to applicable length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress, due to the lead cutting, from traveling to the LED chip die attach and wirebond. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. Avago Technologies LED configuration Anode InGaN Device Note: Electrical connection between bottom surface of LED die and the lead frame material through conductive paste of solder. Soldering condition: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED closer than 1.59mm might damage the LED. 1.59mm • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of jigs, fixtures or pallet. • Special attention must be given to board fabrication, solder masking, surface platting and lead holes size and component orientation to assure the solderability. • Recommended soldering condition: Wave Soldering Pre-heat temperature Preheat time Peak temperature 05 °C Max. 30 sec Max 50 °C Max. Manual Solder Dipping 60 °C Max. • Recommended PC board plated through holes size for LED component leads. LED component lead size 0.457 x 0.457 mm (0.08 x 0.08 inch) 0.508 x 0.508 mm (0.00 x 0.00 inch) Diagonal 0.646 mm (0.05 inch) 0.78 mm (0.08 inch) Plated through hole diameter 0.976 to .078 mm (0.038 to 0.04 inch) .049 to .50 mm (0.04 to 0.045 inch) Dwell time 3 sec Max. 5 sec Max • Wave soldering parameter must be set and maintain according to the recommended temperature and dwell time. Customer is advised to daily check on the soldering profile to ensure that the soldering profile is always conforming to recommended soldering condition. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250°C. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. • Under sizing of plated through hole can lead to twisting or improper LED placement during auto insertion. Over sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching. Note: Refer to application note AN1027 for more information on soldering LED components. 7 Recommended Wave Soldering Profile TURBULENT WAVE 250 LAMINAR WAVE HOT AIR KNIFE 200 TEMPERATURE - °C TOP SIDE OF PC BOARD BOTTOM SIDE OF PC BOARD 150 FLUXING 100 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C ± 5˚C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA LEAD FREE SOLDER 96.5%Sn; 3.0%Ag; 0.5% Cu NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. 40 50 TIME - SECONDS 60 70 80 90 100 50 30 PREHEAT 10 20 30 0 Ammo Packs Drawing 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.0394 CATHODE 20.50±1.00 0.807±0.039 9.125±0.625 0.3593±0.0246 18.00±0.50 0.7087±0.0197 ø\C7;4.00±0.20TYP. 12.70±0.30 0.50±0.0118 0.70±0.20 0.0276±0.0079 A VIEW A-A A 0.1575±0.008 Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff 8 Packaging Box for Ammo Packs Note: For InGaN device, the ammo pack packaging box contain ESD logo For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 007 Avago Technologies Limited. All rights reserved. AV0-0EN - March 9, 007