HLMP-D101/D105, HLMP-K101/K105
T-13/4 (5 mm), T-1 (3 mm),
High Intensity, Double Heterojunction
AlGaAs Red LED Lamps
Data Sheet
Description
Features
These solid state LED lamps utilize newly developed
double heterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding light output
efficiency over a wide range of drive currents. The color is
deep red at the dominant wavelength of 637 nanometres.
These lamps may be DC or pulse driven to achieve desired
light output.
• Exceptional brightness
• Wide viewing angle
• Outstanding material efficiency
• Low forward voltage
• CMOS/MOS compatible
• TTL compatible
• Deep red color
Applications
• Bright ambient lighting conditions
• Moving message panels
• Portable equipment
• General use
Package Dimensions
3.17 (0.125)
∅ 2.67 (0.105)
3.43 (0.135)
2.92 (0.115)
4.70 (0.185)
4.19 (0.165)
6.35 (0.250)
5.58 (0.220)
1.14 (0.045)
0.51 (0.020)
SHOULDER
24.1
MIN.
(0.95)
0.65 (0.026) MAX.
0.55 (0.022)
SQ. TYP.
0.40 (0.016)
CATHODE
2.79 (0.110)
2.29 (0.090)
1.52 (0.060)
1.02 (0.040)
A
B
C
Selection Guide
Luminous Intensity Iv (mcd) at 20 mA
Package Description
Device HLMP-
Min.
Typ.
Max.
2θ1/2[1]
Degree
T-1 3/4 Red Tinted Diffused
D101
35.2
70.0
–
65
A
D101-J00xx
35.2
70.0
–
65
A
D101-JK0xx
35.2
70.0
112.8
65
A
D105
138.0
240.0
–
24
B
D105-M00xx
138.0
240.0
–
24
B
D105-NO0xx
200.0
290.0
580.0
24
B
K101
22.0
45.0
–
60
C
K101-I00xx
22.0
45.0
–
60
C
K105
35.2
65.0
–
45
C
K105-J00xx
35.2
65.0
–
45
C
T-1 3/4 Red Untinted Non-diffused
T-1 Red Tinted Diffused
T-1 Red Untinted Non-diffused
Note:
1. θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 the on-axis value.
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
A1: Right Angle Housing, Uneven Leads, T1
A2: Right Angle Housing, Even Leads, T1
B1: Right Angle Housing, Uneven Leads, T-13/4
B2: Right Angle Housing, Even Leads, T-13/4
DD, UQ: Ammo Pack
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (no max. limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Lens Type
01: Tinted, Diffused
05: Untinted, Nondiffused
Color Options
1: AlGaAs Red
Package Options
D: T-13/4
K: T-1
2
Package
Outline
Absolute Maximum Ratings at TA = 25°C
Parameter
Value
Peak Forward Current[1,2]
300 mA
Average Forward Current[2]
20 mA
DC Current[3]
30 mA
Power Dissipation
87 mW
Reverse Voltage (IR = 100 μA)
5V
Transient Forward Current (10 μs Pulse)[4]
500 mA
LED Junction Temperature
110°C
Operating Temperature Range
-20 to +100°C
Storage Temperature Range
-40 to +100°C
Notes:
1. Maximum IPEAK at f = 1 kHz, DF = 6.7%.
2. Refer to Figure 6 to establish pulsed operating conditions.
3. Derate linearly as shown in Figure 5.
4. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds.
It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.
Electrical/Optical Characteristics at TA = 25°C
Symbol
Description
VF
Forward Voltage
VR
Reverse Breakdown Voltage
λp
Min.
Typ.
Max.
Unit
Test Condition
1.8
2.2
V
IF = 20 mA
15.0
V
IR = 100 μA
Peak Wavelength
645
nm
Measurement at Peak
λd
Dominant Wavelength
637
nm
Note 1
Δλ1/2
Spectral Line Halfwidth
20
nm
τS
Speed of Response
30
ns
Exponential Time
Constant, e-t/TS
C
Capacitance
30
pF
VF = 0, f = 1 MHz
RθJ-PIN
Thermal Resistance
260[3]
210[4]
290[5]
°C/W
Junction to Cathode
Lead
ηV
Luminous Efficacy
80
Im/W
Note 2
5.0
Notes:
1. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the color of the device.
2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = lV/ηV, where IV is the luminous intensity in candelas and ηV is luminous
efficacy in lumens/watt.
3. HLMP-D101.
4. HLMP-D105.
5. HLMP-K101/-K105.
3
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward voltage.
Figure 3. Relative luminous intensity vs. dc forward current.
Figure 4. Relative efficiency vs. peak forward current.
Figure 5. Maximum forward dc current vs. ambient temperature.
Derating based on TJ MAX. = 110°C.
Figure 6. Maximum tolerable peak current vs. peak duration
(IPEAK MAX. determined from temperature derated IDC MAX.).
4
Figure 7. Relative luminous intensity vs. angular displacement. HLMP-D101.
Figure 8. Relative luminous intensity vs. angular displacement. HLMP-K101.
Figure 9. Relative luminous intensity vs. angular displacement. HLMP-D105.
Figure 10. Relative luminous intensity vs. angular displacement. HLMP-K105.
5
Intensity Bin Limits
Intensity Range (mcd)
Color
Bin
Min.
Max.
Red
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
24.8
39.6
39.6
63.4
63.4
101.5
101.5
162.4
162.4
234.6
234.6
340.0
340.0
540.0
540.0
850.0
850.0
1200.0
1200.0
1700.0
1700.0
2400.0
2400.0
3400.0
3400.0
4900.0
4900.0
7100.0
7100.0
10200.0
10200.0
14800.0
14800.0
21400.0
21400.0
30900.0
Maximum tolerance for each bin limit is ± 18%.
Mechanical Option Matrix
Mechanical Option Code
Definition
00
Bulk Packaging, minimum increment 500 pcs/bag
01
Tape & Reel, crimped leads, minimum increment 1300 pcs (T-13/4)/1800 pcs (T-1)
02
Tape & Reel, straight leads, minimum increment 1300 pcs (T-13/4)/1800 pcs (T-1)
A1
Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
A2
Right Angle Housing, even leads, minimum increment 500 pcs/bag
B1
Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
B2
Right Angle Housing, even leads, minimum increment 500 pcs/bag
DD
Ammo Pack, straight leads in 2K increment
UQ
Ammo Pack, horizontal leads in 2K increment
Note:
All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarification/information.
6
Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of LED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED chip
die attach and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended PC board plated through hole sizes for
LED component leads:
• Recommended soldering conditions:
Wave Soldering
Manual Solder
Dipping
Pre-heat Temperature
105 °C Max.
–
Pre-heat Time
30 sec Max.
–
Peak Temperature
250 °C Max.
260 °C Max.
Dwell Time
3 sec Max.
5 sec Max.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
TEMPERATURE – °C
250
Diagonal
Hole Diameter
0.457 x 0.457 mm
0.646 mm
0.976 to 1.078 mm
(0.018 x 0.018 inch)
(0.025 inch)
(0.038 to 0.042 inch)
0.508 x 0.508 mm
0.718 mm
1.049 to 1.150 mm
(0.020 x 0.020 inch)
(0.028 inch)
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
BOTTOM SIDE
OF PC BOARD
200
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
150
FLUXING
100
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
0
PREHEAT
10
20
30
40
50
60
70
TIME – SECONDS
Figure 11. Recommended wave soldering profile.
80
90
100
Plated Through
Lead Size
TOP SIDE OF
PC BOARD
50
30
7
LED Component
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www.avagotech.com
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Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved.
AV02-0230EN - September 24, 2008
