HLMP-DL50-VWPDD

HLMP-DL50 T-13/4 (5 mm) Precision Optical Performance AlInGaP LED Lamps for Variable Message Signs Data Sheet Device Selection Guide Typical Viewing Angle 2q1/2 (Deg.) 15 15 Part Number HLMPDL50 DL51 Dominant Wavelength Range 586.5 to 590.5 nm 588.5 to 592.5 nm Luminous Intensity (mcd at IF = 20 mA)[1] 4200 to 7200 4200 to 7200 Note: 1. The luminous intensity is measured on the mechanical axis of the lamp package. Package Dimensions[2] 1.14 ± 0.20 (0.045 ± 0.008) 5.00 ± 0.20 NOTE 1 (0.197 ± 0.008) NOTE: 1. MEASURED JUST ABOVE FLANGE. 2.35 MAX. (0.093) 0.70 MAX. (0.028) CATHODE LEAD 8.71 ± 0.20 (0.343 ± 0.008) 1.00 MIN. (0.039) 31.60 (1.244) MIN. Note: 2. This part is only offered in a flanged package without stand-offs. Absolute Maximum Ratings at TA = 25°C Parameter DC Forward Current[3, 4]l Peak Pulsed Forward Current[3, 4]l Average Forward Current[4]l Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Storage Temperature 5.90 ± 0.20 (0.228 ± 0.008) 0.50 ± 0.10 SQ. TYP. (0.030 ± 0.004) Value 50 mA 100 mA 30 mA 5V 130°C - 40°C to +100°C - 40°C to +120°C Notes: 3. For long term performance with minimal light output degradation, drive currents between 10 and 30 mA are recommended. 4. Please contact your sales representative about operating currents below 10 mA. CATHODE 2.54 ± 0.38 (0.100 ± 0.15) Electrical/Optical Characteristics at TA = 25°C Parameter Symbol Forward Voltage VF Min. Typical Max. Units Test Conditions 2.02 2.4 V IF = 20 mA Reverse Voltage VR 20 V IR = 100 µA Peak Wavelength lPEAK 592 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Spectral Halfwidth Dl1/2 17 nm Wavelength Width at Spectral Distribution 1/2 Power point at IF = 20 mA Speed of Response ts 20 ns Exponential Time Constant, e-t/ts Capacitance C 40 pF VF = 0, f = 1 MHz Thermal Resistance RqJ-PIN 240 °C/W LED Junction-to-Cathode Lead Luminous Efficacy[5] hV 480 lm/W Emitted Luminous Power/Emitted Radiant Power 5 Note: 5. The radiant intensity, Ie, in watts per steridian, may be found from the equation Ie = IV/hV, where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens/watt. Intensity Bin Limits (mcd at 20 mA) Bin Name Min. Max. V 4200 5500 W 5500 7200 Note: 6. Tolerance for each bin limit is ± 15%. 2 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • Recommended soldering conditions: Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time TEMPERATURE – °C Manual Solder Dipping – – 260 °C Max. 5 sec Max. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) BOTTOM SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA 150 FLUXING 100 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 TIME – SECONDS Figure 1. Recommended wave soldering profile. 90 100 Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. TOP SIDE OF PC BOARD 50 30 3 • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Recommended PC board plated through hole sizes for LED component leads: • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. Wave Soldering 105 °C Max. 30 sec Max. 250 °C Max. 3 sec Max. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2894EN 5989-4365EN May 21, 2006