HLMP-ED31-SV0DD

HLMP-ELxx, HLMP-EHxx, HLMP-EDxx Precision Optical Performance AlInGaP II LED Lamps Data Sheet Description Features Precision Optical Perform­ance AlInGaP II (aluminum indium gallium phosphide) LEDs offer superior light output for excellent readability in sunlight and dependable performance. The AlInGaP II technology provides extremely stable light output over long periods of time. • Well defined spatial radiation patterns These LED lamps are untinted, nondiffused, T-13/4 packages incorporating second generation optics which produce well defined radiation patterns at specific viewing cone angles. These lamps are made with an advanced optical grade epoxy offering superior high tempera­ ture and high moisture resistance performance in outdoor signal and sign applications. The maximum LED junction tempera­ ture limit of +130°C enables high temperature operation in bright sunlight conditions. The epoxy contains both uv-a and uv‑b inhibitors to reduce the effects of long term exposure to direct sunlight. Benefits • Viewing angles match traffic management requirements • Colors meet automotive and traffic signal specifications • Superior light output performance in outdoor environments • Suitable for autoinsertion into PC boards • Viewing angles: 15°, 23°, 30° • High luminous output • Colors: 592 nm Amber 617 nm Reddish-Orange 630 nm Red • High operating temperature: TJLED = +130°C • Superior resistance to moisture Applications • Traffic management: Traffic signals Work zone warning lights Variable message signs • Commercial outdoor advertising: Signs Marquees • Automotive: Exterior and interior lights T-13/4 (5 mm) Precision Optical Performance AlInGaP II LED Lamps Selection Guide Typical Viewing Angle 2q1/2 (Deg.)[2] Color and Dominant Wavelength (nm), Typ.[1] Lamps Without Standoffs (Outline Drawing A) Lamps With Standoffs (Outline Drawing B) 15° Amber 592 HLMP-EL16-S0000 HLMP-EL18-S0000 HLMP-EL16-TW000 HLMP-EL16-UX000 HLMP-EL18-UX000 Max. 1900 – 2500 7200 3200 9300 3200 9300 HLMP-EL16-VW000 4200 7200 7200 21000 HLMP-EL16-VY000 HLMP-EL18-VY000 4200 12000 HLMP-EL16-VYR00 HLMP-EL18-VYR00 4200 12000 4200 12000 4200 12000 2500 7200 3200 9300 HLMP-EL16-VYK00 HLMP-EL16-VYS00 HLMP-EL18-VYS00 HLMP-EH16-TW000 HLMP-EH16-UX000 HLMP-EH18-UX000 HLMP-EH16-VX0DD Red 630 Min. HLMP-EL16-UXR00 HLMP-EL16-VX400 Red-Orange 617 Luminous Intensity Iv (mcd) [3,4,5] @ I(f) = 20 mA 4200 9300 HLMP-ED16-S0000 HLMP-ED18-S0000 1900 – HLMP-ED16-TW000 HLMP-ED18-TW000 2500 7200 HLMP-ED18-TWT00 2500 7200 HLMP-ED16-UX000 HLMP-ED18-UX000 3200 9300 HLMP-ED16-UXT00 HLMP-ED18-UXT00 3200 9300 HLMP-ED16-VX000 HLMP-ED18-VX000 4200 9300 Notes: 1. Dominant Wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 2. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity. 3. The luminous intensity is measured on the mechanical axis of the lamp package. 4. The optical axis is closely aligned with the package mechanical axis. 5. Tolerance for each intensity bin limit is ± 15%. 2 T-13/4 (5 mm) Precision Optical Performance AlInGaP II Led Lamps (Continued) Selection Guide Luminous Intensity Iv (mcd) [3,4,5] @ I(f) = 20 mA Typical Viewing Angle 2q1/2 (Deg.)[2] Color and Dominant Wavelength (nm), Typ.[1] Lamps Without Standoffs (Outline Drawing A) Lamps With Standoffs (Outline Drawing B) Min. Max. 23° Amber 592 HLMP-EL25-Q0000 HLMP-EL27-Q0000 1150 – HLMP-EL27-QTR00 1150 3200 HLMP-EL27-RU000 HLMP-EL25-RU000 Red-Orange 617 1500 4200 HLMP-EL25-SU000 1900 4200 HLMP-EL25-SVK00 1900 5500 HLMP-EL25-SV000 HLMP-EL27-SV000 1900 5500 HLMP-EL25-SVR00 HLMP-EL27-SVR00 1900 5500 HLMP-EL25-TW000 HLMP-EL27-TW000 2500 7200 HLMP-EL25-TWR00 HLMP-EL27-TWR00 2500 7200 HLMP-EL25-TWK00 2500 7200 HLMP-EL25-TWS00 2500 7200 HLMP-EL25-UX000 3200 9300 1150 3200 1900 5500 2500 7200 HLMP-ED25-RU000 3200 9300 HLMP-ED25-RUT00 3200 9300 HLMP-EH25-QT000 HLMP-EH27-QT000 HLMP-EH25-SV000 HLMP-EH25-TW000 Red 630 HLMP-EH27-TW000 HLMP-ED25-SV000 HLMP-ED27-SV000 1900 5500 HLMP-ED25-TW000 HLMP-ED27-TW000 2500 7200 HLMP-ED25-TWT00 HLMP-ED27-TWT00 2500 7200 Notes: 1. Dominant Wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 2. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity. 3. The luminous intensity is measured on the mechanical axis of the lamp package. 4. The optical axis is closely aligned with the package mechanical axis. 5. Tolerance for each intensity bin limit is ± 15%. 3 T-13/4 (5 mm) Precision Optical Performance AlInGaP II Led Lamps (Continued) Selection Guide Typical Viewing Angle 2q1/2 (Deg.)[2] Color and Dominant Wavelength (nm), Typ.[1] Lamps Without Standoffs (Outline Drawing A) 30° Amber 592 HLMP-EL31-P0000 HLMP-EL31-QT000 Lamps With Standoffs (Outline Drawing B) HLMP-EL33-QT000 HLMP-EL31-QTR00 HLMP-EL31-SV000 HLMP-EL33-SV000 HLMP-EL31-SVK00 HLMP-EL31-SVR00 Red-Orange 617 Red 630 HLMP-EL33-SVR00 Luminous Intensity Iv (mcd) [3,4,5] @ I(f) = 20 mA Min. Max. 880 – 1150 3200 1150 3200 1900 5500 1900 5500 1900 5500 HLMP-EL31-STR00 1900 3200 HLMP-EL31-SUK00 1900 4200 HLMP-EL31-SUS00 1900 4200 HLMP-EL31-SUR00 1900 4200 HLMP-EL31-SVK00 1900 5500 HLMP-EL31-SVS00 1900 5500 HLMP-EH31-QT000 1150 3200 HLMP-EH33-RU000 1500 4200 HLMP-EH31-SV000 HLMP-EH33-SV000 1900 5500 HLMP-ED31-Q0000 HLMP-ED33-Q0000 1150 – HLMP-ED31-QTT00 1150 3200 HLMP-ED31-ST000 1900 3200 HLMP-ED31-SUT00 1900 4200 HLMP-ED31-RU000 1500 4200 HLMP-ED31-RUT00 HLMP-ED33-RUT00 1500 4200 HLMP-ED31-SV000 HLMP-ED33-SV000 1900 5500 HLMP-ED31-SVT00 HLMP-ED33-SVT00 1900 5500 Notes: 1. Dominant Wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 2. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity. 3. The luminous intensity is measured on the mechanical axis of the lamp package. 4. The optical axis is closely aligned with the package mechanical axis. 5. Tolerance for each intensity bin limit is ± 15%. 4 Part Numbering System HLMP- x x xx - x x x xx Mechanical Options 00: Bulk Packaging DD: Ammo Pack YY: Flexi-Bin, Bulk Packaging ZZ: Flexi-Bin; Ammo Pack Color Bin & VF Selections 0: No color bin limitation 4: Amber color bin 4 only K: Amber color bins 2 and 4 only L: Color bins 4 and 6 R: Amber color bins 1, 2, 4, and 6 with VF max of 2.6 V S: Amber color bins 2 and 4 with VF max of 2.6 V T: Red color with VF max of 2.6 V U: Amber color bin 4 with VF max of 2.6 V W: Color bins 2, 4 and 6 with VF max of 2.6 V Y: Color bins 4 and 6 with VF max of 2.6 V Maximum Intensity Bin 0: No Iv bin limitation Minimum Intensity Bin Viewing Angle and Lead Standoffs 16: 15 degree without lead standoffs 18: 15 degree with lead standoffs 25: 23 degree without lead standoffs 27: 23 degree with lead standoffs 31: 30 degree without lead standoffs 33: 30 degree with lead standoffs Color D: 630 nm Red H: 617 nm Red-Orange L: 592 nm Amber Package E: 5 mm Round Note: Please refer to AB 5337 for complete information on part numbering system. 5 Package Dimensions A B 5.00 ± 0.20 (0.197 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008 1.14 ± 0.20 (0.045 ± 0.008) d 8.71 ± 0.20 (0.343 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 2.35 (0.093) MAX. 31.60 (1.244) MIN. 0.70 (0.028) MAX. 31.60 (1.244) MIN. 1.50 ± 0.15 (0.059 ± 0.006) 0.70 (0.028) MAX. CATHODE LEAD CATHODE LEAD PART NO. HLMP-EX18-xxxxx HLMP-EX27-xxxxx HLMP-EX33-xxxxx 1.00 MIN. (0.039) CATHODE FLAT 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 5.80 ± 0.20 (0.228 ± 0.008) 1.00 MIN. (0.039) CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) Absolute Maximum Ratings at TA = 25°C DC Forward Current[1,2,3] ...................................................................................... 50 mA Peak Pulsed Forward Current[2,3] ........................................................................100 mA Average Forward Current ....................................................................................... 30 mA Reverse Voltage (IR = 100 µA)......................................................................................... 5 V LED Junction Temperature........................................................................................ 130°C Operating Temperature..........................................................................-40°C to +100°C Storage Temperature...............................................................................-40°C to +100°C Notes: 1.  Derate linearly as shown in Figure 4. 2.  For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E). 3.  Please contact your sales representative about operating currents below 10 mA. 6 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) d 12.60 ± 0.18 (0.496 ± 0.007) 11.33 ± 0.25 (0.446 ± 0.010) 11.99 ± 0.25 (0.472 ± 0.010) Electrical/Optical Characteristics at TA = 25°C Parameter Symbol Min. Typ. Max. Units Test Conditions Forward Voltage IF = 20 mA   Amber (ld = 592 nm) 2.3   Red-Orange (ld = 617 nm) VF 2.35 2.6[1] V   Red (ld = 630 nm) 2.4 Reverse Voltage VR 5 20 V IR = 100 µA Peak Wavelength Peak of Wavelength of   Amber 594 Spectral Distribution  Red-Orange lPEAK 623 nm at IF = 20 mA  Red 639 Spectral Halfwidth ∆l1/2 17 nm Wavelength Width at Spectral Distrib ution 1/2 Power Point at IF = 20 mA Speed of Response ts 20 ns Exponential Time Constant, e-t/ts Capacitance C 40 pF VF = 0, f = 1 MHz Thermal Resistance RQJ-PIN 240 °C/W LED Junction-to-Cathode Lead Luminous Efficacy[2] Emitted Luminous   Amber 500 Power/Emitted Radiant Power  Red-Orange hv 235 lm/W at If = 20 mA  Red 155 Luminous Flux jV 1000 mlm IF = 20 mA Luminous Efficiency [3] he Emitted Amber 22 Luminous Flux/ Red-Orange 22 lm/W Electrical Power Red 21 Notes: 1.  For options -xxRxx, -xxSxx, -xxTxx, -xxUxx, -xxWxx, -xxYxx, max forward voltage (Vf ) is 2.6 V. Refer to Vf bin table. 2.  The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. 3. he = jV / IF x VF, where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage. 1.0 DC FORWARD CURRENT – mA RELATIVE INTENSITY RED 0.5 0 550 50 40 30 AMBER 20 10 RED 600 650 WAVELENGTH – nm Figure 1. Relative Intensity vs. Peak Wavelength. 7 60 RED-ORANGE AMBER 700 0 0 0.5 1.0 1.5 2.0 2.5 FORWARD VOLTAGE – V Figure 2a. Forward Current vs. Forward Voltage for Option -xxRxx, -xxSxx, -xxTxx, -xxUxx, -xxWxx and -xxYxx. 3.0 90 CURRENT – mA 70 RELATIVE INTENSITY (NORMALIZED AT 20 mA) 80 RED 60 50 40 30 AMBER 20 2.0 RED & RED-ORANGE 1.5 AMBER 1.0 0.5 10 0 1.0 1.5 2.0 0 3.0 2.5 10 20 NORMALIZED INTENSITY – % 0.8 0.6 0.4 0.2 -50 0 50 100 ANGULAR DISPLACEMENT – DEGREES Figure 5. Representative Spatial Radiation Pattern for 15° Viewing Angle Lamps. NORMALIZED INTENSITY – % 1.0 0.8 0.6 0.4 0.2 0 -100 -50 0 50 100 ANGULAR DISPLACEMENT – DEGREES Figure 6. Representative Spatial Radiation Pattern for 23° Viewing Angle Lamps. 8 40 Figure 3. Relative Luminous Intensity vs. Forward Current. 1.0 0 -100 30 FORWARD CURRENT – mA VF – FORWARD VOLTAGE – V Figure 2b. Forward Current vs. Forward Voltage. 0 50 IF MAX. – MAXIMUM FORWARD CURRENT – mA 2.5 100 55 50 45 40 35 30 25 20 15 10 5 0 0 20 40 60 80 100 120 TA – AMBIENT TEMPERATURE – C Figure 4. Maximum Forward Current vs. Ambient Temperature. Derating Based on TJMAX = 130°C. NORMALIZED INTENSITY – % 1.0 0.8 0.6 0.4 0.2 0 -100 -50 0 50 100 ANGULAR DISPLACEMENT – DEGREES Figure 7. Representative Spatial Radiation Pattern for 30° Viewing Angle Lamps. RELATIVE LOP (NORMALIZED AT 25 C) 10 RED-ORANGE 1 RED AMBER 0.1 -50 -25 0 25 50 75 100 125 150 JUNCTION TEMPERATURE – C Figure 8. Relative light output vs. junction temperature Intensity Bin Limits (mcd at 20 mA) Bin Name Min. Max. Amber Color Bin Limits (nm at 20 mA) Bin Name Min. Max. Vf Bin Table[2] Bin Name Min. Max. P 880 1150 1 584.5 587.0 VA 2.0 2.2 Q 1150 1500 2 587.0 589.5 VB 2.2 2.4 R 1500 1900 4 589.5 592.0 VC 2.4 2.6 S 1900 2500 6 592.0 594.5 T 2500 3200 U 3200 4200 V 4200 5500 W 5500 7200 X 7200 9300 Y 9300 12000 Z 12000 16000 Tolerance for each bin limit is ±15%. 9 Tolerance for each bin limit is ±0.5 nm. Notes: 1.  Bin categories are established for classification of products. Products may not be available in all bin categories. 2.  Vf Bin table only available for those part number with options -xxRxx, -xxSxx, -xxTxx, -xxUxx, -xxWxx, -xxYxx. Tolerance for each bin limit is ±0.05 V. Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 60 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 10 CATHODE AllnGaP Devicebetween bottom surface of LED die and Note: Electrical connection the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 100 50 PREHEAT 0 10 20 30 40 60 50 TIME (SECONDS) 90 80 70 100 Ammo Pack Drawing 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) CATHODE 20.50 ± 1.00 (0.807 ± 0.039) 9.125 ± 0.625 (0.3593 ± 0.0246) 18.00 ± 0.50 (0.7087 ± 0.0197) A 12.70 ± 0.30 (0.50 ± 0.0118) 0.70 ± 0.20 (0.0276 ± 0.0079) A VIEW A–A ALL DIMENSIONS IN MILLIMETERS (INCHES). NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF. 11 ∅ 4.00 ± 0.20 TYP. (0.1575 ± 0.008) Packaging Box for Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A GO AVA OGIES NOL ECH + DE ANO T HOD CAT E – ANODE LEAD LEAVES THE BOX FIRST. C BEL R LA THE MO NOTE: THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin 12 Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) (i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) OR (ii) Color bin incorporate with VF Bin (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) BIN: 2VB VB: VF bin “VB” 2: Color bin 2 only DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. Obsoletes AVO1-0701EN AV02-342EN - July 18, 2014