HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx
T-13/4 (5 mm) Precision Optical Performance
AlInGaP LED Lamps
Data Sheet
Description
Features
These Precision Optical Performance AlInGaP LEDs provide superior light output for excellent readability in sunlight and are extremely reliable. AlInGaP LED technology
provides extremely stable light output over long periods
of time. Precision Optical Performance lamps utilize the
aluminum indium gallium phosphide (AlInGaP) technology.
• Well defined spatial radiation patterns
These LED lamps are untinted, nondiffused, T-13/4 packages incorporating second generation optics producing
well defined spatial radiation patterns at specific viewing
cone angles.
These lamps are made with an advanced optical grade
epoxy, offering superior high tempera
ture and high
moisture resistance performance in outdoor signal and
sign applications. The high maximum LED junction
temperature limit of +130°C enables high temperature
operation in bright sunlight conditions. The package epoxy contains both uv-a and uv‑b inhibitors to reduce the
effects of long term exposure to direct sunlight.
These lamps are available in two package options to give
the designer flexibility with device mounting.
• Viewing angles: 8°, 15°, 23°, 30°
• High luminous output
• Colors:
590 nm amber
605 nm orange
615 nm reddish-orange
626 nm red
• High operating temperature: TJ led = +130°C
• Superior resistance to moisture
• Package options:
With or without lead stand-offs
Applications
• Traffic management:
Traffic signals
Pedestrian signals
Work zone warning lights
Variable message signs
Benefits
• Commercial outdoor advertising:
Signs
Marquees
• Viewing angles match traffic management sign requirements
• Automotive:
Exterior and interior lights
• Colors meet automotive and pedestrian signal specifications
• Superior performance in outdoor environments
• Suitable for autoinsertion onto PC boards
Device Selection Guide
Typical
Viewing Angle
2θ 1/2 (Deg.)[4]
Color and Dominant
Wavelength
(nm), Typ.[3]
Lamps without
Standoffs on Leads
(Outline Drawing A)
8°
Amber 590
HLMP-EL08-T0000
HLMP-EL08-VY000
Lamps with Standoffs
on Leads
(Outline Drawing B)
HLMP-EL10-VY000
HLMP-EL08-VYK00
Orange 605
Max.
2500
–
4200
12000
4200
12000
HLMP-EL10-WZ000
5500
16000
HLMP-EL08-X1K00
HLMP-EL10-X1K00
7200
21000
HLMP-EL08-X1000
HLMP-EL10-X1000
7200
21000
5500
16000
7200
21000
HLMP-EJ08-WZ000
HLMP-EJ10-X1000
HLMP-EJ08-Y2000
Red 626
Min.
HLMP-EL08-WZ000
HLMP-EJ08-X1000
Red-Orange 615
Luminous Intensity
Iv (mcd)[1,2,5] @ 20 mA
9300
27000
HLMP-EH08-UX000
HLMP-EH10-UX000
3200
9300
HLMP-EH08-WZ000
HLMP-EH10-WZ000
5500
16000
HLMP-EH08-X1000
HLMP-EH10-X1000
7200
21000
HLMP-EH08-Y2000
HLMP-EH10-Y2000
9300
27000
HLMP-EG08-T0000
HLMP-EG10-T0000
2500
–
HLMP-EG08-VY000
4200
12000
HLMP-EG08-WZ000
HLMP-EG10-WZ000
5500
16000
HLMP-EG08-X1000
HLMP-EG10-X1000
7200
21000
9300
16000
9300
27000
HLMP-EG08-YZ000
HLMP-EG08-Y2000
HLMP-EG10-Y2000
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ1/2 is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each intensity bin limit is ± 15%.
2
Device Selection Guide
Typical
Viewing Angle
2θ 1/2 (Deg.)[4]
Color and Dominant
Wavelength
(nm), Typ.[3]
Lamps without
Standoffs on Leads
(Outline Drawing A)
15°
Amber 590
Max.
HLMP-EL15-PS000
880
2500
HLMP-EL15-QSK00
1150
2500
HLMP-EL15-QT000
1150
3200
HLMP-EL15-UX000
HLMP-EL17-UX000
3200
9300
HLMP-EL15-VY000
HLMP-EL17-VY000
4200
12000
HLMP-EL15-VYK00
4200
12000
HLMP-EL15-VW000
4200
7200
1150
3200
HLMP-EJ15-PS000
880
2500
HLMP-EJ15-RU000
1500
4200
1900
5500
HLMP-EH15-QT000
1150
3200
HLMP-EH15-RU000
1500
4200
HLMP-EH15-TW000
2500
7200
HLMP-EG15-PS000
880
2500
HLMP-EG15-QT000
1150
3200
HLMP-EJ17-QT000
HLMP-EJ15-SV000
Red 626
Luminous Intensity
Iv (mcd)[1,2,5] @ 20 mA
Min.
Orange 605
Red-Orange 615
Lamps with Standoffs
on Leads
(Outline Drawing B)
HLMP-EJ17-SV000
HLMP-EG15-RU000
HLMP-EG17-RU000
1500
4200
HLMP-EG15-UX000
HLMP-EG17-UX000
3200
9300
HLMP-EG15-TW000
HLMP-EG17-TW000
2500
7200
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ1/2 is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each intensity bin limit is ± 15%.
3
Device Selection Guide
Typical
Viewing Angle
2θ 1/2 (Deg.)[4]
Color and Dominant
Wavelength
(nm), Typ.[3]
Lamps without
Standoffs on Leads
(Outline Drawing A)
23°
Amber 590
HLMP-EL24-NR000
HLMP-EL24-PS000
Lamps with Standoffs
on Leads
(Outline Drawing B)
HLMP-EL26-PS000
Min.
Max.
680
1900
880
2500
HLMP-EL24-QR000
1150
1900
HLMP-EL24-QRK00
1150
1900
1150
2500
1150
3200
HLMP-EL24-SU400
1900
4200
HLMP-EL24-TW000
2500
7200
1150
3200
880
2500
HLMP-EH24-QT000
1150
3200
HLMP-EH24-RU000
1500
4200
HLMP-EG24-M0000
520
–
880
2500
HLMP-EG24-QT000
1150
4200
HLMP-EG24-RU000
1500
4200
HLMP-EL24-QS400
HLMP-EL24-QT000
Orange 605
HLMP-EJ24-QT000
Red-Orange 615
HLMP-EH24-PS000
Red 626
Luminous Intensity
Iv (mcd)[1,2,5] @ 20 mA
HLMP-EG24-PS000
HLMP-EL26-QT000
HLMP-EH26-PS000
HLMP-EG26-PS000
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ1/2 is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each intensity bin limit is ± 15%.
4
Device Selection Guide
Typical
Viewing Angle
2θ 1/2 (Deg.)[4]
Color and Dominant
Wavelength
(nm), Typ.[3]
Lamps without
Standoffs on Leads
(Outline Drawing A)
30°
Amber 590
Lamps with Standoffs
on Leads
(Outline Drawing B)
Min.
Max.
HLMP-EL30-K0000
310
–
HLMP-EL30-MQ000
520
1500
HLMP-EL30-PQ000
880
1500
HLMP-EL30-PR400
880
1900
HLMP-EL30-PS000
880
2500
HLMP-EL30-PSK00
HLMP-EL32-PS000
880
2500
HLMP-EL30-QT000
1150
3200
HLMP-EL30-QTK00
1150
3200
1900
3200
1900
5500
1900
5500
680
1900
880
2500
HLMP-EH30-MQ000
520
1500
HLMP-EH30-NR000
680
1900
HLMP-EH30-PS000
880
2500
HLMP-EG30-KN000
310
880
520
1500
680
1500
680
1900
HLMP-EG30-PQ000
880
1500
HLMP-EG30-PR000
880
1900
HLMP-EG30-PS000
880
2500
1150
3200
HLMP-EL30-STK00
HLMP-EL30-SV000
HLMP-EL32-SV000
HLMP-EL30-SVK00
Orange 605
HLMP-EJ30-NR000
HLMP-EJ30-PS000
Red-Orange 615
Red 626
Luminous Intensity
Iv (mcd)[1,2,5] @ 20 mA
HLMP-EG30-MQ000
HLMP-EJ32-PS000
HLMP-EG32-MQ000
HLMP-EG30-NQ000
HLMP-EG30-NR000
HLMP-EG30-QT000
HLMP-EG32-NR000
HLMP-EG32-QT000
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ1/2 is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each intensity bin limit is ± 15%.
5
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
YY: Flexi-Bin; Bulk Packaging
ZZ: Flexi-Bin; Ammo Pack
Color Bin Selections
0: No color bin limitation
4: Amber color bin 4 only
K: Amber color bins 2 and 4 only
Maximum Intensity Bin
0: No Iv bin limitation
Minimum Intensity Bin
Viewing Angle & Lead Stand Offs
08: 8 deg without lead stand offs
10: 8 deg with lead stand offs
15: 15 deg without lead stand offs
17: 15 deg with lead stand offs
24: 23 deg without lead stand offs
26: 23 deg with lead stand offs
30: 30 deg without lead stand offs
32: 30 deg with lead stand offs
Color
G: 626 nm Red
H: 615 nm Red-Orange
J: 605 nm Orange
L: 590 nm Amber
Package
E: 5 mm Round
Note: Please refer to AB 5337 for complete information on part numbering system.
6
Package Dimensions
A
B
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
d
1.14 ± 0.20
(0.045 ± 0.008)
2.35 (0.093)
MAX.
0.70 (0.028)
MAX.
31.60
MIN.
(1.244)
1.50 ± 0.15
(0.059 ± 0.006)
31.60
MIN.
(1.244)
0.70 (0.028)
MAX.
CATHODE
LEAD
1.00 MIN.
(0.039)
CATHODE
FLAT
CATHODE
LEAD
0.50 ± 0.10
SQ. TYP.
(0.020 ± 0.004)
1.00 MIN.
(0.039)
5.80 ± 0.20
(0.228 ± 0.008)
CATHODE
FLAT
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
SQ. TYP.
(0.020 ± 0.004)
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
PART NO.
d
HLMP-XX26
HLMP-XX32
HLMP-XX10
HLMP-XX17
12.37 ± 0.25
12.42 ± 0.25
12.52 ± 0.25
11.96 ± 0.25
(0.487 ± 0.010) (0.489 ± 0.010) (0.493 ± 0.010) (0.471 ± 0.010)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.)
DOWN THE LEADS.
3. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE.
7
Absolute Maximum Ratings at TA = 25°C
DC Forward Current [1,2,3]
50 mA
Peak Pulsed Forward Current [2,3]
100 mA
Average Forward Current [3]
30 mA
Reverse Voltage (IR = 100 µA)
5V
LED Junction Temperature
130 °C
Operating Temperature
-40 °C to +100 °C
Storage Temperature
-40 °C to +100 °C
Notes:
1. Derate linearly as shown in Figure 4.
2. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more
information on recommended drive conditions, please refer to Application Brief I-024.
3. Operating at currents below 1 mA is not recommended. Please contact your local representative for further information.
Electrical/Optical Characteristics at TA = 25 °C
Parameter
Symbol
Forward Voltage
Amber (ld = 590 nm)
Orange (ld = 605 nm)
Red-Orange (ld = 615 nm)
Red (ld = 626 nm)
VF
Reverse Voltage
VR
Dominant Wavelength
Red
Amber
Orange
Red Orange
ld
Peak Wavelength:
Amber (ld = 590 nm)
Orange (ld = 605 nm)
Red-Orange (ld = 615 nm)
Red (ld = 626 nm)
lPEAK
Spectral Halfwidth
Units
Test Conditions
V
IF = 20 mA
V
IR = 100 µA
nm
IF = 20 mA
592
609
621
635
nm
Peak of Wavelength of
Spectral Distribution
at IF = 20 mA
∆l1/2
17
nm
Wavelength Width at Spectral
Distribution 1/2 Power Point at
IF = 20 mA
Speed of Response
ts
20
ns
Exponential Time Constant, e-t/ts
Capacitance
C
40
pF
VF = 0, f = 1 MHz
Thermal Resistance
RqJ-PIN
240
°C/W
LED Junction-to-Cathode Lead
Luminous Efficacy[1]
Amber (ld = 590 nm)
Orange (ld = 605 nm)
Red-Orange (ld = 615 nm)
Red (ld = 626 nm)
hv
480
370
260
150
lm/W
Emitted Luminous Power/
Emitted Radiant Power
Luminous Flux
jv
500
mlm
IF = 20 mA
Luminous Efficiency [2]
he
12
13
13
13
lm/W
Emitted Luminous Flux/
Electrical Power
Amber
Orange
Red-Orange
Red
Note:
Min.
Typ.
2.02
1.98
1.94
1.90
5
20
620.0
584.5
599.5
612.0
626.0
590.0
605.0
615.0
Max.
2.4
630.0
594.5
610.5
621.7
1. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv
is the luminous efficacy in lumens/watt.
2. he = jV / IF x VF, where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
8
1.0
ORANGE
90
80
RED
70
CURRENT – mA
RELATIVE INTENSITY
100
RED-ORANGE
AMBER
0.5
60
RED
50
40
AMBER
30
20
0
550
600
650
10
0
1.0
700
1.5
WAVELENGTH – nm
Figure 1. Relative intensity vs. peak wavelength
IF – FORWARD CURRENT – mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
2.5
2.0
1.5
1.0
0.5
0
20
40
IF – DC FORWARD CURRENT – mA
Figure 3. Relative luminous intensity vs. forward current
9
2.5
3.0
Figure 2. Forward current vs. forward voltage
3.0
0
2.0
VF – FORWARD VOLTAGE – V
60
55
50
45
40
35
30
25
20
15
10
5
0
0
20
60
40
80
TA – AMBIENT TEMPERATURE – C
100
Figure 4. Maximum forward current vs. ambient temperature
120
1
0.9
0.8
0.8
0.7
0.7
NORMALIZED INTENSITY
NORMALIZED INTENSITY
1
0.9
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
0.6
0.5
0.4
0.3
0.2
0.1
0
0
90
30
ANGULAR DISPLACEMENT – DEGREES
1
1
0.9
0.9
0.8
0.8
0.7
0.6
0.5
0.4
0.3
0.6
0.5
0.4
0.3
0.2
0.1
0
-100
0.1
100
Figure 7. Representative spatial radiation pattern for 23° viewing angle
lamps
10
180
0.7
0.2
-50
0
50
ANGULAR DISPLACEMENT – DEGREES
150
Figure 6. Representative spatial radiation pattern for 15° viewing angle
lamps
NORMALIZED INTENSITY
NORMALIZED INTENSITY
Figure 5. Representative spatial radiation pattern for 8° viewing angle
lamps
60
90
120
ANGULAR DISPLACEMENT – DEGREES
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT - DEGREES
60
Figure 8. Representative spatial radiation pattern for 30° viewing angle
lamps
90
RELATIVE LOP
(NORMALIZED AT 25C)
10
ORANGE
RED
RED-ORANGE
AMBER
1
0.1
-50
-25
0
25
50
75
JUNCTION TEMPERATURE – C
100
125
150
Figure 9. Relative light output vs. junction temperature
Intensity Bin Limits
(mcd at 20 mA)
Bin Name
Min.
Amber Color Bin Limits
(nm at 20 mA)
Max.
Bin Name
Min.
Max.
584.5
587.0
K
310
400
1
L
400
520
2
587.0
589.5
M
520
680
4
589.5
592.0
6
592.0
594.5
N
680
880
P
880
1150
Q
1150
1500
R
1500
1900
S
1900
2500
T
2500
3200
U
3200
4200
V
4200
5500
W
5500
7200
X
7200
9300
Y
9300
12000
Z
12000
16000
1
16000
21000
2
21000
27000
Tolerance for each bin limit is ± 15%.
11
Tolerance for each bin limit is ± 0.5 nm.
Note:
1. Bin categories are established for classification of products.
Products may not be available in all bin categories.
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation, as the excess lead length also acts as small heat
sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED configuration
Soldering and Handling:
• Care must be taken during PCB assembly and soldering process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat
source (soldering iron’s tip) to the body is 1.59mm.
Soldering the LED using soldering iron tip closer than
1.59mm might damage the LED.
1.59mm
• ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage
to the LED component that is ESD sensitive. Do refer
to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure
electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform
daily check on the soldering profile to ensure that
it is always conforming to recommended soldering
conditions.
12
CATHODE
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during
wave soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended that surface mount components be soldered on
the top side of the PCB. If surface mount need to be
on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH
LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
0.636 mm
(0.018x 0.018 inch) (0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
0.707 mm
(0.020x 0.020 inch) (0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
TEMPERATURE (°C)
Flux: Rosin flux
200
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
150
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
100
50
PREHEAT
0
10
20
30
40
60
50
TIME (SECONDS)
70
80
100
90
Figure 10. Recommended wave soldering profile
Ammo Pack Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
20.50 ± 1.00
(0.807 ± 0.039)
9.125 ± 0.625
(0.3593 ± 0.0246)
18.00 ± 0.50
(0.7087 ± 0.0197)
A
12.70 ± 0.30
(0.50 ± 0.0118)
ALL DIMENSIONS IN MILLIMETERS (INCHES).
0.70 ± 0.20
(0.0276 ± 0.0079)
A
VIEW A–A
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
13
∅
4.00 ± 0.20 TYP.
(0.1575 ± 0.008)
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
A
+
GO
AVA OGIES
NOL
ECH
DE
ANO
T
ANODE LEAD LEAVES
THE BOX FIRST.
C
–
BEL
R LA
E
OTH
M
E
HOD
CAT
NOTE:
THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 250C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
14
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and
no color bin)
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
OR
(ii) Color bin incorporate with VF Bin
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color
bin and VF bin)
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO
MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. Obsoletes 5989-4368EN
AV02-0373EN - July 22, 2014
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