HLMP-EG30-NR000

HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Data Sheet Description Features These Precision Optical Performance AlInGaP LEDs provide superior light output for excellent readability in sunlight and are extremely reliable. AlInGaP LED technology provides extremely stable light output over long periods of time. Precision Optical Performance lamps utilize the aluminum indium gallium phosphide (AlInGaP) technology.  These LED lamps are untinted, nondiffused, T-1¾ packages incorporating second-generation optics producing well defined spatial radiation patterns at specific viewing cone angles. These lamps are made with an advanced optical grade epoxy, offering superior high temperature and high moisture resistance performance in outdoor signal and sign applications. The high maximum LED junction temperature limit of +130 °C enables high temperature operation in bright sunlight conditions. The package epoxy contains both uv-a and uv-b inhibitors to reduce the effects of long-term exposure to direct sunlight.       Applications  These lamps are available in two package options to give the designer flexibility with device mounting. Benefits     Viewing angles match traffic management sign requirements Colors meet automotive and pedestrian signal specifications Superior performance in outdoor environments Suitable for autoinsertion onto PC boards Well-defined spatial radiation patterns Viewing angles: 8°, 15°, 23°, 30° High luminous output Colors: — 590 nm amber — 605 nm orange — 615 nm reddish-orange — 626 nm red High operating temperature: TJLED = +130°C Superior resistance to moisture Package options: — With or without lead stand-offs   Avago Technologies -1- Traffic management: — Traffic signals — Pedestrian signals — Work zone warning lights — Variable message signs Commercial outdoor advertising: — Signs — Marquees Automotive: — Exterior and interior lights HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Device Selection Guide Device Selection Guide Table 1 Device Selection Guide, 8° Typical Viewing Angle Typical Viewing Angle 2θ½ (Deg)a 8° Color and Dominant Wavelength (nm), Typb Amber 590 Lamps without Standoffs on Leads (Outline Drawing A) HLMP-EL08-T0000 HLMP-EL08-VY000 HLMP-EL08-WZ000 Orange 605 Red 626 — HLMP-EL10-VY000 Min Max 2500 — 4200 12000 5500 16000 HLMP-EL10-X1K00 7200 21000 HLMP-EL08-X1000 HLMP-EL10-X1000 7200 21000 5500 16000 HLMP-EJ08-WZ000 — Luminous Intensity Iv (mcd)c,d,e at 20 mA HLMP-EL08-X1K00 HLMP-EJ08-X1000 Red-Orange 615 Lamps with Standoffs on Leads (Outline Drawing B) — 7200 21000 HLMP-EJ08-Y2000 HLMP-EJ10-X1000 — 9300 27000 HLMP-EH08-UX000 — 3200 9300 5500 16000 HLMP-EH08-WZ000 HLMP-EH10-WZ000 HLMP-EH08-Y2000 HLMP-EH10-Y2000 9300 27000 HLMP-EG08-T0000 — 2500 — HLMP-EG08-VY000 — 4200 12000 5500 16000 HLMP-EG08-WZ000 HLMP-EG10-WZ000 HLMP-EG08-X1000 HLMP-EG10-X1000 HLMP-EG08-YZ000 HLMP-EG08-Y2000 — HLMP-EG10-Y2000 a. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. b. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. c. The luminous intensity is measured on the mechanical axis of the lamp package. d. The optical axis is closely aligned with the package mechanical axis. e. Tolerance for each intensity bin limit is ±15%. Avago Technologies -2- 7200 21000 9300 16000 9300 27000 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Device Selection Guide Table 2 Device Selection Guide, 15° Typical Viewing Angle Typical Viewing Angle 2θ½ (Deg)a 15° Color and Dominant Wavelength (nm), Typb Amber 590 Lamps without Standoffs on Leads (Outline Drawing A) Max 880 2500 HLMP-EL15-QSK00 — 1150 2500 1150 3200 HLMP-EL15-UX000 HLMP-EL17-UX000 3200 9300 HLMP-EL15-VY000 HLMP-EL17-VY000 4200 12000 4200 12000 HLMP-EJ15-PS000 HLMP-EJ15-SV000 Red 626 Min — HLMP-EL15-VYK00 Red-Orange 615 Luminous Intensity Iv (mcd)c,d,e at 20 mA HLMP-EL15-PS000 HLMP-EL15-QT000 Orange 605 Lamps with Standoffs on Leads (Outline Drawing B) — — — HLMP-EJ17-SV000 880 2500 1900 5500 HLMP-EH15-RU000 — 1500 4200 HLMP-EH15-TW000 — 2500 7200 HLMP-EG15-PS000 — 880 2500 HLMP-EG15-QT000 — 1150 3200 HLMP-EG15-RU000 — 1500 4200 3200 9300 2500 7200 HLMP-EG15-UX000 HLMP-EG15-TW000 HLMP-EG17-UX000 — a. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. b. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. c. The luminous intensity is measured on the mechanical axis of the lamp package. d. The optical axis is closely aligned with the package mechanical axis. e. Tolerance for each intensity bin limit is ±15%. Avago Technologies -3- HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Device Selection Guide Table 3 Device Selection Guide, 23° Typical Viewing Angle Typical Viewing Angle 2θ½ (Deg)a 23° Color and Dominant Wavelength (nm), Typb Amber 590 Lamps without Standoffs on Leads (Outline Drawing A) HLMP-EL24-PS000 Lamps with Standoffs on Leads(Outline Drawing B) HLMP-EL26-PS000 Luminous Intensity Iv (mcd)c,d,e at 20 mA Min Max 880 2500 HLMP-EL24-QRK00 — 1150 1900 HLMP-EL24-QS400 — 1150 2500 1150 3200 HLMP-EL24-QT000 HLMP-EL26-QT000 HLMP-EL24-SU400 — 1900 4200 HLMP-EL24-TW000 — 2500 7200 Orange 605 HLMP-EJ24-QT000 — 1150 3200 Red-Orange 615 HLMP-EH24-PS000 880 2500 — 1150 3200 — 1500 4200 880 2500 HLMP-EH24-QT000 HLMP-EH24-RU000 Red 626 HLMP-EG24-PS000 HLMP-EH26-PS000 HLMP-EG26-PS000 HLMP-EG24-QT000 — 1150 4200 HLMP-EG24-RU000 — 1500 4200 a. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. b. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. c. The luminous intensity is measured on the mechanical axis of the lamp package. d. The optical axis is closely aligned with the package mechanical axis. e. Tolerance for each intensity bin limit is ±15%. Avago Technologies -4- HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Device Selection Guide Table 4 Device Selection Guide, 30° Typical Viewing Angle Typical Viewing Angle 2θ½ (Deg)a 30° Color and Dominant Wavelength (nm), Typb Amber 590 Lamps without Standoffs on Leads (Outline Drawing A) Max 520 1500 HLMP-EL30-PQ000 — 880 1500 — 880 1900 880 2500 HLMP-EL32-PS000 HLMP-EL30-PSK00 — 880 2500 HLMP-EL30-QT000 — 1150 3200 HLMP-EL30-STK00 — 1900 3200 HLMP-EL30-SV000 — 1900 5500 HLMP-EJ30-NR000 — 680 1900 880 2500 HLMP-EJ30-PS000 Red 626 Min — HLMP-EL30-PS000 Red-Orange 615 Luminous Intensity Iv (mcd)c,d,e at 20 mA HLMP-EL30-MQ000 HLMP-EL30-PR400 Orange 605 Lamps with Standoffs on Leads (Outline Drawing B) HLMP-EJ32-PS000 HLMP-EH30-MQ000 — 520 1500 HLMP-EH30-PS000 — 880 2500 HLMP-EG30-KN000 — 310 880 HLMP-EG30-MQ000 — 520 1500 — 680 1500 680 1900 HLMP-EG30-NQ000 HLMP-EG30-NR000 HLMP-EG32-NR000 HLMP-EG30-PQ000 — 880 1500 HLMP-EG30-PR000 — 880 1900 HLMP-EG30-PS000 — 880 2500 HLMP-EG30-QT000 — 1150 3200 a. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. b. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. c. The luminous intensity is measured on the mechanical axis of the lamp package. d. The optical axis is closely aligned with the package mechanical axis. e. Tolerance for each intensity bin limit is ±15%. Avago Technologies -5- HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Part Numbering System Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk Packaging DD: Ammo Pack YY: Flexi-Bin; Bulk Packaging ZZ: Flexi-Bin; Ammo Pack Color Bin Selection 0: No color bin limitation 4: Amber color bin 4 only K: Amber color bins 2 and 4 only Maximum Intensity Bin 0: No Iv bin limitation Minimum Intensity Bin Viewing Angle & Lead Standoffs 08: 8 deg without lead standoffs 10: 8 deg with lead standoffs 15: 15 deg without lead standoffs 17: 15 deg with lead standoffs 24: 23 deg without lead standoffs 26: 23 deg with lead standoffs 30: 30 deg without lead standoffs 32: 30 deg with lead standoffs Color G: 626 nm Red H: 615 nm Red-Orange J: 605 nm Orange L: 590 nm Amber Package E: 5 mm Round Note: Refer to AB 5337 for complete information on part numbering system. Avago Technologies -6- HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Package Dimensions Package Dimensions A B 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) d 1.14 ± 0.20 (0.045 ± 0.008) 2.35 (0.093) MAX. 0.70 (0.028) MAX. 31.60 MIN. (1.244) 1.50 ± 0.15 (0.059 ± 0.006) 31.60 MIN. (1.244) 0.70 (0.028) MAX. CATHODE LEAD 1.00 MIN. (0.039) CATHODE LEAD 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 1.00 MIN. (0.039) 5.80 ± 0.20 (0.228 ± 0.008) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) 2.54 ± 0.38 (0.100 ± 0.015) PART NO. d HLMP-XX26 HLMP-XX32 HLMP-XX10 HLMP-XX17 12.37 ± 0.25 12.42 ± 0.25 12.52 ± 0.25 11.96 ± 0.25 (0.487 ± 0.010) (0.489 ± 0.010) (0.493 ± 0.010) (0.471 ± 0.010) NOTE 1. 2. 3. All dimensions are in millimeters (inches). Tapers shown at top of leads (bottom of lamp package) indicate an epoxy meniscus that may extend about 1 mm (0.040 in.) down the leads. For dome heights above lead standoff seating plane, d, lamp package B, see table. Avago Technologies -7- HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Absolute Maximum Ratings at TA = 25 °C Absolute Maximum Ratings at TA = 25 °C DC Forward Currenta,b,c 50 mA Peak Pulsed Forward Currentb,c 100 mA Average Forward Currentc 30 mA Reverse Voltage (IR = 100 μA) 5V LED Junction Temperature 130 °C Operating Temperature –40 °C to +100 °C Storage Temperature –40 °C to +100 °C a. Derate linearly as shown in Figure 4. b. For long-term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more information on recommended drive conditions, refer to Application Brief I-024. c. Operating at currents below 1 mA is not recommended. Contact your local representative for further information. Avago Technologies -8- HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Electrical/Optical Characteristics at TA = 25 °C Electrical/Optical Characteristics at TA = 25 °C Parameter Forward Voltage Symbol Min Typ Max VF Amber (λd = 590 nm) 2.02 2.4 Orange (λd = 605 nm) 1.98 2.4 Red-Orange (λd = 615 nm) 1.94 2.4 Red (λd = 626 nm) 1.90 2.4 5 20 Red 620.0 626.0 630.0 Amber 584.5 590.0 594.5 Orange 599.5 605.0 610.5 612.0 615.0 621.7 Reverse Voltage VR Dominant Wavelength λd Red Orange Peak Wavelength λPEAK Amber (λd = 590 nm) 592 Orange (λd = 605 nm) 609 Red-Orange (λd = 615 nm) 621 Red (λd = 626 nm) 635 Unit Test Conditions V IF = 20 mA V IR = 100 μA nm IF = 20 mA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Spectral Halfwidth Δλ½ 17 nm Wavelength Width at Spectral Distribution ½ Power Point at IF = 20 mA Speed of Response τs 20 ns Exponential Time Constant, e-t/ts Capacitance C 40 pF VF = 0, f = 1 MHz Thermal Resistance RθJ-PIN 240 °C/W LED Junction-to-Cathode Lead Luminous Efficacya ηV Im/W Emitted Luminous Flux/Electrical Power mIm IF = 20 mA Im/W Emitted Luminous Flux/Electrical Power Amber (λd = 590 nm) 480 Orange (λd = 605 nm) 370 Red-Orange (λd = 615 nm) 260 Red (λd = 626 nm) 150 Luminous Flux φV Luminous Efficiencyb ηe 500 Red 12 Amber 13 Orange 13 Red Orange 13 a. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. b. ηe = φV / IF x VF, where φV is the emitted luminous flux, IF is electrical forward current, and VF is the forward voltage. Avago Technologies -9- HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Electrical/Optical Characteristics at TA = 25 °C Figure 1 Relative Intensity vs. Peak Wavelength Figure 2 Forward Current vs. Forward Voltage 1.0 ORANGE 90 80 RED 70 CURRENT – mA RELATIVE INTENSITY 100 RED-ORANGE AMBER 0.5 60 RED 50 40 AMBER 30 20 0 550 600 650 10 0 1.0 700 1.5 WAVELENGTH – nm Figure 3 Relative Luminous Intensity vs. Forward Current IF – FORWARD CURRENT – mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 2.0 1.5 1.0 0.5 0 0 40 20 IF – DC FORWARD CURRENT – mA 3.0 2.5 Figure 4 Maximum Forward Current vs. Ambient Temperature 3.0 2.5 2.0 VF – FORWARD VOLTAGE – V 55 50 45 40 35 30 25 20 15 10 5 0 60 Avago Technologies - 10 - 0 20 40 80 60 TA – AMBIENT TEMPERATURE – C 100 120 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Electrical/Optical Characteristics at TA = 25 °C Figure 6 Representative Spatial Radiation Pattern for 15° Viewing Angle Lamps 1 1 0.9 0.9 0.8 0.8 0.7 NORMALIZED INTENSITY NORMALIZED INTENSITY Figure 5 Representative Spatial Radiation Pattern for 8° Viewing Angle Lamps 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 90 60 90 120 ANGULAR DISPLACEMENT – DEGREES Figure 7 Representative Spatial Radiation Pattern for 23° Viewing Angle Lamps Figure 8 Representative Spatial Radiation Pattern for 30° Viewing Angle Lamps 1 1 0.9 0.9 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY ANGULAR DISPLACEMENT – DEGREES 0.7 0.6 0.5 0.4 0.3 180 0.6 0.5 0.4 0.3 0.2 0.1 0 -100 0.1 100 150 0.7 0.2 -50 0 50 ANGULAR DISPLACEMENT – DEGREES 30 0 -90 Avago Technologies - 11 - -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES 60 90 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Intensity Bin Limits (mcd at 20 mA) Amber Color Bin Limits (nm at 20 mA) Figure 9 Relative Light Output vs. Junction Temperature RELATIVE LOP (NORMALIZED AT 25C) 10 ORANGE RED RED-ORANGE AMBER Bin Namea,b Min Max 1 584.5 587 2 587 589.5 4 589.5 592 6 592 594.5 1 0.1 -50 -25 0 25 50 75 JUNCTION TEMPERATURE – C 100 125 a. Tolerance for each bin limit is ±0.5 nm. b. Bin categories are established for classification of products. Products may not be available in all bin categories. 150 Intensity Bin Limits (mcd at 20 mA) a. Bin Namea Min Max K 310 400 L 400 520 M 520 680 N 680 880 P 880 1150 Q 1150 1500 R 1500 1900 S 1900 2500 T 2500 3200 U 3200 4200 V 4200 5500 W 5500 7200 X 7200 9300 Y 9300 12000 Z 12000 16000 1 16000 21000 2 21000 27000 Tolerance for each bin limit is ±15%. Avago Technologies - 12 - HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Precautions Precautions  Recommended soldering condition: Wave Solderinga,b Lead Forming    The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. For better control, it is recommended to use the proper tool to precisely form and cut the leads to the applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand soldering operation, as the excess lead length also acts as small heat sink. Pre-heat temperature 105 °C Max. — Preheat time 60 sec Max — Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max a. Above conditions refer to measurement with thermocouple mounted at the bottom of PCB. b. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED.  Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. The customer is advised to perform daily checks on the soldering profile to ensure that it is always conforming to recommended soldering conditions. Soldering and Handling   Take care during PCB assembly and soldering process to prevent damage to the LED component. LED component may be effectively hand soldered to PCB. However, it is recommended only under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED. NOTE 1.59mm  Manual Solder Dipping 1. 2. ESD precautions must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Refer to Avago application note AN 1142 for details. The soldering iron used should have a grounded tip to ensure electrostatic charge is properly grounded. Avago Technologies - 13 - PCBs with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if the same wave soldering setting is used. So, it is recommended to recalibrate the soldering profile again before loading a new type of PCB. Avago Technologies’ AllnGaP high brightness LEDs are using a high efficiency LED die with a single wire bond as shown below. The customer is advised to take extra precautions during wave soldering to ensure that the maximum wave temperature does not exceed 250 °C and the solder contact time does not exceed 3 s. Overstressing the LED during the soldering process might cause premature failure to the LED due to delamination. HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Avago Technologies LED Configuration Avago Technologies LED Configuration The following table shows the recommended PC board plated through holes (PTH) size for LED component leads.  LED Component Lead Size CATHODE    Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Nonmetal material is recommended as it will absorb less heat during wave soldering process. At elevated temperature, LED is more susceptible to mechanical stress. Therefore, the PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. If the PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If the surface mount must be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. Plated Through Hole Diameter 0.45 × 0.45 mm (0.018 × 0.018 inch) 0.636 mm (0.025 in.) 0.98 to 1.08 mm (0.039 to 0.043 in.) 0.50 x 0.50 mm (0.020 × 0.020 inch) 0.707 mm (0.028 in.) 1.05 to 1.15 mm (0.041 to 0.045 in.)  Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste. Diagonal Over-sizing the PTH can lead to a twisted LED after clinching. On the other hand, under-sizing the PTH can cause difficulty when inserting the TH LED. NOTE Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Application Precautions 1. The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. 2. LEDs do exhibit slightly different characteristics at different drive currents that might result in larger performance variations (such as intensity, wavelength, and forward voltage). The user is recommended to set the application current as close as possible to the test current to minimize these variations. 3. The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, it is crucial to ensure that the reverse bias voltage does not exceed the allowable limit of the LED. Avago Technologies - 14 - HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Example of Wave Soldering Temperature Profile for TH LED Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 TEMPERATURE (°C) Flux: Rosin flux 200 Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 150 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 100 50 PREHEAT 0 10 20 30 40 60 50 TIME (SECONDS) 70 80 90 100 Ammo Pack Drawing 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) CATHODE 20.50 ± 1.00 (0.807 ± 0.039) 9.125 ± 0.625 (0.3593 ± 0.0246) 18.00 ± 0.50 (0.7087 ± 0.0197) A 12.70 ± 0.30 (0.50 ± 0.0118) ALL DIMENSIONS IN MILLIMETERS (INCHES). 0.70 ± 0.20 (0.0276 ± 0.0079) A VIEW A–A NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF. Avago Technologies - 15 - 4.00 ± 0.20 TYP. (0.1575 ± 0.008) HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Packaging Box for Ammo Packs Packaging Box for Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A + GO AVA OGIES NOL ECH DE ANO T E HOD CAT – ANODE LEAD LEAVES THE BOX FIRST. EL C ER TH MO LAB NOTE: THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF. Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Avago Technologies - 16 - HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet Acronyms and Definitions (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definitions Example: BIN:  (i) Color bin only or VF bin only — Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin OR  (ii) Color bin incorporated with VF Bin — Applicable for part number that have both color bin and VF bin   (i) Color bin only or VF bin only — BIN: 2 (represent color bin 2 only) — BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin — BIN: 2VB, where:  2 is color bin 2 only  VB is VF bin "VB" DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. Avago Technologies - 17 - For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago Technologies and the A logo are trademarks of Avago Technologies in the United States and other countries. All other brand and product names may be trademarks of their respective companies. Data subject to change. Copyright © 2016 Avago Technologies. All Rights Reserved. AV02-0373EN – June 1, 2016