HLMP-EH1B-Z10DD

HLMP-EGxx, HLMP-EHxx, HLMP-ELxx New T-1¾ (5mm) Extra High Brightness AlInGaP LED Lamps Data Sheet Description Features These Precision Optical Performance AlInGaP LEDs provide superior light output for excellent readability in sunlight and are extremely reliable. AlInGaP LED technology provides extremely stable light output over long periods of time. Precision Optical Performance lamps utilize the aluminum indium gallium phosphide (AlInGaP) technology. • Viewing angle: 15°, 23°, 30° • High luminous output • Colors: 590nm Amber 615nm Red Orange 626nm Red • Package options: With or without lead standoff These LED lamps are untinted, T-1¾ packages incorporating second generation optics producing well defined spatial radiation patterns at specific viewing cone angles. These lamps are made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance performance in outdoor signal and sign application. The maximum LED junction temperature limit of +130°C enables high temperature operation in bright sunlight conditions. The epoxy contains both uv-a and uv-b inhibitors to reduce the effects of long term exposure to direct sunlight. Benefits • Superior performance for outdoor environments • Suitable for auto-insertion onto PC board  • Superior resistance to moisture • Untinted for 15°, 23° and 30° lamps Applications • Traffic management: - Traffic signals - Pedestrian signals - Work zone warning lights - Variable message signs • Solar Power signs • Commercial outdoor advertising - Signs - Marquees Package Dimension B: Standoff A: Non-standoff 5.00 ± 0.20 (0.197 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 1.14 ±0.20 (0.045 ± 0.008) 8.71 ±0.20 (0.343 ±0.008) d 0.70 (0.028) MAX. 8.71 ±0.20 (0.343 ±0.008) 1.14 ±0.20 (0.045 ±0.008) 2.35 (0.093) MAX. 31.60 MIN. (1.244) 1.50 ±0.15 (0.059 ±0.006) 31.60 MIN. (1.244) 0.70 (0.028) MAX. CATHODE LEAD CATHODE LEAD 0.50 ±0.10 SQ. TYP. (0.020 ±0.004) 1.00 MIN. (0.039) 5.80 ±0.20 (0.228 ±0.008) CATHODE FLAT 2.54 ±0.38 (0.100 ±0.015) Viewing Angle d 15° 12.39±0.25 (0.476±0.010) 23° & 30° 11.96±0.25 (0.459±0.010) Notes: 1. All dimensions are in millimeters (inches) 2. Leads are mild steel with tin plating. 3. The epoxy meniscus is 1.21mm max 4. For Identification of polarity after the leads are trimmed off, please refer to the illustration below: CATHODE  ANODE 1.00 MIN. (0.039) CATHODE FLAT 0.50 ±0.10 SQ. TYP. (0.020 ±0.004) 5.80 ±0.20 (0.228 ±0.008) 2.54 ±0.38 (0.100 ±0.015) Device Selection Guide Typical viewing Angle 2θ1/2 (Deg) [4] Color and Dominant Wavelength (nm), Typ [3] Lamps without Standoff on leads (Package drawing A) Lamps with Standoff on leads (Package drawing B) Luminous Intensity Iv (mcd) [1,2,5] at 20 mA Min Max 15° Amber 590 HLMP-EL1A-Z1KDD HLMP-EL1B-Z1KDD 12000 21000 HLMP-EL1A-Z1LDD HLMP-EL1B-Z1LDD 12000 21000 Red 626 HLMP-EG1A-Z10DD HLMP-EG1B-Z10DD 12000 21000 Red Orange 615 HLMP-EH1A-Z10DD HLMP-EH1B-Z10DD 12000 21000 Amber 590 HLMP-EL2A-XYKDD HLMP-EL2B-XYKDD 7200 12000 HLMP-EL2A-XYLDD HLMP-EL2B-XYLDD 7200 12000 Red 626 HLMP-EG2A-XY0DD HLMP-EG2B-XY0DD 7200 12000 Red Orange 615 HLMP-EH2A-XY0DD HLMP-EH2B-XY0DD 7200 12000 Amber 590 HLMP-EL3A-VWKDD HLMP-EL3B-VWKDD 4200 7200 HLMP-EL3A-VWLDD HLMP-EL3B-VWLDD 4200 7200 HLMP-EL3A-WXKDD HLMP-EL3B-WXKDD 5500 9300 HLMP-EL3A-WXLDD HLMP-EL3B-WXLDD 5500 9300 HLMP-EG3A-VW0DD HLMP-EG3B-VW0DD 4200 7200 HLMP-EG3A-WX0DD HLMP-EG3B-WX0DD 5500 7200 HLMP-EH3A-WX0DD HLMP-EH3B-WX0DD 5500 7200 23° 30° Red 626 Red Orange 615 Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each bin limit is ± 15% Part Numbering System HLMP – E x xx - x x x xx Mechanical Options DD : Ammo Pack Color Bin Selections 0 : Full color distribution K : Color Bin 2 & 4 L : Color Bin 4 & 6 Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle and Lead Standoffs 1A: 15° without lead standoff 1B: 15° with lead standoff 2A: 23° without lead standoff 2B: 23° with lead standoff 3A: 30° without lead standoff 3B: 30° with lead standoff Color G : Red 626nm L : Amber 590nm H: Red Orange 615nm Note: Please refer to AB 5337 for complete information on part numbering system.  Absolute Maximum Ratings TJ = 25°C Parameter Red/ Amber/ Red Orange Unit DC Forward Current [2] 50 mA Peak Forward Current 100 [1] mA Average forward current 30 mA Power Dissipation 120 mW Reverse Voltage 5 V Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C Notes: 1. Duty Factor 30%, frequency 1KHz. 2. Derate linearly as shown in Figure 4 Electrical / Optical Characteristics TJ = 25°C Parameter Symbol Min Typ. Max Units Forward Voltage Amber/ Red / Red Orange VF 1.8 2.1 2.4 V Reverse Voltage VR 5 Dominant Wavelength [1] ld Peak Wavelength Amber Red Red Orange lPEAK Spectral Halfwidth Amber Red Red Orange Δl1/2 Thermal resistance RqJ-PIN Luminous Efficacy [2] Amber Red Red Orange ηv Luminous Flux Amber Red Red Orange Φv Luminous Efficiency [3] Amber Red Red Orange ηe Amber Red Red Orange Thermal coefficient of ld Amber Red Red Orange 584.5 618.0 612.0 590.0 626.0 615.0 594 634 621 13 14 14 240 500 200 265 2100 2300 2300 50 55 55 0.08 0.05 0.07 594.5 630.0 619.0 Test Conditions IF = 20 mA V IR = 100 μA nm IF = 20 mA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA nm °C/W LED junction to anode lead lm/W Emitted Luminous Flux/ Emitted Radiant Flux mlm IF = 20 mA lm/W Emitted Luminous Flux/Electrical Power nm/°C IF = 20 mA ; +25°C ≤ TJ ≤ +100°C Notes: 1. The dominant wavelength, λd is derived from the CIE Chromaticity Diagram referenced to Illuminant E. Tolerance for each color of dominant wavelength is +/- 0.5nm. 2. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / ηV where Iv is the luminous intensity in candela and ηV is the luminous efficacy in lumens/ watt. 3. ηe = Φv /IF x VF where Φv is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.  100 1.0 Red Orange Amber Red FORWARD CURRENT-mA RELATIVE INTENSITY 0.8 0.6 0.4 0.2 0.0 500 550 600 WAVELENGTH - nm 20 0 20 40 60 DC FORWARD CURRENT - mA 80 40 30 20 10 100 NORMALIZED INTENSITY 0.8 0.6 0.4 0.2 -30 0 30 60 ANGULAR DISPLACEMENT-DEGREE 0 0 20 40 60 80 TA - AMBIENT TEMPERATURE - C- 100 Figure 4. Maximum Forward Current vs Ambient Temperature 0.8 Figure 5.Radiation Pattern for 15° Viewing Angle Lamp 3 50 1.0 -60 1 2 FORWARD VOLTAGE-V 60 1.0 0.0 -90 0 Figure 2. Forward Current vs Forward Voltage IFMAX - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) NORMALIZED INTENSITY 40 0 Figure 3. Relative Luminous Intensity vs Forward Current  60 650 Figure 1. Relative Intensity vs Peak Wavelength 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 80 90 0.6 0.4 0.2 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT-DEGREE Figure 6. Radiation Pattern for 23° Viewing Angle Lamp 60 90 NORMALIZED INTENSITY 1.0 0.8 0.6 0.4 0.2 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT-DEGREE 60 90 Figure 7. Radiation Pattern for 30° Viewing Angle Lamp Relative Light Output vs Junction Temperature 10.0 Red Orange RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ=25°C) Red Amber 1.0 0.1 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE - °C 100 120 140 Relative Forward Voltage vs Junction Temperature 0.20 0.10 Red Orange Red 0.05 Amber FORWARD VOLTAGE SHIFT - V 0.15 0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE - °C  100 120 140 Intensity Bin Limit Table (1.3:1 Iv bin ratio) Red Color Range Intensity (mcd) at 20mA Bin Min Max Min Dom V 4200 5500 618 Max Dom X min Y Min X max Y max 630 0.6872 0.3126 0.6890 0.2943 0.6690 0.3149 0.7080 0.2920 W 5500 7200 X 7200 9300 Tolerance for each bin limit is ± 0.5nm Y 9300 12000 Z 12000 16000 Amber Color Range 1 16000 21000 Bin Min Dom Max Dom Xmin Ymin Xmax Ymax Tolerance for each bin limit is ± 15% 2 587 589.5 0.5570 0.4420 0.5670 0.4250 0.5530 0.4400 0.5720 0.4270 VF Bin Table (V at 20mA) 4 589.5 592 0.5720 0.4270 0.5820 0.4110 0.5670 0.4250 0.5870 0.4130 0.5870 0.4130 0.5950 0.3980 0.5820 0.4110 0.6000 0.3990 Bin ID Min Max VD 1.8 2.0 VA 2.0 2.2 VB 2.2 2.4 6 592 594.5 Tolerance for each bin limit is ± 0.5nm Red Orange Color Range Tolerance for each bin limit is ± 0.05V Min Dom Max Dom Xmin Ymin Xmax Ymax 612 619 0.6712 0.6887 0.6716 0.6549 0.3280 0.3109 0.3116 0.3282 Tolerance for each bin limit ± 0.5nm Note: All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact Avago representative for further information. Avago Color Bin on CIE 1931 Chromaticity Diagram 0.460 0.440 0.420 Amber 2 4 6 0.400 Y 0.380 0.360 0.340 Red Orange 0.320 0.300 0.280 0.500  Red 0.550 0.600 0.650 X 0.700 0.750 0.800 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling: Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260°C and the solder contact time does not exceeding 5sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED Configuration • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering Manual Solder [1, 2] Dipping Pre-heat temperature 105 °C Max. - Preheat time 60 sec Max - Peak temperature 260 °C Max. 260 °C Max. Dwell time 5 sec Max. 5 sec Max Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions.  Anode Note: Electrical InGaN connection Device between bottom surface of LED die and the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. Note: In order to further assist customer in designing jig accurately that fit Avago Technologies’ product, 3D model of the product is available upon request. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED 260 °C Max TEMPERATURE (°C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) 105 °C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) 60sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff  Packaging Box for Ammo Packs Note: The dimension for ammo pack is applicable for the device with standoff and without standoff. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin 10 Lamps Baby Label RoHS Compliant e3 max temp 260C DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) (i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) OR (ii) Color bin incorporate with VF Bin (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) BIN: 2VB VB: VF bin “VB” 2: Color bin 2 only DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. AV02-1687EN - April 21, 2009