HLMP-EJ15-SV000

Data Sheet HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Description These Precision Optical Performance AlInGaP LEDs provide superior light output for excellent readability in sunlight and are extremely reliable. AlInGaP LED technology provides extremely stable light output over long periods of time. Precision Optical Performance lamps use the aluminum indium gallium phosphide (AlInGaP) technology. These LED lamps are untinted, nondiffused, T-1¾ packages incorporating second-generation optics producing well defined spatial radiation patterns at specific viewing cone angles. These lamps are made with an advanced optical grade epoxy, offering superior high temperature and high moisture resistance performance in outdoor signal and sign applications. The high maximum LED junction temperature limit of +130 °C enables high temperature operation in bright sunlight conditions. The package epoxy contains both uv-a and uv-b inhibitors to reduce the effects of long-term exposure to direct sunlight. Features        Applications   These lamps are available in two package options to give the designer flexibility with device mounting. Benefits     Well-defined spatial radiation patterns Viewing angles: 8°, 15°, 23°, 30° High luminous output Colors: – 590 nm amber – 605 nm orange – 615 nm reddish-orange – 626 nm red High operating temperature: TJLED = +130°C Superior resistance to moisture Package options: – With or without lead stand-offs  Traffic management: – Traffic signals – Pedestrian signals – Work zone warning lights – Variable message signs Commercial outdoor advertising: – Signs – Marquees Automotive: – Exterior and interior lights Viewing angles match traffic management sign requirements Colors meet automotive and pedestrian signal specifications Superior performance in outdoor environments Suitable for autoinsertion onto PC boards Broadcom AV02-0373EN March 12, 2018 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Device Selection Guide Table 1: Device Selection Guide, 8° Typical Viewing Angle Typical Viewing Angle 2½ (Deg)a 8° Color and Dominant Wavelength (nm), Typ.b Amber 590 Lamps without Standoffs on Leads (Outline Drawing A) Lamps with Standoffs on Leads (Outline Drawing B) HLMP-EL08-T0000 HLMP-EL08-VY000 — HLMP-EL10-VY000 HLMP-EL08-WZ000 Orange 605 Red-Orange 615 Red 626 — Luminous Intensity Iv (mcd)c,d,e at 20 mA Min. Max. 2500 — 4200 12000 5500 16000 HLMP-EL08-X1K00 HLMP-EL10-X1K00 7200 21000 HLMP-EL08-X1000 HLMP-EL10-X1000 7200 21000 HLMP-EJ08-WZ000 — 5500 16000 HLMP-EJ08-X1000 — 7200 21000 HLMP-EJ08-Y2000 — 9300 27000 HLMP-EH08-UX000 — 3200 9300 HLMP-EH08-WZ000 HLMP-EH10-WZ000 5500 16000 HLMP-EH08-Y2000 HLMP-EH10-Y2000 9300 27000 HLMP-EG08-T0000 — 2500 — HLMP-EG08-VY000 — 4200 12000 HLMP-EG08-WZ000 HLMP-EG10-WZ000 5500 16000 HLMP-EG08-X1000 HLMP-EG10-X1000 7200 21000 HLMP-EG08-YZ000 HLMP-EG08-Y2000 — HLMP-EG10-Y2000 9300 16000 9300 27000 a. ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. b. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. c. The luminous intensity is measured on the mechanical axis of the lamp package. d. The optical axis is closely aligned with the package mechanical axis. e. Tolerance for each intensity bin limit is ±15%. Broadcom AV02-0373EN 2 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Table 2: Device Selection Guide, 15° Typical Viewing Angle Typical Viewing Angle 2½ (Deg)a 15° Color and Dominant Wavelength (nm), Typb Amber 590 Lamps without Standoffs on Leads (Outline Drawing A) Lamps with Standoffs on Leads (Outline Drawing B) Luminous Intensity Iv (mcd)c,d,e at 20 mA Min. Max. HLMP-EL15-PS000 — 880 2500 HLMP-EL15-QT000 — 1150 3200 HLMP-EL15-UX000 HLMP-EL15-VY000 — HLMP-EL17-VY000 3200 9300 4200 12000 HLMP-EL15-VYK00 — 4200 12000 Orange 605 HLMP-EJ15-PS000 — 880 2500 Red-Orange 615 HLMP-EH15-RU000 Red 626 HLMP-EJ15-SV000 HLMP-EJ17-SV000 1900 5500 — 1500 4200 HLMP-EH15-TW000 — 2500 7200 HLMP-EG15-PS000 — 880 2500 HLMP-EG15-QT000 — 1150 3200 HLMP-EG15-RU000 — 1500 4200 3200 9300 2500 7200 HLMP-EG15-UX000 HLMP-EG17-UX000 HLMP-EG15-TW000 — a. ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. b. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. c. The luminous intensity is measured on the mechanical axis of the lamp package. d. The optical axis is closely aligned with the package mechanical axis. e. Tolerance for each intensity bin limit is ±15%. Broadcom AV02-0373EN 3 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Table 3: Device Selection Guide, 23° Typical Viewing Angle Typical Viewing Angle 2½ (Deg)a 23° Color and Dominant Wavelength (nm), Typb Amber 590 Lamps without Standoffs on Leads (Outline Drawing A) Lamps with Standoffs on Leads (Outline Drawing B) Luminous Intensity Iv (mcd)c,d,e at 20 mA Min. Max. HLMP-EL24-PS000 HLMP-EL26-PS000 880 2500 HLMP-EL24-QT000 HLMP-EL26-QT000 1150 3200 HLMP-EL24-SU400 — 1900 4200 HLMP-EL24-TW000 — 2500 7200 — 1150 3200 880 2500 Orange 605 HLMP-EJ24-QT000 Red-Orange 615 HLMP-EH24-PS000 Red 626 HLMP-EG24-PS000 HLMP-EH26-PS000 HLMP-EH24-QT000 — HLMP-EG26-PS000 1150 3200 880 2500 HLMP-EG24-QT000 — 1150 4200 HLMP-EG24-RU000 — 1500 4200 a. ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. b. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. c. The luminous intensity is measured on the mechanical axis of the lamp package. d. The optical axis is closely aligned with the package mechanical axis. e. Tolerance for each intensity bin limit is ±15%. Broadcom AV02-0373EN 4 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Table 4: Device Selection Guide, 30° Typical Viewing Angle Typical Viewing Angle 2½ (Deg)a 30° Color and Dominant Wavelength (nm), Typb Amber 590 Lamps without Standoffs on Leads (Outline Drawing A) Lamps with Standoffs on Leads (Outline Drawing B) — 520 1500 — 880 1500 — HLMP-EL32-PS000 880 1900 880 2500 HLMP-EL30-PSK00 — 880 2500 HLMP-EL30-QT000 — 1150 3200 HLMP-EL30-STK00 — 1900 3200 HLMP-EL30-SV000 — 1900 5500 HLMP-EJ30-NR000 HLMP-EJ30-PS000 Red 626 Max. HLMP-EL30-PQ000 HLMP-EL30-PS000 Red-Orange 615 Min. HLMP-EL30-MQ000 HLMP-EL30-PR400 Orange 605 Luminous Intensity Iv (mcd)c,d,e at 20 mA — HLMP-EJ32-PS000 680 1900 880 2500 HLMP-EH30-MQ000 — 520 1500 HLMP-EH30-PS000 — 880 2500 HLMP-EG30-KN000 — 310 880 HLMP-EG30-MQ000 — 520 1500 HLMP-EG30-NQ000 HLMP-EG30-NR000 — HLMP-EG32-NR000 680 1500 680 1900 HLMP-EG30-PR000 — 880 1900 HLMP-EG30-PS000 — 880 2500 HLMP-EG30-QT000 — 1150 3200 a. ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. b. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. c. The luminous intensity is measured on the mechanical axis of the lamp package. d. The optical axis is closely aligned with the package mechanical axis. e. Tolerance for each intensity bin limit is ±15%. Broadcom AV02-0373EN 5 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Figure 1: Package Dimensions A B 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) d 1.14 ± 0.20 (0.045 ± 0.008) 2.35 (0.093) MAX. 0.70 (0.028) MAX. 31.60 MIN. (1.244) 1.50 ± 0.15 (0.059 ± 0.006) 31.60 MIN. (1.244) 0.70 (0.028) MAX. CATHODE LEAD 1.00 MIN. (0.039) CATHODE LEAD 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 1.00 MIN. (0.039) 5.80 ± 0.20 (0.228 ± 0.008) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) 2.54 ± 0.38 (0.100 ± 0.015) PART NO. d HLMP-XX26 HLMP-XX32 HLMP-XX10 HLMP-XX17 12.37 ± 0.25 12.42 ± 0.25 12.52 ± 0.25 11.96 ± 0.25 (0.487 ± 0.010) (0.489 ± 0.010) (0.493 ± 0.010) (0.471 ± 0.010) NOTE: 1. All dimensions are in millimeters (inches). 2. Tapers shown at top of leads (bottom of lamp package) indicate an epoxy meniscus that may extend about 1 mm (0.040 in.) down the leads. 3. For dome heights above lead standoff seating plane, d, lamp package B, see table. Broadcom AV02-0373EN 6 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Absolute Maximum Ratings at TA = 25°C Parameter Value DC Forward Currenta,b,c 50 mA Peak Pulsed Forward Currentb,c 100 mA Average Forward Currentc Reverse Voltage (IR = 100 µA) LED Junction Temperature 30 mA 5V 130°C Operating Temperature –40°C to +100°C Storage Temperature –40°C to +100°C a. Derate linearly as shown in Figure 5. b. For long-term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more information on recommended drive conditions, refer to Application Brief I-024. c. Operating at currents below 1 mA is not recommended. Contact your local representative for further information. Broadcom AV02-0373EN 7 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Electrical/Optical Characteristics at TA = 25 °C Parameter Symbol Forward Voltage Min Typ Max VF Amber (d = 590 nm) — 2.02 2.4 Orange (d = 605 nm) — 1.98 2.4 Red-Orange (d = 615 nm) — 1.94 2.4 Red (d = 626 nm) — 1.90 2.4 5 20 — 620.0 626.0 630.0 Reverse Voltage VR Dominant Wavelength d Red Amber 584.5 590.0 594.5 Orange 599.5 605.0 610.5 612.0 615.0 621.7 Red Orange PEAK Peak Wavelength Unit Test Conditions V IF = 20 mA V IR = 100 µA nm IF = 20 mA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Amber (d = 590 nm) — 592 — Orange (d = 605 nm) — 609 — Red-Orange (d = 615 nm) — 621 — Red (d = 626 nm) — 635 — ½ — 17 — nm Wavelength Width at Spectral Distribution ½ Power Point at IF = 20 mA Speed of Response τs — 20 — ns Exponential Time Constant, e-t/ts Capacitance C — 40 — pF VF = 0, f = 1 MHz RJ-PIN — 240 — °C/W LED Junction-to-Cathode Lead Im/W Emitted Luminous Flux/Electrical Power Spectral Halfwidth Thermal Resistance Luminous ηV Efficacya Amber (d = 590 nm) — 480 — Orange (d = 605 nm) — 370 — Red-Orange (d = 615 nm) — 260 — Red (d = 626 nm) — 150 — — 500 — Luminous Flux φV b Luminous Efficiency ηe Red — 12 — Amber — 13 — Orange — 13 — Red Orange — 13 — mIm IF = 20 mA Im/W Emitted Luminous Flux/Electrical Power a. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. b. ηe = φV / IF x VF, where φV is the emitted luminous flux, IF is electrical forward current, and VF is the forward voltage. Broadcom AV02-0373EN 8 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Part Numbering System H L M P - x1 x2 x3 x4 - x5 x6 x7 x8 Code Description Option x1 Package type E 5mm Standard Round AlInGaP x2 Color G Red H Red Orange J Orange x3 x4 Viewing Angle and Lead Standoffs L Amber 08 8° without lead standoffs 10 10° with lead standoffs 15 15° without lead standoffs 17 15° with lead standoffs 24 23° without lead standoffs 26 23° with lead standoffs 30 30° without lead standoffs 32 30° with lead standoffs x5 Minimum intensity bin Refer to Device Selection Guide x6 Maximum intensity bin Refer to Device Selection Guide x7 Color bin selection x8 x9 NOTE: Broadcom Packaging option 0 Full range 4 Amber Color bin 4 only K Color bin 2 and 4 00 Bulk Packaging DD Ammopack YY Flexi-bin: Bulk Packaging ZZ Flexi-bin: Ammopack x9 Refer to AB 5337 for complete information on part numbering system. AV02-0373EN 9 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Intensity Bin Limits (mcd at 20 mA) Bin Namea Min. Max. K 310 400 L 400 520 M 520 680 N 680 880 P 880 1150 Q 1150 1500 R 1500 1900 S 1900 2500 T 2500 3200 U 3200 4200 V 4200 5500 W 5500 7200 X 7200 9300 Y 9300 12000 Z 12000 16000 1 16000 21000 2 21000 27000 Amber Color Bin Limits (nm at 20 mA) Bin Namea,b Min. 1 584.5 587 2 587 589.5 4 589.5 592 6 592 594.5 Max. a. Tolerance for each bin limit is ±0.5 nm. b. Bin categories are established for classification of products. Products may not be available in all bin categories. a. Tolerance for each bin limit is ±15%. Broadcom AV02-0373EN 10 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Figure 2: Relative Intensity vs. Peak Wavelength Figure 3: Forward Current vs. Forward Voltage 1.0 ORANGE 90 80 RED 70 CURRENT – mA RELATIVE INTENSITY 100 RED-ORANGE AMBER 0.5 60 RED 50 40 AMBER 30 20 0 550 600 650 10 0 1.0 700 1.5 WAVELENGTH – nm Figure 4: Relative Luminous Intensity vs. Forward Current 2.0 VF – FORWARD VOLTAGE – V 3.0 2.5 Figure 5: Maximum Forward Current vs. Ambient Temperature 2.5 IF – FORWARD CURRENT – mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 3.0 2.0 1.5 1.0 0.5 0 0 Broadcom 40 20 IF – DC FORWARD CURRENT – mA 60 55 50 45 40 35 30 25 20 15 10 5 0 0 20 40 80 60 TA – AMBIENT TEMPERATURE – C 100 120 AV02-0373EN 11 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Figure 7: Representative Spatial Radiation Pattern for 15° Viewing Angle Lamps 1 1 0.9 0.9 0.8 0.8 0.7 NORMALIZED INTENSITY NORMALIZED INTENSITY Figure 6: Representative Spatial Radiation Pattern for 8° Viewing Angle Lamps 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 90 30 ANGULAR DISPLACEMENT – DEGREES 1 1 0.9 0.9 0.8 0.8 0.7 0.6 0.5 0.4 0.3 0.6 0.5 0.4 0.3 0.2 0.1 0 -100 0.1 0 -90 100 180 0.7 0.2 -50 0 50 ANGULAR DISPLACEMENT – DEGREES 150 Figure 9: Representative Spatial Radiation Pattern for 30° Viewing Angle Lamps NORMALIZED INTENSITY NORMALIZED INTENSITY Figure 8: Representative Spatial Radiation Pattern for 23° Viewing Angle Lamps 60 90 120 ANGULAR DISPLACEMENT – DEGREES -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES 60 90 Figure 10: Relative Light Output vs. Junction Temperature RELATIVE LOP (NORMALIZED AT 25C) 10 ORANGE RED RED-ORANGE AMBER 1 0.1 -50 Broadcom -25 0 25 50 75 JUNCTION TEMPERATURE – C 100 125 150 AV02-0373EN 12 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Precautions  Lead Forming    The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. For better control, use the proper tool to precisely form and cut the leads to the applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into LED package. Use this method for hand soldering operation, because the excess lead length also acts as small heat sink. Set and maintain wave soldering parameters according to the recommended temperature and dwell time. Perform daily checks on the soldering profile to ensure that it conforms to the recommended soldering conditions. NOTE: 1. PCBs with different sizes and designs (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if the same wave soldering setting is used. Therefore, recalibrate the soldering profile again before loading a new type of PCB. 2. Broadcom’s AllnGaP high-brightness LEDs use a high-efficiency LED die with a single wire bond as shown below. Take extra precautions during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceed 3s. Overstressing the LED during the soldering process might cause premature failure to the LED due to delamination. Soldering and Handling   Take care during the PCB assembly and soldering process to prevent damage to the LED component. The LED component may be effectively hand soldered to PCB; however, do this only under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED. Figure 11: LED Configuration 1.59mm   Broadcom LED Configuration Properly apply ESD precautions on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Refer to Broadcom® application note AN-1142 for details. The soldering iron used should have a grounded tip to ensure electrostatic charge is properly grounded. Recommended soldering condition: Wave Solderinga,b Manual Solder Dipping Pre-heat temperature 105°C max. — Preheat time 60s max. — Peak temperature 250°C mMx. 260°C max. Dwell time 3s max. 5s max. a. Above conditions refer to measurement with thermocouple mounted at the bottom of PCB. b. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. Broadcom CATHODE NOTE:   Electrical connection between the bottom surface of the LED die and the lead frame is achieved through conductive paste. Loosely fit any alignment fixture that is being applied during wave soldering and do not apply weight or force on the LED. Use nonmetal material because it absorbs less heat during the wave soldering process. At elevated temperatures, the LED is more susceptible to mechanical stress. Therefore, allow the PCB to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. AV02-0373EN 13 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet   If the PCB board contains both through hole (TH) LED and other surface-mount components, solder the surface-mount components on the top side of the PCB. If the surface mount must be on the bottom side, solder these components using reflow soldering prior to the insertion of the TH LED. The following table shows the recommended PC board plated through holes (PTH) size for LED component leads. LED Component Lead Size Plated Through Hole Diameter Diagonal 0.45 mm × 0.45 mm (0.018 in. × 0.018 in.) 0.636 mm (0.025 in.) 0.98 mm to 1.08 mm (0.039 in. to 0.043 in.) 0.50 mm × 0.50 mm (0.020 in. × 0.020 in.) 0.707 mm (0.028 in.) 1.05 mm to 1.15 mm (0.041 in. to 0.045 in.)  T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps NOTE: Refer to application note AN-5334 for more information about soldering and handling high-brightness TH LED lamps. Application Precautions    Over-sizing the PTH can lead to a twisted LED after clinching. On the other hand, under-sizing the PTH can cause difficulty when inserting the TH LED. The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. LEDs exhibit slightly different characteristics at different drive currents that might result in larger performance variations (such as intensity, wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations. The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, ensure that the reverse bias voltage does not exceed the allowable limit of the LED. Figure 12: Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 TEMPERATURE (°C) Flux: Rosin flux 200 Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 150 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 100 50 PREHEAT 0 Broadcom 10 20 30 40 60 50 TIME (SECONDS) 70 80 90 100 AV02-0373EN 14 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Figure 13: Ammo Pack Drawing 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) CATHODE 20.50 ± 1.00 (0.807 ± 0.039) 9.125 ± 0.625 (0.3593 ± 0.0246) 18.00 ± 0.50 (0.7087 ± 0.0197) A 12.70 ± 0.30 (0.50 ± 0.0118) 4.00 ± 0.20 TYP. (0.1575 ± 0.008) VIEW A–A 0.70 ± 0.20 (0.0276 ± 0.0079) ALL DIMENSIONS IN MILLIMETERS (INCHES). A NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF. Figure 14: Packaging Box for Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A + GO AVA OGIES L NO ECH DE ANO T E HOD CAT – ANODE LEAD LEAVES THE BOX FIRST. EL C ER TH MO LAB NOTE: THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF. Broadcom AV02-0373EN 15 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Packaging Label Figure 15: Mother Label (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Figure 16: Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Broadcom AV02-0373EN 16 HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Acronyms and Definitions BIN:  (i) Color bin only or VF bin only Example:  Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin OR  (ii) Color bin incorporated with VF Bin Applicable for part number that have both color bin and VF bin Broadcom  (i) Color bin only or VF bin only – BIN: 2 (represent color bin 2 only) – BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin – BIN: 2VB, where:  2 is color bin 2 only  VB is VF bin "VB" AV02-0373EN 17 Disclaimer Broadcom’s products and software are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, construction, maintenenace, or direct operation of a nuclear facility or for use in medical devices or applications. 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