HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx
T-13/4 (5 mm) Precision Optical Performance
AlInGaP LED Lamps
Data Sheet
Description
Features
These Precision Optical Performance AlInGaP LEDs provide
superior light output for excellent readability in sunlight
and are extremely reliable. AlInGaP LED technology provides extremely stable light output over long periods of
time. Precision Optical Performance lamps utilize the aluminum indium gallium phosphide (AlInGaP) technology.
• Well defined spatial radiation patterns
These LED lamps are untinted, nondiffused, T-13/4 packages incorporating second generation optics producing
well defined spatial radiation patterns at specific viewing
cone angles.
These lamps are made with an advanced optical grade
epoxy, offering superior high temperature and high moisture resistance performance in outdoor signal and sign
applications. The high maximum LED junction tempera
ture limit of +130°C enables high temperature operation
in bright sunlight conditions. The package epoxy contains
both uv-a and uv‑b inhibitors to reduce the effects of long
term exposure to direct sunlight.
These lamps are available in two package options to give
the designer flexibility with device mounting.
Benefits
• Viewing angles match traffic management sign requirements
• Colors meet automotive and pedestrian signal specifications
• Superior performance in outdoor environments
• Suitable for autoinsertion onto PC boards
• Viewing angles: 8°, 15°, 23°, 30°
• High luminous output
• Colors:
590 nm amber
605 nm orange
615 nm reddish-orange
626 nm red
• High operating temperature: TJ led = +130°C
• Superior resistance to moisture
• Package options:
With or without lead stand-offs
Applications
• Traffic management:
Traffic signals
Pedestrian signals
Work zone warning lights
Variable message signs
• Commercial outdoor advertising:
Signs
Marquees
• Automotive:
Exterior and interior lights
Device Selection Guide
Typical
Viewing Angle
2θ 1/2 (Deg.)[4]
Color and Dominant
Wavelength
(nm), Typ.[3]
Lamps without
Standoffs on Leads
(Outline Drawing A)
Lamps with Standoffs
on Leads
(Outline Drawing B)
Luminous Intensity
Iv (mcd)[1,2,5] @ 20 mA
Min. Max.
HLMP-EL08-T0000
HLMP-EL10-T0000
2500
–
HLMP-EL08-VY000
HLMP-EL10-VY000
4200
12000
HLMP-EL08-VYK00
4200
12000
HLMP-EL08-WZ000
HLMP-EL10-WZ000
5500
16000
HLMP-EL08-X1K00
HLMP-EL10-X1K00
7200
21000
HLMP-EL08-X1000
HLMP-EL10-X1000
8°
Amber 590
Orange 605
21000
5500
16000
HLMP-EJ08-X1000
7200
21000
HLMP-EJ08-Y2000
HLMP-EJ10-X1000
9300
27000
HLMP-EH08-UX000
HLMP-EH10-UX000
3200
9300
HLMP-EH08-WZ000
HLMP-EH10-WZ000
5500
16000
HLMP-EH08-X1000
HLMP-EH10-X1000
7200
21000
HLMP-EH08-Y2000
HLMP-EH10-Y2000
9300
27000
HLMP-EG08-T0000
HLMP-EG10-T0000
Red-Orange 615
7200
HLMP-EJ08-WZ000
2500
–
Red 626
HLMP-EG08-VY000
4200
12000
HLMP-EG08-WZ000
HLMP-EG10-WZ000
5500
16000
HLMP-EG08-X1000
HLMP-EG10-X1000
7200
21000
HLMP-EG08-YZ000
9300
16000
HLMP-EG08-Y2000
9300
27000
HLMP-EG10-Y2000
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ1/2 is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each intensity bin limit is ± 15%.
Device Selection Guide
Typical
Viewing Angle
2θ 1/2 (Deg.)[4]
Color and Dominant
Wavelength
(nm), Typ.[3]
15°
Lamps without
Standoffs on Leads
(Outline Drawing A)
Amber 590
Lamps with Standoffs
on Leads
(Outline Drawing B)
Luminous Intensity
Iv (mcd)[1,2,5] @ 20 mA
Min. Max.
HLMP-EL17-M0000
520
–
HLMP-EL15-PS000
880
2500
HLMP-EL15-QSK00
1150
2500
HLMP-EL15-QT000
1150
3200
HLMP-EL15-RU000
1500
4200
HLMP-EL15-TW000
2500
7200
HLMP-EL15-TWK00
2500
7200
HLMP-EL15-UX000
HLMP-EL17-UX000
3200
9300
HLMP-EL15-VY000
HLMP-EL17-VY000
4200
12000
HLMP-EL15-VYK00
4200
12000
HLMP-EL15-VW000
4200
7200
1150
3200
HLMP-EJ15-PS000
880
2500
HLMP-EJ15-RU000
1500
4200
HLMP-EJ15-SV000
1900
5500
Orange 605
HLMP-EL17-TW000
HLMP-EJ17-SV000
HLMP-EH15-QT000
1150
3200
HLMP-EH15-RU000
1500
4200
HLMP-EH15-TW000
HLMP-EH17-TW000
2500
7200
HLMP-EH15-UX000
HLMP-EH17-UX000
3200
9300
HLMP-EG15-N0000
HLMP-EG17-N0000
Red-Orange 615
HLMP-EJ17-QT000
680
–
Red 626
HLMP-EG15-PS000
880
2500
HLMP-EG15-QT000
HLMP-EG17-QT000
1150
3200
HLMP-EG15-RU000
HLMP-EG17-RU000
1500
4200
HLMP-EG15-UX000
HLMP-EG17-UX000
3200
9300
HLMP-EG15-TW000
HLMP-EG17-TW000
2500
7200
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ1/2 is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each intensity bin limit is ± 15%.
Device Selection Guide
Typical
Viewing Angle
2θ 1/2 (Deg.)[4]
Color and Dominant
Wavelength
(nm), Typ.[3]
23°
Amber 590
Lamps without
Standoffs on Leads
(Outline Drawing A)
Lamps with Standoffs
on Leads
(Outline Drawing B)
Luminous Intensity
Iv (mcd)[1,2,5] @ 20 mA
Min. Max.
HLMP-EL24-L0000
HLMP-EL26-L0000
400
–
HLMP-EL24-MQ000
520
1500
HLMP-EL24-NR000
680
1900
HLMP-EL24-PS000
880
2500
HLMP-EL24-QR000
1150
1900
HLMP-EL24-QRK00
1150
1900
HLMP-EL24-QS400
1150
2500
HLMP-EL24-QT000
HLMP-EL26-QT000
1150
3200
HLMP-EL24-RU000
HLMP-EL26-RU000
1150
4200
HLMP-EL24-RUK00
1150
4200
HLMP-EL24-SV000
1900
5500
HLMP-EL24-SUK00
1900
4200
HLMP-EL24-SU400
1900
4200
HLMP-EL24-SVK00
1900
5500
HLMP-EL24-TW000
2500
7200
HLMP-EL26-PS000
HLMP-EL26-SV000
HLMP-EL26-TW000
HLMP-EL24-TWK00
2500
7200
Orange 605
HLMP-EJ24-QT000
1150
3200
Red-Orange 615
HLMP-EH24-PS000
880
2500
HLMP-EH24-QT000
1150
3200
HLMP-EH24-RU000
1500
4200
HLMP-EH24-SV000
HLMP-EH26-SV000
1900
5500
Red 626
HLMP-EH26-PS000
HLMP-EG24-M0000
HLMP-EG26-M0000
520
–
HLMP-EG24-PS000
HLMP-EG26-PS000
880
2500
HLMP-EG24-QT000
1150
4200
HLMP-EG24-RU000
1500
4200
HLMP-EG26-RU000
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ1/2 is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each intensity bin limit is ± 15%.
Device Selection Guide
Typical
Viewing Angle
2θ 1/2 (Deg.)[4]
Color and Dominant
Wavelength
(nm), Typ.[3]
30°
Amber 590
Lamps without
Standoffs on Leads
(Outline Drawing A)
Lamps with Standoffs
on Leads
(Outline Drawing B)
Luminous Intensity
Iv (mcd)[1,2,5] @ 20 mA
Min. Max.
HLMP-EL30-K0000
HLMP-EL32-K0000
310
–
520
1500
680
1900
HLMP-EL30-MQ000
HLMP-EL32-NR000
HLMP-EL30-PQ000
880
1500
HLMP-EL30-PR400
880
1900
HLMP-EL30-PS000
880
2500
HLMP-EL30-PSK00
880
2500
HLMP-EL30-QT000
1150
3200
HLMP-EL30-QTK00
1150
3200
HLMP-EL30-ST000
1900
3200
HLMP-EL30-SU400
1900
4200
HLMP-EL30-SUK00
1900
4200
HLMP-EL30-STK00
1900
3200
HLMP-EL30-SV000
1900
5500
HLMP-EL30-SVK00
1900
5500
HLMP-EJ30-NR000
680
1900
HLMP-EJ30-PS000
HLMP-EJ32-PS000
880
2500
Orange 605
Red-Orange 615
HLMP-EL32-PS000
HLMP-EL32-QT000
HLMP-EL32-SV000
HLMP-EH30-MQ000
HLMP-EH32-MQ000
520
1500
HLMP-EH30-NR000
HLMP-EH32-NR000
680
1900
HLMP-EH30-PS000
HLMP-EH32-PS000
880
2500
HLMP-EH30-QT000
HLMP-EH32-QT000
1150
4200
HLMP-EH30-RU000
HLMP-EH32-RU000
1500
4200
HLMP-EG30-K0000
HLMP-EG32-K0000
270
–
Red 626
HLMP-EG30-KN000
310
880
HLMP-EG30-MQ000
520
1500
HLMP-EG30-NQ000
680
1500
HLMP-EG30-NR000
680
1900
HLMP-EG30-PQ000
880
1500
HLMP-EG30-PR000
880
1900
HLMP-EG30-PS000
880
2500
HLMP-EG30-QT000
1150
3200
HLMP-EG32-MQ000
HLMP-EG32-NR000
HLMP-EG32-QT000
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ1/2 is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each intensity bin limit is ± 15%.
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
YY: Flexi-Bin; Bulk Packaging
ZZ: Flexi-Bin; Ammo Pack
Color Bin Selections
0: No color bin limitation
4: Amber color bin 4 only
K: Amber color bins 2 and 4 only
Maximum Intensity Bin
0: No Iv bin limitation
Minimum Intensity Bin
Viewing Angle & Lead Stand Offs
08: 8 deg without lead stand offs
10: 8 deg with lead stand offs
15: 15 deg without lead stand offs
17: 15 deg with lead stand offs
24: 23 deg without lead stand offs
26: 23 deg with lead stand offs
30: 30 deg without lead stand offs
32: 30 deg with lead stand offs
Color
G: 626 nm Red
H: 615 nm Red-Orange
J: 605 nm Orange
L: 590 nm Amber
Package
E: 5 mm Round
Note: Please refer to AB 5337 for complete information on part numbering system.
Package Dimensions
A
B
5.00 ± 0.20
(0.197 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
d
1.14 ± 0.20
(0.045 ± 0.008)
2.35 (0.093)
MAX.
0.70 (0.028)
MAX.
31.60
MIN.
(1.244)
1.50 ± 0.15
(0.059 ± 0.006)
31.60
MIN.
(1.244)
0.70 (0.028)
MAX.
CATHODE
LEAD
1.00 MIN.
(0.039)
CATHODE
FLAT
CATHODE
LEAD
0.50 ± 0.10
SQ. TYP.
(0.020 ± 0.004)
0.50 ± 0.10
SQ. TYP.
(0.020 ± 0.004)
1.00 MIN.
(0.039)
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
5.80 ± 0.20
(0.228 ± 0.008)
CATHODE
FLAT
2.54 ± 0.38
(0.100 ± 0.015)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. LEADS ARE MILD STEEL, SOLDER DIPPED.
3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.
NOTES:
4. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE.
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY MENISCUS
THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.
3. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE.
PART NO.
d
HLMP-XX10
12.37 ± 0.25
(0.487 ± 0.010)
12.42 ± 0.25
(0.489 ± 0.010)
HLMP-XX17
HLMP-XX26
12.52 ± 0.25
(0.493 ± 0.010)
HLMP-XX32
11.96 ± 0.25
(0.471 ± 0.010)
Absolute Maximum Ratings at TA = 25°C
DC Forward Current[1,2,3] . .................................................................................... 50 mA
Peak Pulsed Forward Current[2,3] . ......................................................................100 mA
Average Forward Current[3] . ................................................................................. 30 mA
Reverse Voltage (IR = 100 µA)......................................................................................... 5 V
LED Junction Temperature........................................................................................ 130°C
Operating Temperature..........................................................................-40°C to +100°C
Storage Temperature...............................................................................-40°C to +100°C
Notes:
1. Derate linearly as shown in Figure 4.
2. For long term performance with minimal light output degradation, drive currents between 10
mA and 30 mA are recommended. For more information on recommended drive conditions,
please refer to Application Brief I-024.
3. Operating at currents below 1 mA is not recommended. Please contact your local representative for further information.
Electrical/Optical Characteristics at TA = 25°C
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
Amber (ld = 590 nm)
2.02
Orange (ld = 605 nm)
VF
1.98
2.4
V
Red-Orange (ld = 615 nm)
1.94
Red (ld = 626 nm)
1.90
IF = 20 mA
Reverse Voltage
IF = 100 µA
VR
5
20
V
Peak Wavelength:
Amber (ld = 590 nm)
592
Orange (ld = 605 nm)
lPEAK
609
nm
Red-Orange (ld = 615 nm)
621
Red (ld = 626 nm)
635
Peak of Wavelength of
Spectral Distribution
at IF = 20 mA
Spectral Halfwidth
∆l1/2
17
nm
Wavelength Width at
Spectral Distribution
1/2 Power Point at
IF = 20 mA
Speed of Response
ts
20
ns
Exponential Time
Constant, e-t/ts
Capacitance
VF = 0, f = 1 MHz
C
40
pF
Thermal Resistance
RqJ-PIN
240
°C/W
LED Junction-to-Cathode
Lead
Luminous Efficacy[1]
Amber (ld = 590 nm)
Orange (ld = 605 nm)
hv
Red-Orange (ld = 615 nm)
Red (ld = 626 nm)
480
370
lm/W
260
150
Emitted Luminous
Power/Emitted Radiant
Power
500 mlm
IF = 20 mA
Luminous Flux
jv
Luminous Efficiency [2]
he
Amber
Orange
Red-Orange
Red
Note:
Emitted Luminous
12
lm/W
Flux/Electrical Power
13
13
13
1. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv
is the luminous efficacy in lumens/watt.
2. he = jV / IF x VF, where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
1.0
100
RED-ORANGE
AMBER
80
RED
70
CURRENT – mA
RELATIVE INTENSITY
ORANGE
90
0.5
60
RED
50
40
AMBER
30
20
10
0
550
600
650
0
1.0
700
WAVELENGTH – nm
Figure 1. Relative intensity vs. peak wavelength
55
50
IF – FORWARD CURRENT – mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
2.5
2.0
1.5
1.0
0.5
45
40
35
30
25
20
15
10
5
0
0
20
40
0
60
20
40
60
80
100
120
TA – AMBIENT TEMPERATURE – °C
IF – DC FORWARD CURRENT – mA
Figure 4. Maximum forward current vs. ambient temperature
Figure 3. Relative luminous intensity vs. forward
current
1
NORMALIZED INTENSITY – %
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
01.
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT – DEGREES
Figure 5. Representative spatial radiation pattern for 8° viewing angle lamps
2.0
2.5
Figure 2. Forward current vs. forward voltage
3.0
0
1.5
VF – FORWARD VOLTAGE – V
60
90
3.0
1
NORMALIZED INTENSITY – %
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
30
60
90
120
150
180
ANGULAR DISPLACEMENT – DEGREES
Figure 6. Representative spatial radiation pattern for 15° viewing angle lamps
1
NORMALIZED INTENSITY – %
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-100
-50
0
50
100
ANGULAR DISPLACEMENT – DEGREES
Figure 7. Representative spatial radiation pattern for 23° viewing angle lamps
1
NORMALIZED INTENSITY
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREES
Figure 8. Representative spatial radiation pattern for 30° viewing angle lamps
10
90
Intensity Bin Limits
RELATIVE LOP
(NORMALIZED AT 25°C)
10
(mcd at 20 mA)
ORANGE
RED
RED-ORANGE
AMBER
1
0.1
-50
-25
0
25
50
75
JUNCTION TEMPERATURE – °C
Figure 9. Relative light output vs. junction temperature
100
125
150
Bin Name
Min.
Max.
K
310
400
L
400
520
M
520
680
N
680
880
P
880
1150
Q
1150
1500
R
1500
1900
S
1900
2500
T
2500
3200
U
3200
4200
V
4200
5500
W
5500
7200
X
7200
9300
Y
9300
12000
Z
12000
16000
1
16000
21000
2
21000
27000
Tolerance for each bin limit is ± 15%.
Amber Color Bin Limits
(nm at 20 mA)
Bin Name
Min.
Max.
1
584.5
587.0
2
587.0
589.5
4
589.5
592.0
6
592.0
594.5
Tolerance
for each bin limit is ± 0.5 nm.
Note:
1. Bin categories are established for classification of products. Products may not be
available in all bin categories.
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED configuration
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The
closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59mm. Soldering the LED using soldering iron tip
closer than 1.59mm might damage the LED.
1.59mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and maintained
according to the recommended temperature and
dwell time. Customer is advised to perform daily check
on the soldering profile to ensure that it is always
conforming to recommended soldering conditions.
12
CATHODE
Note: Electrical
connection
AllnGaP
Devicebetween bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
0.636 mm
(0.018x 0.018 inch) (0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
0.707 mm
(0.020x 0.020 inch) (0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
250
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
200
150
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
100
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
50
PREHEAT
0
10
20
30
40
50
60
TIME (MINUTES)
70
80
90
100
Figure 10. Recommended wave soldering profile
Ammo Pack Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
20.50 ± 1.00
(0.807 ± 0.039)
9.125 ± 0.625
(0.3593 ± 0.0246)
18.00 ± 0.50
(0.7087 ± 0.0197)
A
12.70 ± 0.30
(0.50 ± 0.0118)
ALL DIMENSIONS IN MILLIMETERS (INCHES).
0.70 ± 0.20
(0.0276 ± 0.0079)
A
VIEW A–A
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
13
∅
4.00 ± 0.20 TYP.
(0.1575 ± 0.008)
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
A
+
O
AG ES
AV LOGI
O
HN
E
OD
AN
TEC
E
OD
TH
CA
–
ANODE LEAD LEAVES
THE BOX FIRST.
C
ER
TH
MO
L
BE
LA
NOTE:
THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 250C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
Lamps Baby Label
14
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and
no color bin)
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
OR
(ii) Color bin incorporate with VF Bin
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color
bin and VF bin)
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR
FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE
CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4368EN
AV02-0373EN - September 2, 2008
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