HLMP-EL1G-130DD

Data Sheet HLMP-EGxx, HLMP-ELxx T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs Description The Broadcom® Precision Optical Performance AlInGaP LEDs provide superior light output for excellent readability in sunlight and are extremely reliable. AlInGaP LED technology provides extremely stable light output over long periods of time. Precision Optical Performance lamps utilize the aluminum indium gallium phosphide (AlInGaP) technology. These LED lamps are untinted, T-1¾ packages incorporating second-generation optics, producing welldefined spatial radiation patterns at specific viewing cone angles. These lamps are made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance performance in outdoor signal and sign application. The maximum LED junction temperature limit of +130°C enables high temperature operation in bright sunlight conditions. The epoxy contains UV inhibitor to reduce the effects of long-term exposure to direct sunlight. Benefits   Features       Viewing angle: 15°, 23°, and 30° Well-defined spatial radiation pattern High brightness material Available in Red and Amber – Red AlInGaP 626 nm – Amber AlInGaP 590 nm Superior resistance to moisture Standoff and non-standoff package Applications    Traffic management: – Traffic signals – Pedestrian signals – Work zone warning lights – Variable message signs Solar power signs Commercial outdoor advertising – Signs – Marquee Superior performance for outdoor environment Suitable for auto-insertion onto PC board Broadcom AV02-3139EN February 14, 2018 T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs HLMP-EGxx, HLMP-ELxx Data Sheet Figure 1: Package Dimensions Non-Standoff Standoff 5.00 ± 0.20 (0.197 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) d 1.14 ± 0.20 (0.045 ± 0.008) 2.35 (0.093) MAX. 0.70 (0.028) MAX. 31.60 MIN. (1.244) 1.50 ± 0.15 (0.059 ± 0.006) 31.60 MIN. (1.244) 0.70 (0.028) MAX. CATHODE LEAD 1.00 MIN. (0.039) CATHODE FLAT CATHODE LEAD 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 5.80 ± 0.20 (0.228 ± 0.008) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 1.00 MIN. (0.039) 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) 2.54 ± 0.38 (0.100 ± 0.015) NOTE: Part Number Dimension d HLMP-EG1H-xxxxx 12.30 ± 0.25 mm HLMP-EL1H-xxxxx 12.64 ± 0.25 mm HLMP-EG2H-xxxxx 12.10 ± 0.25 mm HLMP-EL2H-xxxxx 12.14 ± 0.25 mm HLMP-EG3H-xxxxx/HLMP-EL3H-xxxxx 12.10 ± 0.25 mm 1. All dimensions in millimeters (inches). 2. Tolerance is ±0.20 mm unless other specified. 3. Leads are mild steel with tin plating. 4. The epoxy meniscus is 1.21 mm max. 5. For identification of polarity after the leads are trimmed off, refer to the illustration: CATHODE Broadcom ANODE AV02-3139EN 2 T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs HLMP-EGxx, HLMP-ELxx Data Sheet Device Selection Guide Color and Dominant Wavelength, d (nm) Typa Part Number Luminous Intensity, IV (mcd) Standoff Typical Viewing Angle (°)e 15 at 20 mAb,c,d Min Max HLMP-EG1G-Y10DD Red 626 9300 21000 No HLMP-EG1H-Y10DD Red 626 9300 21000 Yes HLMP-EL1G-130DD Amber 590 16000 35000 No HLMP-EL1H-130DD Amber 590 16000 35000 Yes HLMP-EG2G-XZ0DD Red 626 7200 16000 No HLMP-EG2H-XZ0DD Red 626 7200 16000 Yes HLMP-EL2G-XZKDD Amber 590 7200 16000 No HLMP-EL2H-XZKDD Amber 590 7200 16000 Yes HLMP-EG3G-VX0DD Red 626 4200 9300 No HLMP-EG3H-VX0DD Red 626 4200 9300 Yes HLMP-EL3G-VX0DD Amber 590 4200 9300 No HLMP-EL3H-VX0DD Amber 590 4200 9300 Yes 23 30 a. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. b. The luminous intensity, IV, is measured on the mechanical axis of the lamp package, and it is tested with pulsing condition. c. The optical axis is closely aligned with the package mechanical axis. d. Tolerance for each bin limit is ±15%. e. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. Absolute Maximum Ratings (TJ = 25°C) Parameter Red/ Amber Unit DC Forward Current 50 mA Peak Forward Currentb 100 mA Power Dissipation 120 mW LED Junction Temperature 130 °C Operating Temperature Range –40 to +100 °C Storage Temperature Range –40 to +100 °C a a. Derate linearly as shown in Figure 6. b. Duty Factor 30%, frequency 1 kHz. Broadcom AV02-3139EN 3 T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs HLMP-EGxx, HLMP-ELxx Data Sheet Electrical/Optical Characteristics (TJ = 25°C) Parameter Symbol Forward Voltage Red and Amber VF Reverse Voltagea Red and Amber VR Dominant Wavelength Red Amber Peak Wavelength Red Amber Min. Typ. Max. 1.8 2.1 2.4 5 — — 618.0 584.5 626.0 590.0 630.0 594.5 — — — 634 594 240 — — — — — 190 490 — — — — 0.05 0.09 — — Unit d b PEAK Thermal Resistance RJ-PIN v Luminous Efficacyc Red Amber Thermal Coefficient of d Red Amber Test Conditions V IF = 20 mA V IR = 100 A nm IF = 20 mA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA °C/W LED junction to pin lm/W Emitted Luminous Power/ Emitted Radiant Power nm/°C IF = 20 mA; +25° C ≤ TJ ≤ +100° C a. Indicates product final testing condition; long-term reverse bias is not recommended. b. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp. c. The radiant intensity, Ie in watts per steradian, can be found from the equation Ie = IV/ηV, where IV is the luminous intensity in candela and ηV is the luminous efficacy in lumens/watt. Part Numbering System H L M P - x1 x2 x3 x4 - x5 x6 x7 x8 x9 Code Description Option x1 Package Type E 5-mm Standard Round AlInGaP x2 Color G Red L Amber x3 x4 Viewing Angle and Lead Standoffs 1G 15° without lead standoffs 1H 15° with lead standoffs 2G 23° without lead standoffs 2H 23° with lead standoffs 3G 30° without lead standoffs 3H 30° with lead standoffs x5 Minimum Intensity Bin x6 Maximum Intensity Bin x7 Color Bin Selection x8 x9 Broadcom Packaging Option Refer to Device Selection Guide. 0 Full range K Color bin 2 and 4 L Color bin 4 and 6 DD Ammopack AV02-3139EN 4 T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs HLMP-EGxx, HLMP-ELxx Data Sheet Bin Information Amber Color Range Intensity Bin Limit Table (1.3 : 1 IV Bin Ratio) Intensity (mcd) at 20 mA Bin Min Dom Max Dom 1 584.5 587.0 2 Bin Min Max U 3200 4200 V 4200 W 5500 7200 X 7200 9300 Y 9300 12000 Z 12000 16000 1 16000 21000 2 21000 27000 3 27000 35000 4 587.0 589.5 589.5 592.0 5500 6 592.0 594.5 X Min Y Min X Max Y Max 0.5420 0.4580 0.5530 0.4400 0.5370 0.4550 0.5570 0.4420 0.5570 0.4420 0.5670 0.4250 0.5530 0.4400 0.5720 0.4270 0.5720 0.4270 0.5820 0.4110 0.5670 0.4250 0.5870 0.4130 0.5870 0.4130 0.5950 0.3980 0.5820 0.4110 0.6000 0.3990 Tolerance for each bin limit is ±0.5 nm. NOTE: Tolerance for each bin limit is ±15%. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Broadcom representative for further information. Figure 2: Color Bin on CIE 1931 Chromaticity Diagram VF Bin Table (V at 20 mA) 0.480 Bin ID Min Max 0.460 VD 1.8 2.0 0.440 VA 2.0 2.2 VB 2.2 2.4 Amber 2 0.420 Y Red Color Range 618.0 630.0 4 6 0.400 Tolerance for each bin limit is ±0.05V. Min Dom Max Dom 1 0.380 0.360 X Min Y Min X Max Y Max 0.340 0.6872 0.3126 0.6890 0.2943 0.320 0.6690 0.3149 0.7080 0.2920 Red 0.300 Tolerance for each bin limit is ±0.5 nm. 0.280 0.500 Broadcom 0.550 0.600 0.650 X 0.700 0.750 0.800 AV02-3139EN 5 T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs HLMP-EGxx, HLMP-ELxx Data Sheet Figure 3: Relative Intensity vs Wavelength Figure 4: Forward Current vs Forward Voltage 1.0 RELATIVE INTENSITY 0.8 Amber FORWARD CURRENT-mA 100 Red 0.6 0.4 0.2 550 600 WAVELENGTH - nm 650 0 1 2 FORWARD VOLTAGE-V 3 60 IF - FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 20 Figure 6: Maximum Forward Current vs Ambient Temperature 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 20 40 60 DC FORWARD CURRENT - mA 80 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 40 30 20 10 0 20 40 60 80 TA - AMBIENT TEMPERATURE - ºC 100 120 Figure 8: Representative Radiation Pattern for 23° Viewing Angle Lamp NORMALIZED INTENSITY 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 50 0 100 Figure 7: Representative Radiation Pattern for 15° Viewing Angle Lamp NORMALIZED INTENSITY 40 700 Figure 5: Relative Intensity vs Forward Current Broadcom 60 0 0.0 500 -90 80 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 AV02-3139EN 6 T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs HLMP-EGxx, HLMP-ELxx Data Sheet Figure 10: Relative Light Output vs Junction Temperature 10 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 RELATIVE LIGHT OUTPUT NORMALIZED AT TJ = 25° C NORMALIZED INTENSITY Figure 9: Representative Radiation Pattern for 30° Viewing Angle Lamp -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Amber Red 1 0.1 -40 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE 120 140 Figure 11: Forward Voltage Shift vs Junction Temperature 0.6 Amber Red FORWARD VOLTAGE SHIFT - V 0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -40 Broadcom -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE 120 140 AV02-3139EN 7 T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs HLMP-EGxx, HLMP-ELxx Data Sheet Precautionary Notes  Lead Forming    The leads of an LED lamp can be preformed or cut to length prior to insertion and soldering on PC board. For better control, use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground, which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. The customer is advised to perform a daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. NOTE: Soldering and Handling   Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. The LED component can be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED.  A PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to recalibrate the soldering profile again before loading a new type of PCB.  The Broadcom high brightness LEDs are using high-efficiency LED die with single-wire bond as shown in Figure 12. The customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260°C and the solder contact time does not exceeding 5 sec. Overstressing the LED during soldering process might cause premature failure to the LED due to delamination. Figure 12: LED Configuration 1.59 mm   ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Refer to Broadcom application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. Recommended soldering condition: Preheat Temperature Preheat Time Peak Temperature Dwell Time Wave Solderinga,b Manual Solder Dipping 105°C Max. 60 sec Max 260°C Max. 5 sec Max. — — 260°C Max. 5 sec Max a. These conditions refer to the measurement with thermocouple mounted at the bottom of PCB. b. Use only bottom preheaters to reduce thermal stress experienced by LED. Broadcom Anode NOTE:  Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste. Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on the LED. Non-metal material is recommended as it will absorb less heat during wave soldering process. NOTE: In order to further assist the customer in designing jig accurately to fit the Broadcom product, a 3D model of the product is available upon request. AV02-3139EN 8 T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs HLMP-EGxx, HLMP-ELxx Data Sheet   At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, the PCB must be allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. If the PCB board contains both through-hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount needs to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED.  The following table shows the recommended PC board plated through holes (PTH) size for LED component leads: LED Component Lead Size Diagonal Plated Through Hole Diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch)  Oversizing the PTH can lead to twisted LED after clinching. On the other hand, undersizing the PTH can cause difficulty inserting the TH LED. Refer to the Broadcom application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Figure 13: Example of Wave Soldering Temperature Profile for TH LED 260 °C Max TEMPERATURE (°C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) 105 °C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) 60sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Broadcom AV02-3139EN 9 T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs HLMP-EGxx, HLMP-ELxx Data Sheet Figure 14: Ammo Packs Drawing 6.35 ±1.30 0.250 ±0.051 12.70 ±1.00 0.500 ±0.039 CATHODE 20.5 ±1.00 0.8070 ±0.0394 9.125 ±0.625 0.3595 ±0.0245 18.00 ±0.50 0.7085 ±0.0195 12.70 ±0.30 0.500 ±0.012 0.70 ±0.20 0.0275 ±0.0075 A A 4.00 ±0.20 TYP. ø 0.1575 ±0.0075 VIEW A-A NOTE: The ammo-packs drawing is applicable for packaging option -DD and -ZZ and regardless standoff or non-standoff. Broadcom AV02-3139EN 10 HLMP-EGxx, HLMP-ELxx Data Sheet T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs Figure 15: Packaging Box for Ammo Packs NOTE: Broadcom The dimension for ammo pack is applicable for the device with standoff and without standoff. AV02-3139EN 11 T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs HLMP-EGxx, HLMP-ELxx Data Sheet Packaging Labels Figure 16: (i) Mother Label (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Figure 17: (ii) Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Broadcom AV02-3139EN 12 HLMP-EGxx, HLMP-ELxx Data Sheet T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs Acronyms and Definitions BIN: (i) Color bin only or VF bin only Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin. OR (ii) Color bin incorporated with VF Bin Applicable for part number that have both color bin and VF bin. Example: (i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin VB only) (ii) Color bin incorporate with VF Bin BIN: 2 VB VB: VF bin VB 2: Color bin 2 only Broadcom AV02-3139EN 13 Disclaimer Broadcom's products and software are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical devices or applications. The customer is solely responsible, and waives all rights to make claims against Broadcom or its suppliers, for all loss, damage, expense, or liability in connection with such use. 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