HLMP-EL3G-VX0DD

HLMP-EGxx, HLMP-ELxx T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs Data Sheet Description Features These Precision Optical Performance AlInGaP LEDs provide superior light output for excellent readability in sunlight and are extremely reliable. AlInGaP LED technology provides extremely stable light output over long periods of time. Precision Optical Performance lamps utilize the aluminum indium gallium phosphide (AlInGaP) technology. • Viewing angle: 15°, 23° and 30° These LED lamps are untinted. T-1¾ packages incorporating second generation optics producing well defined spatial radiation patterns at specific viewing cone angles. • Superior resistance to moisture These lamps are made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance performance in outdoor signal and sign application. The maximum LED junction temperature limit of +130° C enables high temperature operation in bright sunlight conditions. The epoxy contains uv inhibitor to reduce the effects of long term exposure to direct sunlight. Benefits • Superior performance for outdoor environment • Suitable for auto-insertion onto PC board • Well defined spatial radiation pattern • High brightness material • Available in Red and Amber – Red AlInGaP 626 nm – Amber AlInGaP 590 nm • Standoff and non-standoff Package Applications • Traffic management: – Traffic signals – Pedestrian signals – Work zone warning lights – Variable message signs • Solar Power signs • Commercial outdoor advertising – Signs – Marquee Package Dimension B: Standoff A: Non-standoff 5.00 ± 0.20 (0.197 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) d 8.71 ± 0.20 (0.343 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 2.35 (0.093) MAX. 0.70 (0.028) MAX. 31.60 MIN. (1.244) 1.50 ± 0.15 (0.059 ± 0.006) 31.60 MIN. (1.244) 0.70 (0.028) MAX. CATHODE LEAD CATHODE LEAD 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 1.00 MIN. (0.039) 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) Part Number Dimension ‘d’ HLMP-EG1H-xxxxx 12.30 ± 0.25mm HLMP-EL1H-xxxxx 12.64 ± 0.25mm HLMP-EG2H-xxxxx 12.10 ± 0.25mm HLMP-EL2H-xxxxx 12.14 ± 0.25mm HLMP-EG3H-xxxxx/HLMP-EL3H-xxxxx 12.10 ± 0.25mm Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.20 mm unless other specified. 3. Leads are mild steel with tin plating. 4. The epoxy meniscus is 1.21 mm max. 5. For identification of polarity after the leads are trimmed off, please refer to the illustration below: CATHODE 2 ANODE 1.00 MIN. (0.039) CATHODE FLAT 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) Device Selection Guide Luminous Intensity Iv (mcd) at 20 mA [1,2,5] Part Number Color and Dominant Wavelength λd (nm) Typ [3] Min Max Standoff Typical Viewing angle (°) [4] HLMP-EG1G-Y10DD Red 626 9300 21000 No 15 HLMP-EG1H-Y10DD Red 626 9300 21000 Yes HLMP-EL1G-Y10DD Amber 590 9300 21000 No HLMP-EL1H-Y10DD Amber 590 9300 21000 Yes HLMP-EG2G-XZ0DD Red 626 7200 16000 No HLMP-EG2H-XZ0DD Red 626 7200 16000 Yes HLMP-EL2G-WY0DD Amber 590 5500 12000 No HLMP-EL2H-WY0DD Amber 590 5500 12000 Yes HLMP-EG3G-VX0DD Red 626 4200 9300 No HLMP-EG3H-VX0DD Red 626 4200 9300 Yes HLMP-EL3G-VX0DD Amber 590 4200 9300 No HLMP-EL3H-VX0DD Amber 590 4200 9300 Yes Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each bin limit is ± 15% Part Numbering System HLMP – E x xx – x x x xx Packaging Option DD: Ammopack Color Bin Selection 0 : Full Distribution K: Color bin 2 and 4 L: Color bin 4 and 6 Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle and Lead Standoff 1G : 1H : 2G : 2H : 3G : 3H : 15 without standoff 15 with standoff 23 without standoff 23 with standoff 30 without standoff 30 with standoff Color G : Red L : Amber Package E: 5 mm Standard Round Note: Refer to AB 5337 for complete information on the part numbering system. 3 23 30 Absolute Maximum Ratings TJ = 25° C Parameter Red/ Amber Unit DC Forward Current [1] 50 mA Peak Forward Current 100 [2] mA Power Dissipation 120 mW LED Junction Temperature 130 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 4. 2. Duty Factor 30%, frequency 1 kHz. Electrical / Optical Characteristics TJ = 25° C Parameter Symbol Min. Typ. Max. Units Test Conditions Forward Voltage Red & Amber VF 1.8 2.1 2.4 V IF = 20 mA Reverse Voltage [3] Red & Amber VR 5 V IR = 100 μA Dominant Wavelength [1] Red Amber ld nm IF = 20 mA Peak Wavelength Red Amber lPEAK nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Thermal resistance RqJ-PIN °C/W LED junction to pin Luminous Efficacy [2] ηv lm/W Emitted Luminous Power/ Emitted Radiant Power nm/°C IF = 20 mA; +25° C ≤ TJ ≤ +100° C Red Amber Thermal coefficient of ld Red Amber 618.0 584.5 626.0 590.0 634 594 240 190 490 0.05 0.09 630.0 594.5 Notes: 1. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp. 2. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / ηV where Iv is the luminous intensity in candela and ηV is the luminous efficacy in lumens/ watt. 3. Indicates product final testing condition, long term reverse bias is not recommended. 4 1.0 100 Amber Red FORWARD CURRENT-mA RELATIVE INTENSITY 0.8 0.6 0.4 0.2 0.0 500 550 600 WAVELENGTH - nm 650 0 20 40 60 DC FORWARD CURRENT - mA 80 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES NORMALIZED INTENSITY Figure 5. Representative Radiation pattern for 15° Viewing Angle Lamp 5 0 1 2 FORWARD VOLTAGE-V 3 50 40 30 20 10 0 100 0 20 40 60 80 TA - AMBIENT TEMPERATURE - ºC 100 120 Figure 4. Maximum Forward Current vs Ambient Temperature NORMALIZED INTENSITY -90 20 60 Figure 3. Relative Intensity vs Forward Current 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 40 Figure 2. Forward Current vs Forward Voltage IF - FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 60 0 700 Figure 1. Relative Intensity vs Wavelength 80 90 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 6. Representative Radiation pattern for 23° Viewing Angle Lamp 90 10 RELATIVE LIGHT OUTPUT NORMALIZED AT TJ = 25° C NORMALIZED INTENSITY 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 7. Representative Radiation pattern for 30° Viewing Angle Lamp Amber Red FORWARD VOLTAGE SHIFT - V 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -40 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE Figure 9. Forward Voltage Shift vs Junction Temperature 6 120 1 0.1 -40 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE Figure 8. Relative Light Output vs Junction Temperature 0.6 0.5 Amber Red 140 120 140 Intensity Bin Limit Table (1.3 : 1 Iv Bin Ratio) Red Color Range Intensity (mcd) at 20 mA Bin Min Max Min Dom U 3200 4200 618.0 Max Dom X min Y Min X max Y max 630.0 0.6872 0.3126 0.6890 0.2943 0.6690 0.3149 0.7080 0.2920 V 4200 5500 W 5500 7200 Tolerance for each bin limit is ± 0.5 nm X 7200 9300 Y 9300 12000 Amber Color Range Z 12000 16000 1 16000 21000 Tolerance for each bin limit is ± 15% Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 584.5 587.0 0.5420 0.4580 0.5530 0.4400 0.5370 0.4550 0.5570 0.4420 2 587.0 589.5 0.5570 0.4420 0.5670 0.4250 0.5530 0.4400 0.5720 0.4270 0.5720 0.4270 0.5820 0.4110 0.5670 0.4250 0.5870 0.4130 0.5870 0.4130 0.5950 0.3980 0.5820 0.4110 0.6000 0.3990 VF Bin Table (V at 20 mA) Bin ID Min Max VD 1.8 2.0 VA 2.0 2.2 VB 2.2 2.4 4 589.5 592.0 6 592.0 594.5 Tolerance for each bin limit is ± 0.5 nm Tolerance for each bin limit is ± 0.05 V Note: All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information. Avago Color Bin on CIE 1931 Chromaticity Diagram 0.480 0.460 0.440 0.420 1 Amber 2 4 6 Y 0.400 0.380 0.360 0.340 0.320 Red 0.300 0.280 0.500 7 0.550 0.600 0.650 X 0.700 0.750 0.800 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260°C and the solder contact time does not exceeding 5sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED Configuration Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59 mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering Manual Solder [1, 2] Dipping Pre-heat temperature 105 °C Max. - Preheat time 60 sec Max - Peak temperature 260 °C Max. 260 °C Max. Dwell time 5 sec Max. 5 sec Max Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 8 Anode Note: Electrical InGaN connection Device between bottom surface of LED die and the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. Note: In order to further assist customer in designing jig accurately that fit Avago Technologies’ product, 3D model of the product is available upon request. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED 260 °C Max TEMPERATURE (°C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) 105 °C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) 60sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing 6.35 ±1.30 0.250 ±0.051 12.70 ±1.00 0.500 ±0.039 CATHODE 20.5 ±1.00 0.8070 ±0.0394 9.125 ±0.625 0.3595 ±0.0245 18.00 ±0.50 0.7085 ±0.0195 12.70 ±0.30 0.500 ±0.012 0.70 ±0.20 0.0275 ±0.0075 A A VIEW A-A Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff 9 4.00 ±0.20 TYP. ø 0.1575 ±0.0075 Packaging Box for Ammo Packs Note: The dimension for ammo pack is applicable for the device with standoff and without standoff. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin 10 Lamps Baby Label RoHS Compliant e3 max temp 260C DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) (ii) Color bin incorporate with VF Bin BIN: 2 VB VB: VF bin “VB” 2: Color bin 2 only DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. AV02-3139EN - April 3, 2014