HLMP-EL55-HJKDD

Data Sheet HLMP-EL55/EG55 T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Description Features These precision optical performance AlInGaP LEDs provide superior light output for excellent readability in sunlight and are extremely reliable. AlInGaP LED technology provides extremely stable light output over long periods of time. Precision optical performance lamps use the aluminum indium gallium phosphide (AlInGaP) technology.  These LED lamps are tinted, diffused, T-1¾ packages incorporating second-generation optics producing well-defined radiation patterns at specific viewing cone angles. The high maximum LED junction temperature limit of +130°C enables high temperature operation in bright sunlight conditions. These lamps are available in two package options to give the designer flexibility with device mounting.       Applications   Benefits     Viewing angles match traffic management sign requirements Colors meet automotive specifications Superior performance in outdoor environments Suitable for autoinsertion onto PC boards Broadcom Well-defined and smooth spatial radiation patterns Wide viewing angle Tinted diffused lamp High luminous output Colors: – 590-nm Amber – 626-nm Red High operating temperature: TJLED = +130°C Superior resistance to moisture  Traffic management: – Variable message signs – Traffic management signs Commercial indoor/outdoor advertising: – Signs – Marquees – Passenger information Automotive: – Exterior and interior lights AV02-1541EN July 16, 2020 HLMP-EL55/EG55 Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Device Selection Guide for AlInGaP Part Number Color and Dominant Wavelength d (nm) Typ.a HLMP-EL55-GK0DD Amber 590 HLMP-EL55-LP0xx HLMP-EG55-GK0DD Luminous Intensity Iv (mcd) at Luminous Intensity Iv (mcd) at 20 mA Min.b, c 20 mA Max.b, c 140 400 Amber 590 400 1150 Red 626 140 400 HLMP-EG55-HJ0xx Red 626 180 310 HLMP-EG55-JK0xx Red 626 240 400 a. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. b. The luminous intensity is measured on the mechanical axis of the lamp package. c. The optical axis is closely aligned with the package mechanical axis. Broadcom AV02-1541EN 2 HLMP-EL55/EG55 Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Package Dimensions 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008 1.14 ± 0.20 (0.045 ± 0.008) 2.35 (0.093) MAX. 31.60 (1.244) MIN. 0.70 (0.028) MAX. CATHODE LEAD 1.00 MIN. (0.039) CATHODE FLAT 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) NOTE: 1. All dimensions are in millimeters (inches). 2. Tapers shown at the top of the leads (bottom of the lamp package) indicate an epoxy meniscus that may extend about 1 mm (0.40 in.) down the leads. 3. Recommended PC board hole diameters: Lamp package without stand-offs: flush mounting at base of the lamp package = 1.143/1.067 (0.044/0.042). Broadcom AV02-1541EN 3 HLMP-EL55/EG55 Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Absolute Maximum Ratings at TA = 25°C Parameter Value DC Forward Currenta, b, c 50 mA Peak Pulsed Forward Currentb, c 100 mA Average Forward 30 mA Currentc Reverse Voltage (IR = 100 µA) 5V LED Junction Temperature 130°C Operating Temperature –40°C to +100°C Storage Temperature –40°C to +100°C a. Derate linearly as shown in Figure 4. b. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. c. Contact your Broadcom® sales representative about operating currents below 10 mA. Electrical/Optical Characteristics at TA = 25°C Parameter Forward Voltage Symbol Min. Typ. Max. VF Amber (d = 590 nm) — 2.02 2.4 Red (d = 626 nm) — 1.90 2.4 5 20 — Reverse Voltage VR Peak Wavelength PEAK Units Test Conditions V IF = 20 mA V IR = 100 µA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Amber (d = 590 nm) — 592 — Red (d = 626 nm) — 635 — 1/2 — 17 — nm Wavelength Width at Spectral Distribution 1/2 Power Point at IF = 20 mA Speed of Response s — 20 — ns Exponential Time Constant, e-t/s Capacitance C — 40 — pF VF = 0, f = 1 MHz RJ-PIN — 240 — °C/W LED Junction-to-Cathode Lead lm/W Emitted Luminous Power/Emitted Radiant Power Spectral Halfwidth Thermal Resistance Luminous Efficacy a v Amber (d = 590 nm) — 480 — Red (d = 626 nm) — 150 — a. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/v, where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. Broadcom AV02-1541EN 4 HLMP-EL55/EG55 Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Part Numbering System H L M P - x1 x2 x3 x4 - x5 x6 x7 x8 x9 Code Description Option x1 Package Type E 5mm AlInGaP Round x2 Color G Red 626 nm L Amber 590 nm x3 x4 Viewing Angle and Lead Stand-off 55 55° without lead stand-off x5 Minimum Intensity Bin Refer to Intensity Bin Limits (CAT) table x6 Maximum Intensity Bin x7 Color Bin Option x8 x9 Packing Option 0 Full distribution 00 Bulk packaging DD Ammopack Bin Information Intensity Bin Limits (mcd at 20 mA) Bin Name Min. Max. Bin Name Min. Max. G 140 180 1 584.5 587.0 H 180 240 2 587.0 589.5 J 240 310 4 589.5 592.0 K 310 400 6 592.0 594.5 L 400 520 M 520 680 N 680 880 P 880 1150 Tolerance for each bin limit is ± 15%. Broadcom Amber Color Bin Limits (nm at 20 mA) Tolerance for each bin limit is ± 0.5 nm. NOTE: Bin categories are established for classification of products. Products may not be available in all bin categories. AV02-1541EN 5 HLMP-EL55/EG55 Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Figure 1: Relative Intensity vs. Peak Wavelength 1 RELATIVE INTENSITY 0.9 0.8 AMBER 0.7 RED 0.6 0.5 0.4 0.3 0.2 0.1 0 500 550 600 650 700 WAVELENGTH - nm Figure 2: Forward Current vs. Forward Voltage 100 50 2.5 70 IF – FORWARD CURRENT – mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 80 FORWARD CURRENT – mA Figure 4: Maximum Forward Current vs. Ambient Temperature. Derating based on TJMAX = 130°C. 3.0 90 2.0 60 RED 50 40 1.5 AMBER 30 1.0 20 10 0 1.0 Figure 3: Relative Luminous Intensity vs. Forward Current 0.5 2.5 1.5 2.0 VF – FORWARD VOLTAGE – V 3.0 0 0 20 40 IF – DC FORWARD CURRENT – mA 60 40 RTJA = 585 C/W 30 RTJA = 780 C/W 20 10 0 0 40 80 20 60 100 TA – AMBIENT TEMPERATURE – C Figure 5: Representative Spatial Radiation Pattern for 55° Viewing Angle Lamps 100 90 RELATIVE INTENSITY – % 80 70 60 50 40 30 20 10 0 -100 Broadcom -80 -60 -40 -20 0 20 40 T – ANGULAR DISPLACEMENT – DEGREES 60 80 100 AV02-1541EN 6 HLMP-EL55/EG55 Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Precautions Lead Forming    The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. For better control, use the proper tool to precisely form and cut the leads to the applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into the LED package. Perform this action for the hand solder operation, because the excess lead length also acts as small heat sink. Soldering and Handling   Take care during the PCB assembly and soldering process to prevent damage to the LED component. LED component may be effectively hand soldered to the PCB; however, do this only under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source (soldering iron's tip) to the body is 1.59 mm. 1.59 mm Soldering the LED using a soldering iron tip closer than 1.59 mm might damage the LED.   Apply ESD precautions on the soldering station and personnel to prevent ESD damage to the LED component, which is ESD sensitive. Refer to Broadcom application note AN 1142 for details. Use a soldering iron used with a grounded tip to ensure that electrostatic charge is properly grounded. The following table shows the recommended soldering condition. Broadcom Wave Solderinga, b Manual Solder Dipping Pre-heat temperature 105°C max. — Preheat time 60 seconds max. — Peak temperature 250°C max. 260°C max. Dwell time 3 seconds max. 5 seconds max. a. The preceding conditions refer to measurement with a thermocouple mounted at the bottom of the PCB. b. Use only bottom preheaters to reduce thermal stress experienced by the LED.  Set and maintain wave soldering parameters according to the recommended temperature and dwell time. Perform daily checks on the soldering profile to ensure that it always conforms to the recommended soldering conditions. NOTE: 1. PCBs with different sizes and designs (component density) have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if the same wave soldering setting is used. So, recalibrate the soldering profile again before loading a new type of PCB. 2. The Broadcom high brightness LEDs use high-efficiency LED dies with single wire bond as shown in the following figure. Take extra precautions during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceed 3 seconds. Overstressing the LED during the soldering process might cause premature failure to the LED due to delamination. AV02-1541EN 7 HLMP-EL55/EG55 Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps LED Configuration   If PCB board contains both through-hole (TH) LED and other surface mount components, solder the surface mount components on the top side of the PCB. If surface mount must be on the bottom side, solder these components using reflow soldering prior to insertion the TH LED. The following table shows the recommended PC board plated through-holes (PTH) size for LED component leads. CATHODE LED Component Lead Size AllnGaP Device NOTE: The electrical connection between the bottom surface of the LED die and the lead frame is achieved through conductive paste.   Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Use nonmetal material because it absorbs less heat during wave soldering process. At elevated temperatures, LED is more susceptible to mechanical stress. Therefore, allow the PCB to cool down to room temperature prior to handling, which includes the removal of the alignment fixture or pallet. Diagonal Plated Through-Hole Diameter 0.45 × 0.45 mm (0.018 0.636 mm × 0.018 in.) (0.025 in.) 0.98 to 1.08 mm (0.039 to 0.043 in.) 0.50 × 0.50 mm (0.020 0.707 mm × 0.020 in.) (0.028 in.) 1.05 to 1.15 mm (0.041 to 0.045 in.)  Oversizing the PTH can lead to a twisted LED after clinching. On the other hand, undersizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high-brightness TH LED lamps. Figure 6: Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 100 50 PREHEAT 0 Broadcom 10 20 30 40 60 50 TIME (SECONDS) 70 80 90 100 AV02-1541EN 8 HLMP-EL55/EG55 Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Ammo Pack Drawing 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) CATHODE 20.50 ± 1.00 (0.807 ± 0.039) 9.125 ± 0.625 (0.3593 ± 0.0246) 18.00 ± 0.50 (0.7087 ± 0.0197) A 12.70 ± 0.30 (0.50 ± 0.0118) 0.70 ± 0.20 (0.0276 ± 0.0079) A Ø 4.00 ± 0.20 TYP. (0.1575 ± 0.008) VIEW A–A ALL DIMENSIONS IN MILLIMETERS (INCHES). NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF. Broadcom AV02-1541EN 9 HLMP-EL55/EG55 Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Packaging Box for Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A + GO AVA OGIES NOL ECH E D ANO T E HOD CAT – ANODE LEAD LEAVES THE BOX FIRST. C BEL R LA THE MO NOTE: THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF. Broadcom AV02-1541EN 10 HLMP-EL55/EG55 Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Packaging Label (i) Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Broadcom AV02-1541EN 11 HLMP-EL55/EG55 Data Sheet T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps Acronyms and Definition BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin OR (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) Broadcom BIN: 2VB 2: Color bin 2 only VB: VF bin “VB” AV02-1541EN 12 Disclaimer Broadcom products and software are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical devices or applications. The customer is solely responsible, and waives all rights to make claims against Broadcom or its suppliers, for all loss, damage, expense, or liability in connection with such use. Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries, and/or the EU. Copyright © 2014–2021 Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Inc. and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.