HLMP-FW66-MN0DD

Agilent HLMP-FWxx 5mm Extra Bright Flat Top InGaN White LED Lamps. Data Sheet Features • High luminous white emission • Flat top • Standoff or non-standoff leads • Superior resistance to moisture HLMP-FW66, HLMP-FW67 Description These high intensity white LED lamps are based on InGaN material technology. A blue LED die is coated by phosphor to produce white. The typical resulting color is described by the coordinates x = 0.31, y = 0.31 using the 1931 CIE Chromaticity Diagram. These flat top lamps are untinted, non-diffused, and incorporate precise optics which produce well-defined spatial radiation patterns at specific viewing cone angle. Applications • Electronic signs and signals • Small area illumination • Legend backlighting • General purpose indicators Benefit • Reduced power consumption, higher reliability, and increased optical/mechanical design flexibility compared to incandescent bulbs and other alternative white light sources. Caution: Devices are Class 1 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions Package Dimension B Package Dimension A 5.00±0.20 [ 0.197±0.008 ] 5.00±0.20 [ 0.197±0.008 ] 7.00±0.20 [ 0.278±0.008 ] 11.02±0.25 [ 0.434±0.010 ] 1.14±0.20 [ 0.045±0.008 ] 1.14±0.20 [ 0.045±0.008 ] 31.60 MIN. [ 1.244 ] 31.60 MIN. [ 1.244 ] CATHODE LEAD CATHODE LEAD 1.00 MIN. [ 0.038 ] 0.50±0.10 SQ. TYP. [ 0.020±0.004 ] 5.72±0.20 [ 0.225±0.008 ] CATHODE FLAT 2.54±0.38 [ 0.100±0.015 ] 1.00 MIN. [ 0.038 ] 0.50±0.10 SQ. TYP. [ 0.020±0.004 ] 5.72±0.20 [ 0.225±0.008 ] CATHODE FLAT 2.54±0.38 [ 0.100±0.015 ] Part Numbering System H L M P - FW XX - X X X XX Mechanical Option 00: Bulk DD: Ammo Pack Straight Leads Color Bin Options 0: Full color bin distribution B: Color bin 2 & 3 only Maximum Intensity Bin 0: No maximum intensity bin limit Others: Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle and Standoff Option 66: Flat top without standoff 67: Flat top with standoff 2 Notes: 1. All dimensions are in millimeters /inches. 2. Epoxy meniscus may extend about 1mm (0.040") down the leads. 3. If heat-sinking application is required, the terminal for heat sink is anode. Device Selection Guide Intensity (mcd) at 20 MA Part Number Typical Viewing Angle, 2θ½ (Degree) Min. Max. Standoff Package Dimension HLMP-FW66-LP0xx 85 400 1150 No A HLMP-FW66-MN0xx 85 520 880 No A HLMP-FW66-MNBxx 85 520 880 No A HLMP-FW66-MQ0xx 85 520 1500 No A HLMP-FW66-NP0xx 85 680 1150 No A HLMP-FW66-NPBxx 85 680 1150 No A HLMP-FW67-LP0xx 85 400 1150 Yes B HLMP-FW67-MN0xx 85 520 880 Yes B HLMP-FW67-MNBxx 85 520 880 Yes B HLMP-FW67-MQ0xx 85 520 1500 Yes B HLMP-FW67-NP0xx 85 680 1150 Yes B HLMP-FW67-NPBxx 85 680 1150 Yes B Notes: 1. Tolerance for luminous intensity measurement is ± 15% 2. The luminous intensity is measured on the mechanical axis of the lamp package. 3. The optical axis is closely aligned with the package mechanical axis. 4. 2θ1/2 is the off-axis angle where the luminous intensity is ½ the on axis intensity. 5. Part numbers in BOLD are recommended for new designs. Absolute Maximum Rating at TA = 25oC Parameters Value Unit 30 mA 100 mA Power dissipation 105 mW LED junction temperature 110 o C Operating temperature range -40 to +85 o C Storage temperature range -40 to +100 o C DC forward current [1] Peak pulsed forward current [2] Notes: 1. Derate linearly as shown in figure 2. 2. Duty factor 10%, frequency 1KHz 3 Electrical/Optical Characteristics TA = 25oC Parameters Symbol Forward voltage Reverse Voltage Min VF [1] VR Thermal resistance Chromaticity Coordinates [2] Capacitance Typ Max Units Test Condition 3.2 4.0 V IF = 20 mA V IR = 10 µA o LED Junction to anode lead 5.0 RθJ-PIN 240 X Y 0.31 0.31 IF = 20 mA C 70 VF=0, f=1MHz C/W Notes: 1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA 2. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 0.6 0.4 0.2 480 580 680 WAVELENGTH - nm 0.015 5mA 0.010 10mA 0.005 0.000 20mA -0.005 30mA 0.000 0.005 0.010 X-COORDINATES 0.015 Figure 4. Chromaticity shift vs. Current *Note: (x,y) values @ 20mA reference to (0,0) IF - FORWARD CURRENT - mA Y-COORDINATES 15 10 5 0 20 40 60 80 100 AMBIENT TEMPERATURE - ˚C 30 1mA 0.020 4 RθJ-A = 780˚C/W 20 Figure 2. Forward Current vs. Ambient Temperature. 0.025 -0.010 -0.005 RθJ-A = 585˚C/W 25 0 780 Figure 1. Relative Intensity vs. Wavelength 30 25 20 15 10 5 0 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 VF - FORWARD VOLTAGE - VOLTS Figure 5. Forward Current vs. Forward Voltage. RELATIVE LUMINOUS INTENSITY 0.8 0.0 380 1.5 35 IF - FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY 1.0 1.2 0.9 0.6 0.3 0 0 10 20 FORWARD CURRENT - mA Figure 3. Relative Intensity versus DC Forward Current 30 Intensity Bin Limit Table RELATIVE INTENSITY 1.0 Intensity (mcd) at 20 mA 0.5 0.0 -90 -60 -30 0 30 60 90 ANGULAR REPLACEMENT - DEGREE Bin Min Max L 400 520 M 520 680 N 680 880 P 880 1150 Q 1150 1500 Figure 6. Spatial Radiation Pattern Tolerance for each bin limit is ± 15% Color Bin Limit Table Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram Rank Limits (Chromaticity Coordinates) 1 X 0.330 0.330 0.356 0.361 Y 0.360 0.318 0.351 0.385 X 0.287 0.296 0.330 0.330 Y 0.295 0.276 0.318 0.339 X 0.264 0.280 0.296 0.283 Y 0.267 0.248 0.276 0.305 X 0.283 0.287 0.330 0.330 Y 0.305 0.295 0.339 0.360 0.40 3 4 Tolerance for each bin limit is ± 0.01 Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Agilent representative for information on currently available bins. 5 0.35 Y-COORDINATE 2 4 1 2 0.30 BLACK BODY CURVE 3 0.25 0.20 0.26 0.30 0.34 X-COORDINATE 0.38 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Condition: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering condition: • Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through holes size for LED component leads. Manual Solder Wave Soldering Dipping − Pre-heat temperature 105 °C Max. Preheat time 30 sec Max − Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max LED component ead size Diagonal Plated through hole diameter 0.457 x 0.457mm (0.018 x 0.018inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508mm (0.020 x 0.020inch) 0.718 mm (0.028 inch) 1.049 to 1.150mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. Recommended Wave Soldering Profile LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 200 TEMPERATURE - ˚C BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 150 FLUXING CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150 C (100 C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 100 50 30 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 0 10 20 30 40 50 TIME - SECONDS 60 70 80 90 100 www.agilent.com/ semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2004-2005 Agilent Technologies, Inc. Obsoletes 5989-3734EN October 20, 2005 5989-4118EN