HLMP-HB57

HLMP-HD55, HLMP-HM57, HLMP-HB57 Precision Optical Performance Red, Green and Blue 5 mm Standard Oval LEDs Data Sheet Description These  Precision  Optical  Performance  Oval  LEDs  are  specifically designed for full color/video and passenger  information signs. The oval shaped radiation pattern and  high luminous intensity ensure these devices are excellent  for wide field of view outdoor applications where a wide  viewing  angle  and  readability  in  sunlight  are  essential.  These lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the  sign. High efficiency LED material is used in these lamps:  higher performance Aluminum Indium Gallium Phosphide  (AlInGaP II) for red color, Indium Gallium Nitride (InGaN)  for blue and green. Each lamp is made with an advance  optical grade epoxy offering superior high temperature  and high moisture resistance in outdoor applications.  The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct  sunlight. Features •  Well defined spatial radiation pattern •  High brightness material •  Available in red, green and blue color  Red AlInGaP 630 nm      Green InGaN 525 nm      Blue InGaN 470 nm •  Tinted and diffused             Benefits •  Viewing angle designed for wide field of view applications •  Superior performance for outdoor environments Applications •  Full color signs •  Commercial outdoor advertising Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions A 11.90 ± 0.50 (0.469 ± 0.019) 1.50 ± 0.15 (0.059 ± 0.006) 0.70 MAX. (0.028) 5.20 ± 0.25 (0.204 ± 0.010) CATHODE LEAD (SEE NOTE A) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) NOTE: MEASURED AT BASE OF LENS. 3.80 ± 0.25 (0.150 ± 0.010) 2.54 ± 0.25 (0.10 ± 0.010) 1.0 MAX. (0.039) 7.00 ± 0.25 (0.275 ± 0.010) 1.00 MIN. (0.039) 24.00 MIN. (0.945) B 11.80 ± 0.50 (0.465 ± 0.019) 1.50 ± 0.15 (0.059 ± 0.006) 0.70 MAX. (0.028) 5.20 ± 0.50 (0.205 ± 0.020) CATHODE LEAD (SEE NOTE A) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 2.54 ± 0.25 (0.10 ± 0.010) 1.0 MAX. (0.039) 6.85 ± 0.25 (0.270 ± 0.010) 1.00 MIN. (0.039) 24.00 MIN. (0.945) NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. FOR InGaN BLUE AND GREEN (PACKAGE B), IF HEAT-SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE. Device Selection Guide Part Number HLMP-HD55-NR0xx  HLMP-HB57-KN0xx  HLMP-HB57-LMCxx  HLMP-HB57-LP0xx  HLMP-HM57-SV0xx  HLMP-HM57-RSCxx  HLMP-HM57-RU0xx  Color Red  Blue  Blue  Blue  Green  Green  Green  Typical Dominant Wavelength ld (nm) 630  470  470  470  525  525  525  Luminous Intensity Iv (mcd) at 20 mA Minimum Maximum 680  310  400  400  1900  1500  1500  1900  880  680  1150  5500  2500  4200  Package Lens Type Tinted, Diffused  Tinted, Diffused  Tinted, Diffused  Tinted, Diffused  Tinted, Diffused  Tinted, Diffused  Tinted, Diffused  Dimension A  B  B  B  B  B  B  Notes: 1.  Tolerance for luminous intensity measurement is ±15%. 2.  The luminous intensity is measured on the mechanical axis of the lamp package. 3.  The optical axis is closely aligned with the package mechanical axis. 4.  The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp. 5.  LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED with unaided  eyes. 2 Part Numbering System HLMP - x x 5x - x x x xx                       Mechanical Option 00: Bulk DD: Ammo Pack ZZ: Flexi-Bin; Ammo Pack Color Bin Option 0: Full Color Bin Distribution C: Color Bin 3 & 4 Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Color B: Blue 470 nm D: Red 630 nm M: Green 525 nm Package H: 5 mm Standard Oval Note: Please refer to AB 5337 for complete information about part numbering system. Absolute Maximum Rating at TA = 25oC Parameters DC Forward Current[1]  Peak Pulsed Forward Current   Power Dissipation  LED Junction Temperature  Operating Temperature Range  Storage Temperature Range  Notes: 1.  Derate linearly as shown in Figures 2 and 7. 2.  Duty factor 10%, frequency 1 KHz. 3.  Duty factor 30%, frequency 1 KHz. Blue and Green 30  100[2]  116  130  -40 to +85  -40 to +100  Red 50  100[3]    120  130  -40 to 100    -40 to 120  Unit mA  mA  mW  °C  °C  °C    3 Electrical/Optical Characteristics TA = 25°C Parameters Forward Voltage  Red  Green  Blue  Reverse Voltage  Red  Green, Blue  Capacitance  Red  Green  Blue  Thermal Resistance[1]  Dominant Wavelength[2,3]  Red  Green  Blue  Symbol VF        VR      C        RqJ-PIN  ld        lPEAK        Dl1/2        hv          jV      he        Min.   2.0  2.8  2.8    5.0  5.0              622  520  460                                        Value Typ.   2.20  3.30  3.20          40  65  64 240    630  525  470  639  516  464    17  32  23    155  520  75   1300  3000  600 30  50  10   Max.   2.40  3.85  3.85          Units V    Test Condition IF = 20 mA         V      pF  IR = 100 µA  IR = 10 µA VF = 0, f = 1 MHz          634  540  480                            °C/W  nm    LED Junction-to-Pin IF = 20 mA         Peak Wavelength  Red  Green  Blue  Spectral Half Width  Red  Green  Blue  Luminous Efficacy[4]  Red  Green  Blue  Luminous Flux  Red  Green  Blue  Luminous Efficiency [5]  Red  Green  Blue  nm        nm        lm/W        mlm  Peak of Wavelength of Spectral   Distribution at IF = 20 mA      Wavelength Width at Spectral Distribution 1/2 Power Point at  IF = 20 mA    Emitted Luminous  Power/Emitted Radiant Power    IF = 20 mA      lm/W    Luminous Flux/Electrical Power  IF = 20 mA  Notes: 1.  For AlInGaP Red, the thermal resistance applied to LED junction to cathode lead. For InGaN Blue and Green, the thermal resistance applied to  LED junction to anode lead. 2.  The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp. 3.  Tolerance for each color bin limit is ± 0.5 nm. 4.  The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is  the luminous efficacy in lumens/watt. 5.  he = jV / IF  x VF , where jV  is the emitted luminous flux, IF  is electrical forward current and VF  is the forward voltage. 4 AlInGaP Red IF MAX. – MAXIMUM FORWARD CURRENT – mA 60 50 40 30 20 10 0 0 20 40 60 80 100 TA – AMBIENT TEMPERATURE – °C Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. ambient temperature. Figure 3. Forward current vs. forward voltage. Figure 4. Relative luminous intensity vs. forward current. InGaN Blue and Green 35 IF – MAXIMUM FORWARD CURRENT – mA 30 25 20 15 10 5 0 0 20 40 60 80 100 TA – AMBIENT TEMPERATURE – °C Figure 5. Relative intensity vs. wavelength. Figure 6. Forward current vs. forward voltage. Figure 7. Maximum forward current vs. ambient temperature. 5 Figure 8. Relative intensity vs. forward current. Figure 9. Relative dominant wavelength vs. DC forward current. 1.0 NORMALIZED INTENSITY 0.5 0 0 30 60 90 120 150 180 ANGULAR DISPLACEMENT – DEGREES Figure 10. Spatial radiation pattern – major axis. 1.0 NORMALIZED INTENSITY 0.5 0 0 30 60 90 120 150 180 ANGULAR DISPLACEMENT – DEGREES Figure 11. Spatial radiation pattern – minor axis. 6 Intensity Bin Limit Table Bin K  L  M  N  P  Q  R  S  T  U  V  Blue Color Bin Table Bin 1    2    3    4    5    Intensity (mcd) at 20 mA Min Max 310  400  520  680  880  1150  1500  1900  2500  3200  4200  400  520  680  880  1150  1500  1900  2500  3200  4200  5500  Min. Dom 460.0    464.0    468.0    472.0    476.0    Max. Dom 464.0    468.0    472.0    476.0    480.0    Xmin 0.1440  0.1818  0.1374  0.1766  0.1291  0.1699  0.1187  0.1616  0.1063  0.1517  Ymin 0.0297  0.0904  0.0374  0.0966  0.0495  0.1062  0.0671  0.1209  0.0945  0.1423  Xmax 0.1766  0.1374  0.1699  0.1291  0.1616  0.1187  0.1517  0.1063  0.1397  0.0913  Ymax 0.0966 0.0374 0.1062 0.0495 0.1209 0.0671 0.1423 0.0945 0.1728 0.1327 Tolerance for each bin limit is ± 0.5 nm. Tolerance for each bin limit is ± 15%. Green Color Bin Table Bin 1    2    3    4    5    Min. Dom 520.0    524.0    528.0    532.0    536.0    Max. Dom 524.0    528.0    532.0    536.0    540.0    Xmin 0.0743  0.1650  0.1060  0.1856  0.1387  0.2068  0.1702  0.2273  0.2003  0.2469  Ymin 0.8338  0.6586  0.8292  0.6556  0.8148  0.6463  0.7965  0.6344  0.7764  0.6213  Xmax 0.1856  0.1060  0.2068  0.1387  0.2273  0.1702  0.2469  0.2003  0.2659  0.2296  Ymax 0.6556 0.8292 0.6463 0.8148 0.6344 0.7965 0.6213 0.7764 0.6070 0.7543 Tolerance for each bin limit is ± 0.5 nm. Red Color Range Min. Dom 622    Max. Dom 634    Xmin 0.6904  0.6726  Ymin 0.3094  0.3106  Xmax 0.6945  0.7135  Ymax 0.2888 0.2865 Tolerance for each bin limit is ± 0.5 nm. 7 Avago Color Bin on CIE 1931 Diagram 1.000 0.800 Green 1 23 45 0.600 Y 0.400 Red 0.200 5 4 3 2 1 Blue 0.000 0.000 0.100 0.200 0.300 0.400 X 0.500 0.600 0.700 0.800 Relative Light Output vs. Junction Temperature 10 RELATIVE LIGHT OUTPUT (NORMALIZED at TJ = 25°C) GREEN 1 RED BLUE 0.1 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE - °C 100 120 8 Precautions: Lead Forming: •  The leads of an LED lamp may be preformed or cut to  length prior to insertion and soldering on PC board. •  For better control, it is recommended to use proper  tool to precisely form and cut the leads to applicable  length rather than doing it manually. •  If manual lead cutting is necessary, cut the leads after  the  soldering  process.  The  solder  connection  forms  a  mechanical  ground  which  prevents  mechanical  stress  due  to  lead  cutting  from  traveling  into  LED  package. This is highly recommended for hand solder  operation, as the excess lead length also acts as small  heat sink. Note:  1.  PCB with different size and design (component density) will have  different heat mass (heat capacity). This might cause a change in  temperature  experienced  by  the  board  if  same  wave  soldering  setting is used. So, it is recommended to re-calibrate the soldering  profile again before loading a new type of PCB. 2.  Avago Technologies’ high brightness LED are using high efficiency  LED die with single wire bond as shown below. Customer is advised  to  take  extra  precaution  during  wave  soldering  to  ensure  that  the maximum wave temperature does not exceed 250°C and the  solder  contact  time  does  not  exceeding  3sec.  Over-stressing  the  LED during soldering process might cause premature failure to the  LED due to delamination. Avago Technologies LED configuration Soldering and Handling: •  Care must be taken during PCB assembly and soldering  process to prevent damage to the LED component.  •  LED  component  may  be  effectively  hand  soldered  to  PCB.  However,  it  is  only  recommended  under  unavoidable  circumstances  such  as  rework.  The  closest  manual  soldering  distance  of  the  soldering  heat  source  (soldering  iron’s  tip)  to  the  body  is  1.59mm.  Soldering  the  LED  using  soldering  iron  tip  closer than 1.59mm might damage the LED. 1.59mm CATHODE ANODE AlInGaP Device   InGaN Device Note: Electrical connection between bottom surface of LED die and  the lead frame is achieved through conductive paste. •  Any  alignment  fixture  that  is  being  applied  during  wave  soldering  should  be  loosely  fitted  and  should  not apply weight or force on LED. Non metal material  is  recommended  as  it  will  absorb  less  heat  during  wave soldering process. •  At elevated temperature, LED is more susceptible to  mechanical stress. Therefore, PCB must allowed to cool  down to room temperature prior to handling, which  includes removal of alignment fixture or pallet. •  If PCB board contains both through hole (TH) LED and  other surface mount components, it is recommended  that surface mount components be soldered on the  top side of the PCB. If surface mount need to be on the  bottom  side,  these  components  should  be  soldered  using reflow soldering prior to insertion the TH LED. •  Recommended PC board plated through holes (PTH)  size for LED component leads. LED component lead size Diagonal Plated through hole diameter •  ESD  precaution  must  be  properly  applied  on  the  soldering  station  and  personnel  to  prevent  ESD  damage to the LED component that is ESD sensitive.  Do refer to Avago application note AN 1142 for details.  The soldering iron used should have grounded tip to  ensure electrostatic charge is properly grounded. •  Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature Preheat time Peak temperature Dwell time 105 °C Max. 60 sec Max 250 °C Max. 3 sec Max. 260 °C Max. 5 sec Max Note:  1)  Above  conditions  refers  to  measurement  with  thermocouple  mounted at the bottom of PCB. 2)  It  is  recommended  to  use  only  bottom  preheaters  in  order  to  reduce thermal stress experienced by LED. 0.45 x 0.45 mm (0.018x 0.018 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.636 mm (0.025 inch) 0.707 mm (0.028 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) •  Wave  soldering  parameters  must  be  set  and  maintained  according  to  the  recommended  temperature  and  dwell  time.  Customer  is  advised  to  perform  daily  check  on  the  soldering  profile  to  ensure that it is always conforming to recommended  soldering conditions. 9 •  Over-sizing  the  PTH  can  lead  to  twisted  LED  after  clinching. On the other hand under sizing the PTH can  cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED TURBULENT WAVE 250 LAMINAR WAVE HOT AIR KNIFE Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux 200 Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 150 100 50 PREHEAT 0 10 20 30 40 50 60 TIME (MINUTES) 70 80 90 100 Ammo Packs Drawing 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) CATHODE 20.5 ± 1.00 (0.8071 ± 0.0394) 9.125 ± 0.625 (0.3593 ± 0.0246) 18.00 ± 0.50 (0.7087 ± 0.0197) 12.70 ± 0.30 (0.50 ± 0.0118) 0.70 ± 0.20 (0.0276 ± 0.0079) ALL DIMENSIONS IN MILLIMETERS (INCHES). A VIEW A–A A ∅ 4.00 ± 0.20 TYP. (0.1575 ± 0.008) Note: The ammo-packs drawing is applicable for packaging option –DD & –ZZ and regardless of standoff or non-standoff. 10 Packaging Box for Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A + AN OD E TEC ANODE LEAD LEAVES THE BOX FIRST. O AG ES AV LOGI O HN CA TH OD E – C T MO HE RL AB EL Note: For InGaN device, the ammo pack packaging box contains ESD logo. Packaging Label (i)  Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number (1T) Lot: Lot Number LPN (9D) MFG Date: Manufacturing Date (P) Customer Item: (V) Vendor ID STANDARD LABEL LS0002 RoHS Compliant e1 max temp 250C (Q) QTY: Quantity CAT: Intensity Bin BIN: Refer to below information REV: DeptID: Made In: Country of Origin 11 (ii) Avago Baby Label (Only available on bulk packaging) RoHS Compliant e1 max temp 250C PART #: Part Number LOT#: Lot Number MFG DATE: Manufacturing Date C/O: Country of Origin Customer P/N: Supplier Code: CAT: Intensity Bin BIN: Refer to below information DATECODE: Date Code QUANTITY: Packing Quantity Acronyms and Definition: BIN:  (i)  Color bin only or VF bin only   (Applicable for part number with color bins but without  VF bin OR part number with VF bins and no color bin) OR          (ii) Color bin incorporated with VF Bin   (Applicable  for  part  number  that  have  both  color  bin  and VF bin) Example: (i)  Color bin only or VF bin only   BIN: 2 (represent color bin 2 only)   BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin   BIN: 2VB         VB: VF bin “VB” 2:  Color bin 2 only DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0305EN AV02-0371EN - July 6, 2007