HLMP-HB61

HLMP-HD61, HLMP-HM61 and HLMP-HB61 Precision Optical Performance Red, Green and Blue 5mm Standard Oval LEDs Data Sheet Description These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. These lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. High efficiency LED material is used in these lamps: Aluminum Indium Gallium Phosphide (AlInGaP II) for red and Indium Gallium Nitride for blue and green. Each lamp is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. Features • Well defined spatial radiation pattern • High brightness material • Available in red, green and blue color. Red AlInGaP 630mm Green InGaN 525nm Blue InGaN 470nm • Superior resistance to moisture • Standoff package Applications • Full color signs • Commercial outdoor advertising. Package Dimensions 1.50 max. 0.059 max. 10.80±0.50 0.425±0.020 1.50±0.15 0.059±0.006 0.70 max. 0.028 Notes: 1. Measured at base of lens 0.50±0.10 sq. 0.020±0.004 3.80 0.150 5.20 0.205 cathode lead 7.01 0.276 24.00 min 0.945 min 2.54 0.10 1.00 min 0.039 Notes: All dimensions in millimeters (inches). For Blue and Green if heat-sinking application is required, the terminal for heat sink is anode. Caution: InGaN devices are Class 1C HBM ESD Sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Device Selection Guide Part Number HLMP-HD61-TXTZZ HLMP-HM61-Y30ZZ HLMP-HB61-QU0ZZ Color and Dominant Wavelength ld (nm) Typ Red 630 Green 525 Blue 470 Luminous Intensity lv(mcd) at 20 mA Min 800 1990 460 Luminous Intensity lv(mcd) at 20 mA Max 1990 5040 1150 Tolerance for each intensity limit is ± 15%. Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. Part Numbering System HLMP - H x 61 - x x x x x Packaging Option ZZ: Flexi Ammo-packs Color Bin Selection 0: Open distribution T: Red Color, Vf max =2.6V Maximum Intensity Bin 0: No maximum intensity limit Minimum Intensity Bin Refer to Device Selection Guide. Color B: Blue 470 D: Red 630 M: Green 525 Package H: 5mm Standard Oval 40˚ x 100˚� 2 Absolute Maximum Rating (TA = 25°C) Parameter DC Forward Current [1] Peak Forward Current Power Dissipation Reverse Voltage LED Junction Temperature Operating Temperature Range Storage Temperature Range Notes: 1. Derate linearly as shown in Figure 2 and Figure 8. 2. Duty Factor 30%, frequency 1KHz. 3. Duty Factor 10%, frequency 1KHz. Red 50 100[2] 130 5 (IR = 100 mA) 130 -40 to +100 -40 to +120 Blue and Green 30 100[3] 116 5 (IR = 10 mA) 110 -40 to +85 -40 to +100 Unit mA mA mW V °C °C °C Electrical / Optical Characteristics (TA = 25°C) Parameter Forward Voltage Red Green Blue Reverse Voltage Red Green & blue Dominant Wavelength Red Green Blue Peak Wavelength Red Green Blue Spectral Half width Red Green Blue Thermal Resistance, Luminous Efficacy [3] Red Green Blue Symbol VF Min. 2.0 2.8 2.8 5 5 622 520 460 Typ. 2.3 3.3 3.2 Max. 2.6[1] 3.8 3.8 Units V Test Conditions IF = 20 mA VR V IR = 100 mA IR = 10 mA IF = 20 mA lD 630 525 470 639 516 464 17 32 23 240 155 520 75 634 540 480 nm lPEAK nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Dl1/2 nm Wavelength Width at Spectral Distribution ½ Power Point at ,IF = 20 mA LED Junction-to-pin Emitted Luminous Power/Emitted Radiant Power RqJ-PIN ηV °C/W lm/W Notes: 1. For option –xxTxx, the VF maximum is 2.6V, refer to Vf bin table 2. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp 3. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is the luminous efficacy in lumens/watt. 4. Forward voltage allowable tolerance is ± 0.05V. 5. For AlInGaP Red, thermal resistance applied to LED junction to cathode lead. For InGaN blue and Green, thermal resistance applied to LED junction to anode lead. 3 AlInGaP Red I F MAX . - MAXIMUM FORWARD CURRENT - mA 1.0 60 50 40 30 20 10 0 RELATIVE INTENSITY 0.5 0 550 600 650 700 WAVELENGTH – nm Figure 1. Relative Intensity vs Wavelength 0 20 40 60 80 TA - AMBIENT TEMPERATURE - o C 100 Figure 2. Maximum Forward Current vs Ambient Temperature 50 IF - FORWARD CURRENT - mA 40 30 20 10 0 2.5 2.0 1.5 1.0 0.5 0 RELATIVE INTENSITY (NORMALIZED AT 20 mA) 0 0.5 1.0 1.5 2.0 2.5 V F - FORWARD VOLTAGE - V 3.0 0 10 30 20 40 FORWARD CURRENT - mA 50 Figure 3. Forward Current vs Forward Voltage Figure 4. Relative Intensity vsForward Current 4 InGaN Blue and Green 1.00 0.80 RELATIVE INTENSITY BLUE 0.60 0.40 0.20 0 350 35 30 FORWARD CURRENT - mA 650 GREEN 25 20 15 10 5 0 0 1 3 2 FORWARD VOLTAGE - V 4 400 450 500 550 600 WAVELENGTH - nm Figure 5. Relative Intensity vs Wavelength Figure 6. Forward Current vs Forward Voltage 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 DC FORWARD CURRENT - mA IF - MAXIMUM FORWARD CURRENT - mA 1.6 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 35 30 25 20 15 10 5 0 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE - oC Figure 8. Maximum Forward Current vs Ambient Temperature Figure 7. Relative Intensity vs Forward Current 5 RELATIVE DOMINANT WAVELENGHT SHIFT (NORMALIZED AT 20mA) 10 8 6 4 2 0 -2 -4 0 5 10 15 20 25 FORWARD CURRENT - mA 30 BLUE GREEN Figure 9. Relative dominant wavelength vs Forward Current 1 NORMALIZED INTENSITY 0.8 0.6 0.4 0.2 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES Figure 10. Radiation pattern-Major Axis 1 NORMALIZED INTENSITY 0.8 0.6 0.4 0.2 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 11. Radiation pattern-Minor Axis 6 Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio) Intensity (mcd) at 20 mA Bin Q R S T U V W X Y Z 1 2 3 Min 460 550 660 800 960 1150 1380 1660 1990 2400 2900 3500 4200 Max 550 660 800 960 1150 1380 1660 1990 2400 2900 3500 4200 5040 Green Color Bin Table Bin 1 2 3 4 5 Min Dom 520.0 524.0 528.0 532.0 536.0 Max Dom 524.0 528.0 532.0 536.0 540.0 Xmin 0.0743 0.1650 0.1060 0.1856 0.1387 0.2068 0.1702 0.2273 0.2003 0.2469 Ymin 0.8338 0.6586 0.8292 0.6556 0.8148 0.6463 0.7965 0.6344 0.7764 0.6213 Xmax 0.1856 0.1060 0.2068 0.1387 0.2273 0.1702 0.2469 0.2003 0.2659 0.2296 Ymax 0.6556 0.8292 0.6463 0.8148 0.6344 0.7965 0.6213 0.7764 0.6070 0.7543 Tolerance for each bin limit is ± 0.5nm Blue Color Bin Table Bin Min Dom 460.0 464.0 468.0 472.0 476.0 Tolerance for each bin limit is ± 15% Max Dom 464.0 468.0 472.0 476.0 480.0 Xmin 0.1440 0.1818 0.1374 0.1766 0.1291 0.1699 0.1187 0.1616 0.1063 0.1517 Ymin 0.0297 0.0904 0.0374 0.0966 0.0495 0.1062 0.0671 0.1209 0.0945 0.1423 Xmax 0.1766 0.1374 0.1699 0.1291 0.1616 0.1187 0.1517 0.1063 0.1397 0.0913 Ymax 0.0966 0.0374 0.1062 0.0495 0.1209 0.0671 0.1423 0.0945 0.1728 0.1327 VF bin Table (V at 20mA) Bin ID VA VB VC 1 Min. 2.0 2.2 2.4 Max. 2.2 2.4 2.6 2 3 4 5 Tolerance for each bin limit is ± 0.05 Red Color Range Min Dom 622 Max Dom 634 Xmin Ymin Xmax Ymax 0.2888 0.2865 0.6904 0.3094 0.6945 0.6726 0.3106 0.7135 Tolerance for each bin limit is ± 0.5nm Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information. Tolerance for each bin limit is ± 0.5 nm 7 Avago Color Bin on CIE 1931 Chromaticity Diagram 1.000 0.800 Green 1 23 4 5 0.600 Y 0.400 Red 0.200 5 4 3 2 0.000 0.000 Blue 1 0.200 0.300 0.400 X 0.500 0.600 0.700 0.800 0.100 Relative Light Output vs. Junction Temperature 1.6 1.4 RELATIVE LIGHT OUTPUT (NORMALIZED at TJ = 25˚C) 1.2 1 0.8 0.6 0.4 0.2 0 -40 Red Blue Green -20 0 20 40 60 80 100 T J - JUNCTION TEMPERATURE - ˚C 8 Precautions Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • For better control, it is recommended to use proper tool to precisely form and cut the leads to length rather that doing it manually. Soldering Condition: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED closer than 1.59mm might damage the LED. 1.59mm Avago Technologies LED configuration AlInGaP Device InGaN Device Note: Electrical connection between bottom surface of LED die and the leadframe material through conductive paste or solder. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. Note: In order to further assist customer in designing jig accurately that fit Avago Technologies’ product, 3D model of the product is available upon request. • Recommended soldering condition: Wave Soldering Pre-heat temperature Preheat time Peak temperature Dwell time 105 °C Max. 30 sec Max 250 °C Max. 3 sec Max. Manual Solder Dipping 260 °C Max. 5 sec Max • At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, PCB must be allowed to cool down to room temperature prior to handling, which includes removal of jigs, fixtures or pallet. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through holes size for LED component leads. LED component Lead size 0.457 x 0.457mm (0.018 x 0.018inch) 0.508 x 0.508mm (0.020 x 0.020inch) Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated through hole diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150mm (0.041 to 0.045 inch) • Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to daily check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again prior to loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding recommendation of 250 ° C. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Note: Refer to application note AN1027 for more information on soldering LED components. • Over sizing of plated through hole can lead to twisting or improper LED placement during auto insertion. Under sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching 9 TURBULENT WAVE 250 LAMINAR WAVE HOT AIR KNIFE 200 TEMPERATURE - °C TOP SIDE OF PC BOARD BOTTOM SIDE OF PC BOARD 150 FLUXING 100 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C ± 5°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA LEAD FREE SOLDER 96.5%Sn; 3.0%Ag; 0.5% Cu NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. 40 50 TIME - SECONDS 60 70 80 90 100 50 30 PREHEAT 10 20 30 0 10 Ammo Packs Drawing Note: The ammo-packs drawing is applicable for packaging option –DD & - ZZ and regardless standoff or non-standoff Packaging Box for Ammo Packs Note: For InGaN device, the ammo pack packaging box contain ESD logo DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0418EN AV02-0339EN - April 19, 2007 12