HLMP-HD61, HLMP-HM61 and HLMP-HB61
Precision Optical Performance Red, Green and Blue
5mm Standard Oval LEDs
Data Sheet
Description
Features
These Precision Optical Performance Oval LEDs are
specifically designed for full color/video and passenger
information signs. The oval shaped radiation pattern
and high luminous intensity ensure that these devices
are excellent for wide field of view outdoor applications
where a wide viewing angle and readability in sunlight
are essential. These lamps have very smooth, matched
radiation patterns ensuring consistent color mixing in full
color applications, message uniformity across the viewing angle of the sign. High efficiency LED material is used
in these lamps: Aluminum Indium Gallium Phosphide
(AlInGaP II) for red and Indium Gallium Nitride for blue
and green. Each lamp is made with an advanced optical
grade epoxy offering superior high temperature and high
moisture resistance in outdoor applications.
• Well defined spatial radiation pattern
• High brightness material
• Available in red, green and blue color.
Red AlInGaP 630mm
Green InGaN 525nm
Blue InGaN 470nm
• Superior resistance to moisture
• Standoff package
• Tinted and diffused
The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct
sunlight.
Applications
• Full color signs
• Commercial outdoor advertising.
Package Dimensions
1.02 max.
0.040 max.
10.80±0.50
0.425±0.020
Notes:
1. Measured at base of lens
1.50±0.15
0.059±0.006
3.80
0.150
0.50±0.10 sq.
0.020±0.004
0.70 max.
0.028
5.20
0.205
cathode lead
7.01
0.276
24.00 min
0.945 min
2.54
0.10
1.00 min
0.039
Notes:
All dimensions in millimeters (inches).
For Blue and Green if heat-sinking application is required, the terminal for heat sink is anode.
Caution: InGaN devices are Class 1C HBM ESD Sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Device Selection Guide
Part Number
Color and Dominant
Wavelength ld (nm) Typ
Luminous Intensity
lv(mcd) at 20 mA Min
Luminous Intensity
lv(mcd) at 20 mA Max
HLMP-HD61-TXTZZ
Red 630
800
1990
HLMP-HM61-Y30ZZ
Green 525
1990
5040
HLMP-HB61-QU0ZZ
Blue 470
460
1150
Tolerance for each intensity limit is ± 15%.
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
Part Numbering System
HLMP - H x 61 - x x x x x
Packaging Option
ZZ: Flexi Ammo-packs
Color Bin Selection
0: Open distribution
T: Red Color, Vf max =2.6V
Maximum Intensity Bin
0: No maximum intensity limit
Minimum Intensity Bin
Refer to Device Selection Guide.
Color
B: Blue 470
D: Red 630
M: Green 525
Package
H: 5mm Standard Oval 40˚ x 100˚�
Please refer to AB 5337 for complete information about part numbering system.
Absolute Maximum Rating (TA = 25°C)
Parameter
Red
Blue and Green
Unit
DC Forward Current [1]
50
30
mA
Peak Forward Current
100[2]
100[3]
mA
Power Dissipation
130
116
mW
Reverse Voltage
5 (IR = 100 mA)
5 (IR = 10 mA)
V
LED Junction Temperature
130
110
°C
Operating Temperature Range
-40 to +100
-40 to +85
°C
Storage Temperature Range
-40 to +100
-40 to +100
°C
Notes:
1. Derate linearly as shown in Figure 2 and Figure 8.
2. Duty Factor 30%, frequency 1KHz.
3. Duty Factor 10%, frequency 1KHz.
Electrical / Optical Characteristics (TA = 25°C)
Parameter
Symbol
Forward Voltage
Red
Green
Blue
VF
Reverse Voltage
Red
Green & blue
VR
Dominant Wavelength [2]
Red
Green
Blue
lD
Peak Wavelength
Red
Green
Blue
lPEAK
Spectral Half width
Red
Green
Blue
Dl1/2
Thermal Resistance [3]
RqJ-PIN
Luminous Efficacy [4]
hV
Luminous Flux
Red
Green
Blue
jV
Luminous Efficiency [5]
Red
Green
Blue
he
Red
Green
Blue
Min.
Typ.
Max.
2.0
2.8
2.8
2.3
3.3
3.2
2.6[1]
3.8
3.8
Test Conditions
V
IF = 20 mA
V
5
5
622
520
460
Units
630
525
470
634
540
480
nm
IR = 100 mA
IR = 10 mA
IF = 20 mA
639
516
464
nm
Peak of Wavelength of Spectral Distribution at IF = 20
mA
17
32
23
nm
Wavelength Width at Spectral Distribution ½ Power
Point at ,IF = 20 mA
240
°C/W
LED Junction-to-pin
155
520
75
lm/W
Emitted Luminous Power/Emitted Radiant Power
1300
3000
600
mlm
IF = 20 mA
30
50
10
lm/W
Luminous Flux/Electrical Power
IF = 20 mA
Notes:
1. For option –xxTxx, the VF maximum is 2.6V, refer to Vf bin table
2. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp
3. For AlInGaP Red, thermal resistance applied to LED junction to cathode lead. For InGaN blue and Green, thermal resistance applied to LED
junction to anode lead.
4. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV
is the luminous efficacy in lumens/watt.
5. he = jV / IF x VF , where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
6. Forward voltage allowable tolerance is ± 0.05V.
RELATIVE INTENSITY
1.0
0.5
0
550
700
60
50
40
30
20
10
0
0
20
40
60
80
T A - AMBIENT TEMPERATURE - °C
IF
600
650
WAVELENGTH – nm
MAX . - MAXIMUM FORWARD CURRENT - mA
AlInGaP Red
Figure 1. Relative Intensity vs Wavelength
Figure 2. Maximum Forward Current vs Ambient Temperature
2.5
RELATIVE INTENSITY
(NORMALIZED AT 20 mA)
IF - FORWARD CURRENT - mA
50
40
30
20
10
0
0
0.5
VF
1.0
1.5
2.0
2.5
- FORWARD VOLTAGE - V
Figure 3. Forward Current vs Forward Voltage
100
3.0
2.0
1.5
1.0
0.5
0
0
10
30
20
40
FORWARD CURRENT - mA
Figure 4. Relative Intensity vsForward Current
50
InGaN Blue and Green
0.80
FORWARD CURRENT - mA
35
GREEN
BLUE
0.60
0.40
0.20
0
350
400
450
500
550
WAVELENGTH - nm
600
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
Figure 5. Relative Intensity vs Wavelength
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
5
10
15
20
DC FORWARD CURRENT - mA
Figure 7. Relative Intensity vs Forward Current
25
20
15
10
5
0
1
3
2
FORWARD VOLTAGE - V
4
Figure 6. Forward Current vs Forward Voltage
1.6
0
30
0
650
25
30
IF - MAXIMUM FORWARD CURRENT - mA
RELATIVE INTENSITY
1.00
35
30
25
20
15
10
5
0
0
20
40
60
80
TA - AMBIENT TEMPERATURE - °C
Figure 8. Maximum Forward Current vs Ambient Temperature
100
RELATIVE DOMINANT WAVELENGHT SHIFT
(NORMALIZED AT 20mA)
10
8
6
4
GREEN
2
BLUE
0
-2
-4
0
5
10
15
20
FORWARD CURRENT - mA
25
30
Figure 9. Relative dominant wavelength vs Forward Current
NORMALIZED INTENSITY
1
0.8
0.6
0.4
0.2
0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
Figure 10. Radiation pattern-Major Axis
NORMALIZED INTENSITY
1
0.8
0.6
0.4
0.2
0
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREES
Figure 11. Radiation pattern-Minor Axis
90
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
Green Color Bin Table
Intensity (mcd) at 20 mA
Bin
Min
Max
Q
460
550
R
550
660
S
660
800
T
800
960
U
960
1150
V
1150
1380
W
1380
1660
X
1660
1990
Y
1990
2400
Z
2400
2900
1
2900
3500
2
3500
4200
3
4200
5040
Bin
Min
Dom
Max
Dom
1
520.0
524.0
2
524.0
528.0
3
528.0
532.0
4
532.0
536.0
5
536.0
540.0
Bin ID
Min.
Max.
VA
2.0
2.2
VB
2.2
2.4
VC
2.4
2.6
634
0.1856
0.6556
0.1650
0.6586
0.1060
0.8292
0.1060
0.8292
0.2068
0.6463
0.1856
0.6556
0.1387
0.8148
0.1387
0.8148
0.2273
0.6344
0.2068
0.6463
0.1702
0.7965
0.1702
0.7965
0.2469
0.6213
0.2273
0.6344
0.2003
0.7764
0.2003
0.7764
0.2659
0.6070
0.2469
0.6213
0.2296
0.7543
Xmin
Ymin
Xmax
Ymax
1
460.0
464.0
0.1440
0.0297
0.1766
0.0966
0.1818
0.0904
0.1374
0.0374
0.1374
0.0374
0.1699
0.1062
0.1766
0.0966
0.1291
0.0495
0.1291
0.0495
0.1616
0.1209
0.1699
0.1062
0.1187
0.0671
0.1187
0.0671
0.1517
0.1423
0.1616
0.1209
0.1063
0.0945
0.1063
0.0945
0.1397
0.1728
0.1517
0.1423
0.0913
0.1327
5
Xmax
Ymax
0.6904 0.3094 0.6945
0.2888
0.6726 0.3106 0.7135
0.2865
Tolerance for each bin limit is ± 0.5 nm
0.8338
Max
Dom
3
Red Color Range
622
0.0743
Min
Dom
4
Ymin
Ymax
Bin
2
Tolerance for each bin limit is ± 0.05
Xmin
Xmax
Blue Color Bin Table
VF bin Table (V at 20mA)
Max Dom
Ymin
Tolerance for each bin limit is ± 0.5nm
Tolerance for each bin limit is ± 15%
Min Dom
Xmin
464.0
468.0
472.0
476.0
468.0
472.0
476.0
480.0
Tolerance for each bin limit is ± 0.5nm
Note:
1. All bin categories are established for classification of products.
Products may not be available in all bin categories. Please contact
your Avago representative for further information.
Avago Color Bin on CIE 1931 Chromaticity Diagram
1.000
0.800
1 2 3
4
Green
5
Y
0.600
0.400
Red
0.200
5
4
3
2
0.000
0.000
0.100
Blue
1
0.200
0.300
0.400
0.500
0.600
X
Relative Light Output vs. Junction Temperature
RELATIVE LIGHT OUTPUT
(NORMALIZED at TJ = 25˚C)
10
GREEN
1
BLUE
RED
0.1
-40
-20
0
20
40
60
80
TJ - JUNCTION TEMPERATURE - ˚C
100
120
0.700
0.800
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due
to delamination.
Avago Technologies LED configuration
Note: Electrical connection between bottom surface of LED die and
Soldering and Handling:
• Care must be taken during PCB assembly and soldering process to prevent damage to the LED component.
• LED component may be effectively hand soldered to
PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual
soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the
LED using soldering iron tip closer than 1.59mm might
damage the LED.
1.59mm
• ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage
to the LED component that is ESD sensitive. Do refer
to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure
electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and maintained according to the recommended temperature
and dwell time. Customer is advised to perform daily
check on the soldering profile to ensure that it is always conforming to recommended soldering conditions.
Note:
CATHODE
AlInGaP Device
ANODE
InGaN Device
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during
wave soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED
lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
TEMPERATURE (°C)
Flux: Rosin flux
200
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
150
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
100
50
PREHEAT
0
10
20
30
40
50
60
TIME (MINUTES)
70
80
90
100
Ammo Packs Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
20.5 ± 1.00
(0.8071 ± 0.0394)
9.125 ± 0.625
(0.3593 ± 0.0246)
18.00 ± 0.50
(0.7087 ± 0.0197)
A
12.70 ± 0.30
(0.50 ± 0.0118)
0.70 ± 0.20
(0.0276 ± 0.0079)
A
∅
4.00 ± 0.20 TYP.
(0.1575 ± 0.008)
VIEW A–A
ALL DIMENSIONS IN MILLIMETERS (INCHES).
Note: The ammo-packs drawing is applicable for packaging option –DD & –ZZ and regardless of standoff or non-standoff.
10
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
A
+
O
AG ES
AV LOGI
O
HN
E
OD
AN
TEC
E
OD
TH
CA
–
ANODE LEAD LEAVES
THE BOX FIRST.
C
EL
AB
RL
HE
T
MO
Note: For InGaN device, the ammo pack packaging box contains ESD logo.
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 250C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
Lamps Baby Label
11
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but without VF bin OR part number with VF bins and no color
bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin
and VF bin)
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED
OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION,
MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO
OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes AV01-0418EN
AV02-0339EN - September 2, 2008
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