HLMP-HD55, HLMP-HM57, HLMP-HB57
Precision Optical Performance Red, Green and Blue
5 mm Standard Oval LEDs
Data Sheet
Description
Features
These Precision Optical Performance Oval LEDs are
specifically designed for full color/video and passenger
information signs. The oval shaped radiation pattern and
high luminous intensity ensure these devices are excellent
for wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
These lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the
sign. High efficiency LED material is used in these lamps:
higher performance Aluminum Indium Gallium Phosphide
(AlInGaP II) for red color, Indium Gallium Nitride (InGaN)
for blue and green. Each lamp is made with an advance
optical grade epoxy offering superior high temperature
and high moisture resistance in outdoor applications.
• Well defined spatial radiation pattern
• High brightness material
• Available in red, green and blue color
Red AlInGaP 630 nm
Green InGaN 525 nm
Blue InGaN 470 nm
• Tinted and diffused
The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct
sunlight.
Applications
Benefits
• Viewing angle designed for wide field of view applications
• Superior performance for outdoor environments
• Full color signs
• Commercial outdoor advertising
Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
A
11.90 ± 0.50
(0.469 ± 0.019)
NOTE: MEASURED AT BASE OF LENS.
1.50 ± 0.15
(0.059 ± 0.006)
3.80 ± 0.25
(0.150 ± 0.010)
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
0.70 MAX.
(0.028)
2.54 ± 0.25
(0.10 ± 0.010)
5.20 ± 0.25
(0.204 ± 0.010)
CATHODE LEAD
(SEE NOTE A)
1.0 MAX.
(0.039)
1.00 MIN.
(0.039)
24.00 MIN.
(0.945)
7.00 ± 0.25
(0.275 ± 0.010)
B
11.80 ± 0.50
(0.465 ± 0.019)
1.50 ± 0.15
(0.059 ± 0.006)
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
0.70 MAX.
(0.028)
2.54 ± 0.25
(0.10 ± 0.010)
5.20 ± 0.50
(0.205 ± 0.020)
1.0 MAX.
(0.039)
CATHODE LEAD
(SEE NOTE A)
1.00 MIN.
(0.039)
24.00 MIN.
(0.945)
6.85 ± 0.25
(0.270 ± 0.010)
NOTES:
1. DIMENSIONS IN MILLIMETERS (INCHES).
2. FOR InGaN BLUE AND GREEN (PACKAGE B), IF HEAT-SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE.
Device Selection Guide
Typical Dominant
Part Number
Color
Wavelength ld (nm)
Luminous Intensity Iv
(mcd) at 20 mA
Minimum
Maximum
Package
Lens Type
Dimension
HLMP-HD55-NR0xx
Red
630
680
1900
Tinted, Diffused
A
HLMP-HB57-KN0xx
Blue
470
310
880
Tinted, Diffused
B
HLMP-HB57-LMCxx
Blue
470
400
680
Tinted, Diffused
B
HLMP-HB57-LP0xx
Blue
470
400
1150
Tinted, Diffused
B
HLMP-HM57-SV0xx
Green
525
1900
5500
Tinted, Diffused
B
HLMP-HM57-RSCxx
Green
525
1500
2500
Tinted, Diffused
B
HLMP-HM57-RU0xx
Green
525
1500
4200
Tinted, Diffused
B
Notes:
1. Tolerance for luminous intensity measurement is ±15%.
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp.
5. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED with unaided
eyes.
Part Numbering System
HLMP - x x 5x - x x x xx
Mechanical Option
00: Bulk
DD: Ammo Pack
ZZ: Flexi-Bin; Ammo Pack
Color Bin Option
0: Full Color Bin Distribution
C: Color Bin 3 & 4
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Color
B: Blue 470 nm
D: Red 630 nm
M: Green 525 nm
Package
H: 5 mm Standard Oval
Note: Please refer to AB 5337 for complete information about part numbering system.
Absolute Maximum Rating at TA = 25oC
Parameters
Blue and Green
Red
Unit
DC Forward Current[1]
30
50
mA
Peak Pulsed Forward Current
100[2]
100[3]
mA
Power Dissipation
116
120
mW
LED Junction Temperature
130
130
°C
Operating Temperature Range
-40 to +85
- 40 to 100
°C
Storage Temperature Range
-40 to +100
-40 to 120
°C
Notes:
1. Derate linearly as shown in Figures 2 and 7.
2. Duty factor 10%, frequency 1 KHz.
3. Duty factor 30%, frequency 1 KHz.
Electrical/Optical Characteristics
TA = 25°C
Parameters
Symbol
Min.
Value
Typ.
Max.
Units
Test Condition
Forward Voltage
VF
V
IF = 20 mA
Red
2.0
2.20
2.40
Green
2.8
3.30
3.85
Blue
2.8
3.20
3.85
Reverse Voltage
VR
V
Red
5.0
Green, Blue
5.0
IR = 100 µA
IR = 10 µA
Capacitance
C
Red
40
Green
65
Blue
64
pF
VF = 0, f = 1 MHz
Thermal Resistance[1]
°C/W
LED Junction-to-Pin
RqJ-PIN
240
Dominant Wavelength[2,3]
ld
nm
IF = 20 mA
Red
622
630
634
Green
520
525
540
Blue
460
470
480
Peak Wavelength
lPEAK
nm
Red
639
Green
516
Blue
464
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Spectral Half Width
Dl1/2
nm
Wavelength Width at Spectral
Red
17
Distribution 1/2 Power Point at
Green
32
IF = 20 mA
Blue
23
Luminous Efficacy[4]
hv
lm/W
Red
155
Green
520
Blue
75
Luminous Flux
Red
jV
1300
Green
3000
Blue
600
Luminous Efficiency [5]
he
Red
Green
Blue
mlm
30
lm/W
50
10
Emitted Luminous
Power/Emitted Radiant Power
IF = 20 mA
Luminous Flux/Electrical Power
IF = 20 mA
Notes:
1. For AlInGaP Red, the thermal resistance applied to LED junction to cathode lead. For InGaN Blue and Green, the thermal resistance applied to
LED junction to anode lead.
2. The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp.
3. Tolerance for each color bin limit is ± 0.5 nm.
4. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is
the luminous efficacy in lumens/watt.
5. he = jV / IF x VF , where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
IF MAX. – MAXIMUM FORWARD CURRENT – mA
AlInGaP Red
60
50
40
30
20
10
0
0
20
40
60
80
100
TA – AMBIENT TEMPERATURE – °C
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. ambient temperature.
Figure 3. Forward current vs. forward voltage.
Figure 4. Relative luminous intensity vs. forward
current.
InGaN Blue and Green
IF – MAXIMUM FORWARD CURRENT – mA
35
30
25
20
15
10
5
0
0
20
40
60
80
TA – AMBIENT TEMPERATURE – °C
Figure 5. Relative intensity vs. wavelength.
Figure 6. Forward current vs. forward voltage.
Figure 7. Maximum forward current vs. ambient
temperature.
100
Figure 8. Relative intensity vs. forward current.
Figure 9. Relative dominant wavelength vs. DC forward current.
NORMALIZED INTENSITY
1.0
0.5
0
0
30
60
90
120
150
180
150
180
ANGULAR DISPLACEMENT – DEGREES
Figure 10. Spatial radiation pattern – major axis.
NORMALIZED INTENSITY
1.0
0.5
0
0
30
60
90
120
ANGULAR DISPLACEMENT – DEGREES
Figure 11. Spatial radiation pattern – minor axis.
Intensity Bin Limit Table
Blue Color Bin Table
Bin
Intensity (mcd) at 20 mA
Min
Max
Bin
Min. Dom
Max. Dom
Xmin
Ymin
Xmax
Ymax
1
460.0
464.0
0.1440
0.0297
0.1766
0.0966
K
L
M
N
P
Q
R
S
T
U
310
400
520
680
880
1150
1500
1900
2500
3200
400
520
680
880
1150
1500
1900
2500
3200
4200
0.1818
0.0904
0.1374
0.0374
2
V
4200
5500
0.1374
0.0374
0.1699
0.1062
464.0
468.0
0.1766
0.0966
0.1291
0.0495
3
0.1291
0.0495
0.1616
0.1209
468.0
472.0
0.1699
0.1062
0.1187
0.0671
4
0.1187
0.0671
0.1517
0.1423
472.0
476.0
0.1616
0.1209
0.1063
0.0945
5
0.1063
0.0945
0.1397
0.1728
0.1517
0.1423
0.0913
0.1327
476.0
480.0
Tolerance for each bin limit is ± 0.5 nm.
Tolerance for each bin limit is ± 15%.
Green Color Bin Table
Bin
Min. Dom
Max. Dom
Xmin
Ymin
Xmax
Ymax
1
520.0
524.0
0.0743
0.8338
0.1856
0.6556
0.1650
0.6586
0.1060
0.8292
2
0.1060
0.8292
0.2068
0.6463
524.0
528.0
0.1856
0.6556
0.1387
0.8148
3
0.1387
0.8148
0.2273
0.6344
0.2068
0.6463
0.1702
0.7965
4
528.0
532.0
0.1702
0.7965
0.2469
0.6213
532.0
536.0
0.2273
0.6344
0.2003
0.7764
5
0.2003
0.7764
0.2659
0.6070
0.2469
0.6213
0.2296
0.7543
536.0
540.0
Tolerance for each bin limit is ± 0.5 nm.
Red Color Range
Min. Dom
Max. Dom
Xmin
Ymin
Xmax
Ymax
622
634
0.6904
0.3094
0.6945
0.2888
0.6726
0.3106
0.7135
0.2865
Tolerance for each bin limit is ± 0.5 nm.
Avago Color Bin on CIE 1931 Diagram
1.000
0.800
Green
1 2 3
4 5
0.600
Y
0.400
Red
0.200
Blue
5
4
0.000
0.000
0.100
3
2
1
0.200
0.300
0.400
0.500
0.600
0.700
X
Relative Light Output vs. Junction Temperature
RELATIVE LIGHT OUTPUT
(NORMALIZED at TJ = 25°C)
10
GREEN
1
RED
0.1
-40
-20
0
BLUE
20
40
60
80
TJ - JUNCTION TEMPERATURE - °C
100
120
0.800
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms
a mechanical ground which prevents mechanical
stress due to lead cutting from traveling into LED
package. This is highly recommended for hand solder
operation, as the excess lead length also acts as small
heat sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that
the maximum wave temperature does not exceed 250°C and the
solder contact time does not exceeding 3sec. Over-stressing the
LED during soldering process might cause premature failure to the
LED due to delamination.
Avago Technologies LED configuration
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The
closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59mm. Soldering the LED using soldering iron tip
closer than 1.59mm might damage the LED.
1.59mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
CATHODE
AlInGaP Device
ANODE
InGaN Device
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
250
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
200
150
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
100
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
50
PREHEAT
0
10
20
30
40
50
60
TIME (MINUTES)
70
80
90
100
Ammo Packs Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
20.5 ± 1.00
(0.8071 ± 0.0394)
9.125 ± 0.625
(0.3593 ± 0.0246)
18.00 ± 0.50
(0.7087 ± 0.0197)
A
12.70 ± 0.30
(0.50 ± 0.0118)
0.70 ± 0.20
(0.0276 ± 0.0079)
A
∅
4.00 ± 0.20 TYP.
(0.1575 ± 0.008)
VIEW A–A
ALL DIMENSIONS IN MILLIMETERS (INCHES).
Note: The ammo-packs drawing is applicable for packaging option –DD & –ZZ and regardless of standoff or non-standoff.
10
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
A
+
O
AG ES
AV LOGI
O
HN
E
OD
AN
TEC
E
OD
TH
CA
–
ANODE LEAD LEAVES
THE BOX FIRST.
C
EL
AB
RL
HE
T
MO
Note: For InGaN device, the ammo pack packaging box contains ESD logo.
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1T) Lot: Lot Number
STANDARD LABEL LS0002
RoHS Compliant
e1 max temp 250C
(Q) QTY: Quantity
LPN
CAT: Intensity Bin
(9D) MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
REV:
(V) Vendor ID
DeptID:
(1P) Item: Part Number
Made In: Country of Origin
11
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e1 max temp 250C
PART #: Part Number
LOT#: Lot Number
MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
(Applicable for part number with color bins but without
VF bin OR part number with VF bins and no color bin)
OR
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
(ii) Color bin incorporated with VF Bin
BIN: 2VB
(Applicable for part number that have both color bin
and VF bin)
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR
FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE
CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0305EN
AV02-0371EN - July 6, 2007
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