HLMP-KA45-J0000

Data Sheet HLMP-KA45 T-1 (3-mm) High Intensity InGaN Lamp Description This Broadcom® blue LED is designed in an industry-standard T-1 package with clear and nondiffused optics. This lamp is ideal for use as indicators and for general-purpose lighting. Applications      Features      Popular T1 diameter package General-purpose leads Reliable and rugged Binned for color and intensity InGaN blue dice Status indicators Small message panel Running and decorative lights for commercial use Backlighting Consumer audio CAUTION! Devices are Class 1C HBM ESD sensitive per JEDEC Standard. Observe appropriate precautions during handling and processing. For additional details, refer to Application Note AN-1142. Broadcom AV02-0921EN June 22, 2021 HLMP-KA45 Data Sheet T-1 (3-mm) High Intensity InGaN Lamp Package Dimensions 1.14 (.045) 0.51 (.020) 3.43 (.135) 2.92 (.115) ‡ 2.79 (.110) 2.29 (.090) 24.1(.95) MIN. 1.52 (.060) 1.02 (.040) 0.65 (0.026) max. 3.17 (.125) 2.67 (.105) (0.022) 0.55 SQ. TYP. (0.016) 0.40 4.70 (.185) 4.19 (.165) 6.35 (.250) 5.58 (.220) NOTE: 1. All dimensions are in mm (in.). 2. An epoxy meniscus may extend about 1 mm (0.040 in.) down the leads. 3. For PCB hole recommendations, see Precautions. Device Selection Guide Color and Dominant Wavelength da (nm) Typ. Part Number Luminous IntensityIv (mcd) at Luminous Intensity Iv (mcd) at 20 mA Min.b, c 20 mA Max.b, c HLMP-KA45-E0000 Blue 470 85 — HLMP-KA45-J0000 Blue 470 240 — a. The dominant wavelength, d is derived from the CIE Chromaticity Diagram and represents the color of the lamp. b. The luminous intensity is measured on the mechanical axis of the lamp package. c. 2.The optical axis is closely aligned with the package mechanical axis. Absolute Maximum Ratings at TA = 25°C Parameter HLMP-KA45 (Blue) Units DC Forward Currenta 30 mA Peak Pulsed Forward Currentb 100 mA Power Dissipation 116 mW LED Junction Temperature 115 °C Operating Temperature Range –35 to +85 °C Storage Temperature Range –35 to +85 °C a. Derate linearly as shown in Figure 4. b. Duty factor = 10%, frequency = 1 kHz. Broadcom AV02-0921EN 2 HLMP-KA45 Data Sheet T-1 (3-mm) High Intensity InGaN Lamp Electrical /Optical Characteristics at TA = 25°C Parameter Symbol Min. Typ. Max. Units Forward Voltage VF 2.8 3.2 3.8 V IF = 20 mA Capacitance C — 40 — pF VF = 0, f = 1 MHz RJ-PIN — 465 — °C/W 21/2 — 50 — deg Dominant Wavelengthb d — 470 — nm IF = 20 mA Peak Wavelength P — 464 — nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Spectral Halfwidth 1/2 — 24 — nm Wavelength Width at Spectral Distribution ½ Power Point at IF = 20 mA Thermal Resistance Viewing Anglea Test Conditions LED Junction-to-Cathode Lead a. 21/2 is the off-axis angle where the luminous intensity is 1/2 the on axis intensity. b. The dominant wavelength, d, is derived from the Chromaticity Diagram and represents the color of the lamp. Part Numbering System H L M P - X1 X2 X3 X4 - X5 X6 X7 X8 X9 Code Description Option X1 Package Type K T-1 X2 Color A Blue X3 X4 Viewing Angle 45 55° X5 Minimum Intensity Bin See Intensity Bin Limits X6 Maximum Intensity Bin 0 Open binning (no max. IV bin limit) X7 Color Bin Selection 0 Full color bin range X8 X9 Packaging Option 00 Bulk Broadcom AV02-0921EN 3 HLMP-KA45 Data Sheet T-1 (3-mm) High Intensity InGaN Lamp Bin Information Intensity Bin Limits Color Bin Limits Intensity (mcd) at 20 mA Bin Min. Lambda (nm) Max. Color Cat Number Min. Max. Blue E 85 110 1 460.0 464.0 F 110 140 2 464.0 468.0 G 140 180 3 468.0 472.0 H 180 240 4 472.0 476.0 5 476.0 480.0 J 240 310 K 310 400 L 400 520 M 520 680 N 680 880 P 880 1150 Q 1150 1500 R 1500 1900 S 1900 2500 T 2500 3200 Tolerance for each bin limit is ± 0.5 nm. Mechanical Option Matrix Mechanical Option Code 00 NOTE: Tolerance for each bin limit is ± 15%. Broadcom Definition Bulk Packaging, minimum increment 500 pieces/bag All categories are established for classification of products. Products may not be available in all categories. For further clarification and information, contact your local Broadcom representative. AV02-0921EN 4 HLMP-KA45 Data Sheet T-1 (3-mm) High Intensity InGaN Lamp 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Figure 2: Forward Current vs. Forward Volatge 30 FORWARD CURRENT - mA RELATIVE INTENSITY Figure 1: Relative Intensity vs. Wavelength 20 15 10 5 380 430 480 530 580 WAVELENGTH - nm 630 0 680 Figure 3: Relative Luminous Intensity vs. Forward Current 1.4 35 1.2 30 1.0 0.8 0.6 0.4 0.2 0 0 1 2 FORWARD VOLTAGE - V 3 4 Figure 4: Maximum Forward Current vs. Ambient Temperature Based on Tjmax = 115°C FORWARD CURRENT – mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 25 25 RTJ-A = 780°C/W 20 15 10 5 0 5 10 15 20 25 30 IF – DC FORWARD CURRENT – mA 0 0 20 40 60 AMBIENT TEMPERATURE – °C 80 100 Figure 5: Radiation Pattern RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -75 -60 -45 -30 -15 0 15 30 45 60 75 ANGULAR DISPLACEMENT – DEGREES Broadcom 90 AV02-0921EN 5 HLMP-KA45 Data Sheet T-1 (3-mm) High Intensity InGaN Lamp Precautions Lead Forming     The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. If lead forming is required before soldering, take care to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. Make the tooling to precisely form and cut the leads to length rather than rely upon hand operation.    Soldering Conditions    Take care during the PCB assembly and soldering process to prevent damage to LED component. Ensure that the closest LED to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. The soldering conditions follow. Manual Solder Wave Soldering Dipping Pre-heat Temperature 105°C max. — Pre-heat Time 60s max. — Peak Temperature 250°C max. 260°C max. Dwell Time 3s max. 5s max.  Set and maintain the wave soldering parameter according to recommended temperature and dwell time in the solder wave. Periodically check on the soldering profile to ensure the soldering profile used always conforms to recommended soldering condition. If necessary, use the fixture to hold the LED component in proper orientation with respect to the PCB during the soldering process. Use proper handling to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. Pay special attention to board fabrication, solder masking, surface plating, and lead holes’ size and component orientation to assure solderability. The recommended PC board plated through hole sizes for LED component leads follow. Lead size (typ.) Plated ThroughHole Diameter 0.45 × 0.45 mm 0.636 mm (0.018 × 0.018 in.) (0.025 in.) 0.98 to 1.08 mm (0.039 to 0.043 in.) Dambar 0.65 mm shearoff area (0.026 in.) (max.) Lead size (typ.) 0.919 mm (0.036 in.) 0.50 × 0.50 mm 0.707 mm (0.020 × 0.020 in.) (0.028 in.) Dambar 0.70 mm shearoff area (0.028 in.) (max.) NOTE: Broadcom LED Component Lead Size Diagonal 1.05 to 1.15 mm (0.041 to 0.045 in.) 0.99 mm (0.039 in.) Refer to application note AN1027 for more information on soldering LED components. AV02-0921EN 6 HLMP-KA45 Data Sheet T-1 (3-mm) High Intensity InGaN Lamp Figure 6: Recommended Wave Soldering Profile Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead-free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin flux Solder bath temperature: 245 qC ± 5 qC (maximum peak temperature = 250 qC) TEMPERATURE (qC) 200 Dwell time: 1.5 sec – 3.0 sec (maximum = 3 sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before you exert mechanical force. 100 50 PREHEAT 0 Broadcom 10 20 30 40 50 60 TIME (SECONDS) 70 80 90 100 AV02-0921EN 7 HLMP-KA45 Data Sheet T-1 (3-mm) High Intensity InGaN Lamp Packing Label (i) Mother Label (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Color Bin DATECODE: Date Code Broadcom AV02-0921EN 8 Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries, and/or the EU. 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