HLMP-KB45-A0000

HLMP-DB25, HLMP-KB45 T-1¾ (5 mm), T-1 (3 mm) Blue LED Lamps Data Sheet Description Features These blue LEDs are designed in industry standard T-1 and T-1¾ package with clear and non diffused optics. They are also available in tape and reel, and ammo-pack option for ease of handling and use. •  Popular T-1¾ and T-1 diameter packages These blue lamps are ideal for use as indicators and for general purpose lighting. Blue lamps offer color differentiation as blue is attractive and not widely available. •  General purpose leads •  Reliable and rugged •  Available on tape and reel •  Binned for color and intensity Applications •  Status indicators •  Small message panel •  Running and decorative lights for commercial use Package Dimensions HLMP-KB45 HLMP-DB25 3.18 (0.125) 2.67 (0.105) 5.08 (0.200) 4.57 (0.180) 3.43 (0.135) 2.92 (0.115) 9.19 (0.352) 8.43 (0.332) 6.35 (0.250) 5.58 (0.220) 4.70 (0.185) 4.19 (0.165) 1.02 (0.040) NOM. 0.89 (0.035) 0.64 (0.025) 23.0 MIN. (0.90) 23.0 MIN. (0.90) 0.45 (0.018) SQUARE NOMINAL CATHODE 1.27 (0.050) NOM. 6.10 (0.240) 5.59 (0.220) CATHODE 2.54 (0.100) NOM. 1.27 (0.050) NOM. 0.45 (0.018) SQUARE NOM. 2.54 (0.100) NOM. NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. CAUTION: Devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Selection Guide Luminous Intensity Iv (mcd) Part Number Package Viewing Angle Min. Max. HLMP-KB45-A0000 T-1 40 30 – HLMP-DB25-B0000 T-1¾ 25 40 – Part Numbering System HLMP - x x xx - x x x xx Mechanical Option 00: Bulk Color Bin Options 0: Full Color Bin Distribution Maximum Iv Bin Options 0: Open (no max. limit) Minimum Iv Bin Options Please refer to the Iv Bin Table Viewing Angle 25: 25 degrees 45: 40 degrees Color Options B: Blue Package Options D: T-1¾ (5 mm) K: T-1 (3 mm) Absolute Maximum Ratings at TA = 25°C Parameter Blue Units Peak Forward Current 70 mA DC Current[1] 30 mA Reverse Voltage Not recommended for reverse bias Transient Forward Current[2] (10 µsec Pulse) 350 mA LED Junction Temperature 115 °C Operating Temperature –20 to +80 °C Storage Temperature –30 to +100 °C Wave Soldering Temperature [1.59 mm (0.063 in.) from Body] 250°C for 3 seconds Solder Dipping Temperature [1.59 mm (0.063 in.) from Body] 260°C for 5 seconds Notes: 1.  Derate linearly from 50°C as shown in Figure 6. 2.  The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that this device be operated at peak currents above the Absolute Maximum Peak Forward Current. 2 Optical Characteristics at TA = 25°C Part Number Luminous Intensity IV (mcd) @ IF = 20 mA Min. Color, Dominant Wavelength ld[1] (nm) Typ. Peak Wavelength lPEAK (nm) Typ. Viewing Angle 2q1/2[2] Degrees Typ. HLMP-DB25-B0000 40 470 464 25 HLMP-KB45-A0000 30 470 464 40 Notes: 1. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 2. q1/2 is the off-axis angle at which the luminous intensity is half of the axial luminous intensity. Electrical Characteristics at TA = 25°C Forward Voltage VF (Volts) @ IF = 20 mA Speed Response ts (ns) Capacitance C (pF), VF = 0, f = 1 MHz Thermal Resistance RqJ-PIN (°C/W) Junction to Cathode Lead Typ. Max. Typ. Typ. Typ. HLMP-DB25-B00xx 3.2 3.8 500 97 260 HLMP-KB45-A00xx 3.2 3.8 500 97 290 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 30 IF – FORWARD CURRENT – mA RELATIVE INTENSITY Part Number 430 480 530 580 WAVELENGTH - nm 630 5 0 1 2 3 VF – FORWARD VOLTAGE – V 4 Hz Hz HR RES REF ATE RATIO OF PEAK CURRENT TO TEMPERATURE DERATED DC CURRENT 100 300 Hz 80 1K 40 50 60 70 IP – PEAK FORWARD CURRENT – mA Hz 30 KHz 1.2 3K 1.4 10 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 10 10 Figure 3. Relative intensity vs. peak forward current (300 µs pulse width, 10 ms period) 3 15 Figure 2. Forward current vs. forward voltage 1.6 1.0 20 20 0 680 Figure 1. Relative intensity vs. wavelength 25 1 1.00E-06 1.00E-05 1.00E-04 1.00E-03 PULSE WIDTH (SECONDS) Figure 4. Maximum Tolerable Peak Current vs Pulse Width 1.00E-02 35 1.2 30 IF – FORWARD CURRENT – mA DC RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 IF – DC FORWARD CURRENT – mA 10° 30° 20 15 10 5 0 0 10 20 30 50° 0° 1.0 .6 60° .4 70° .2 80° 90° 10° 20° 30° 40° 50° 60° 70° 80° 90° 100° Figure 7. Relative luminous intensity vs. angular displacement for HLMP-DB25 20° 30° 40° 50° 10° 0° 1.0 .8 .6 60° 70° 80° 90° .4 .2 10° 20° 30° 40° 50° 60° 70° 80° 90° 100° Figure 8. Relative luminous intensity vs. angular displacement for HLMP-KB45 4 50 60 70 80 90 Figure 6. Maximum DC forward current vs. ambient temperature. Derating based on TJ max. = 115°C .8 40° 40 TA – AMBIENT TEMPERATURE – °C Figure 5. Relative luminous intensity vs. forward current 20° 25 Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts. Intensity Bin Limits Color Bin Limits (nm at 20 mA) Intensity Range (mcd) Min Max Blue nm @ 20 mA Bin ID Bin ID Min. A 30 40 1 460.0 464.0 B 40 50 C 50 65 2 464.0 468.0 D 65 85 E 85 110 F 110 140 G 140 180 H 180 240 J 240 310 K 310 400 L 400 520 M 520 680 N 680 880 P 880 1150 Q 1150 1500 R 1500 1900 S 1900 2500 T 2500 3200 U 3200 4200 3 468.0 472.0 4 472.0 476.0 5 476.0 480.0 Tolerance for each bin limit is ±0.5 nm. Tolerance for each bin limit is ± 15%. Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. 5 Max. Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59 mm • ESD precaution must be properly applied on the soldering station and by personnel to prevent ESD damage to the LED component that is ESD sensitive. For details, refer to Avago application note AN 1142. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering conditions: Wave Soldering[1],[2] Manual Solder Dipping Pre-heat Temperature 105°C Max. – Pre-heat Time 60 sec Max. – Peak Temperature 250°C Max. 260°C Max. Dwell Time 3 sec Max. 5 sec Max. Notes: 1. These conditions refer to measurement with a thermocouple mounted at the bottom of PCB. 2. To reduce thermal stress experienced by LED, it is recommended that you use only bottom preheaters. 6 • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED Component Lead Size Diagonal Plated Through Hole Diameter Lead size (Typical) 0.45 x 0.45 mm (0.018 x 0.018 in) 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) Dambar shearoff area (max) 0.65 mm (0.026 in) 0.919 mm (0.036 in) Lead size (Typical) 0.50 x 0.50 mm (0.020 x 0.020 in) 0.707 mm (0.028 in) Dambar shearoff area (max) 0.70 mm (0.028 in) 0.99 mm (0.039 in) 1.05 to 1.15 mm (0.041 to 0.045 in) • Over-sizing the PTH can lead to a twisted LED after it is clinched. On the other hand, undersizing the PTH can cause difficulty in inserting the TH LED. For more information about soldering and handling of TH LED lamps, refer to application note AN5334. Example of Wave Soldering Temperature Profile for TH LED 250 Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) 100 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 50 PREHEAT 0 10 20 30 Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) 40 50 60 TIME (SECONDS) 70 80 90 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C 7 (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Color Bin DATECODE: Date Code For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. Obsoletes 5989-3263EN AV02-2213EN - July 24, 2014