HLMP-LD15-MNTDD

HLMP-LD15, HLMP-LM15, HLMP-LB15 4mm Precision Optical Performance Red, Green and Blue Standard Oval LEDs Data Sheet Features Description These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. These lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. High efficiency LED material is used in these lamps: Aluminum Indium Gallium Phosphide (AlInGaP II) for red and Indium Gallium Nitride for blue and green. Each lamp is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. The package epoxy contains both UV-a and UV-b inhibitors to reduce the effects of long-term exposure to direct sunlight. • Well defined spatial radiation pattern • High brightness material • Available in red, green and blue color. - Red AlInGaP 630mm - Green InGaN 525nm - Blue InGaN 470nm • Superior resistance to moisture Benefits • Viewing angle designed for wide filed of view applications • Superior performance for outdoor environments Applications • Full color signs • Commercial outdoor advertising. Package Dimension 6.3±0.2 0.248±0.008 9.65±0.2 0.380±0.008 21.0 MIN. 0.827 1.0 MIN. 0.038 1.25±0.2 0.049±0.008 2.9±0.2 0.114±0.008 CATHODE LEAD 2.54±0.3 0.100±0.012 3.7±0.2 0.146±0.008 0.8 0.016 MAX. EPOXY MENISCUS 0.45±0.10 0.018±0.004 0.4±0.1 0.016±0.004 Notes: 1. Dimension in millimeters (inches). Caution: InGaN devices are Class I ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Device Selection Guide Luminous Intensity Iv (mcd) at 20 mA Part Number Color and Dominant Wavelength λd (nm) Typ. Min. Max Tinting Type HLMP-LD15-NRTxx Red 630 680 1900 Red HLMP-LM15-QT0xx Green 525 1150 3200 Green HLMP-LB15-KN0xx Blue 470 310 880 Blue Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package 2. The tolerance for intensity limit is ±15% 3. The optical axis is closely aligned with the package mechanical axis 4. The dominant wavelength, λd, is derived from the Chromaticity Diagram and represents the color of the lamp. Part Numbering System H L M P - L X 15 - X X X XX Mechanical Option 00: Bulk ZZ: Flexi-Bin, Ammo pack Color Bin Options 0: No color bin limitation T: Red Color with max VF of 2.6V Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Color B: 470nm Blue M: 525nm Green D: 630nm Red Package L: 4mm standard Oval 2 Absolute Maximum Rating TA = 25oC Parameter DC Forward Current [1] Red Blue and Green Unit 50 30 mA [2] [3] Peak Forward Current 100 100 mA Power Dissipation 120 130 mW Reverse Voltage 5 (IR = 100 µA) 5 (IR = 10 µA) V LED Junction Temperature 130 130 o -40 to +80 o -40 to +100 o Operating Temperature Range -40 to +100 Storage Temperature Range -40 to +120 C C C Notes: 1. Derate linearly as shown in Figure 4 and Figure 8. 2. Duty Factor 30%, frequency 1Khz. 3. Duty Factor 10%, frequency 1kHz. Electrical/Optical Characteristics Parameter Symbol Forward Voltage Red (λd = 630nm)[1] Blue (λd = 470nm) Green (λd = 525nm) VF Reverse Voltage Red (λd = 630nm) Blue (λd = 470nm) Green (λd = 525nm) VR Peak Wavelength Red (λd = 630nm) Blue (λd = 470nm) Green (λd = 525nm) λpeak Spectral Half width Red (λd = 630nm) Blue (λd = 470nm) Green (λd = 525nm) ∆λ1/2 Capacitance Red (λd = 630nm) Blue (λd = 470nm) Green (λd = 525nm) C Thermal Resistance RθJ-PIN [2] Luminous Efficacy Red (λd = 630nm) Blue (λd = 470nm) Green (λd = 525nm) Min. Typ. Max. 2.3 3.8 3.8 2.6 4.0 4.0 5 Units Test Condition V IF = 20 mA V IR = 100 µA IR = 10 µA IR = 10 µA nm Peak of wavelength of spectral distribution at IF = 20 mA nm Wavelength width at spectral distribution power point at IF = 20 mA pF VF = 0, F = 1 MHz o LED Junction to cathode lead lm/W Emitted luminous power/emitted radiant power 639 467 520 17 24 35 40 43 43 240 ηv 155 75 520 C/W Notes: 1. Refer to VF bin table. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/ηv where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. 3 AlInGaP Red 630nm RELATIVE INTENSITY 1.0 0.5 0 500 550 600 WAVELENGTH – nm 650 700 60 2.5 50 2.0 RELATIVE INTENSITY (NORMALIZED AT 20 mA) DC FORWARD CURRENT - mA Figure 1. Relative intensity vs. wavelength 40 30 20 10 0 0.5 1.0 1.5 2.0 2.5 3.0 50 IF - FORWARD CURRENT - mA 0.5 40 RθJA = 585 ˚C/W 30 RθJA = 780 ˚C/W 20 10 0 20 40 60 80 0 10 20 30 40 50 FORWARD CURRENT - mA Figure 2. Forward current vs. forward voltage 100 TA - AMBIENT TEMPERATURE - C Figure 4. Forward current vs. ambient temperature 4 1.0 0 0 FORWARD VOLTAGE - V 0 1.5 Figure 3. Relative luminous intensity vs. forward current InGaN Blue and Green 1.0 RELATIVE LUMINOUS INTENSITY BLUE GREEN 0.8 0.6 0.4 0.2 0 400 450 500 550 600 650 700 WAVELENGTH - nm Figure 5. Relative intensity vs. wavelength 1.4 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) FORWARD CURRENT - mA 30 25 20 15 10 5 0 25 RθJA = 780 ˚C/W 20 15 10 5 0 0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE - ˚C Figure 8. Forward current vs. ambient temperature. 5 RELATIVE DOMINANT WAVELENGTH MAXIMUM FORWARD CURRENT - mA 30 0.8 0.6 0.4 0.2 0 5 20 15 25 10 FORWARD CURRENT - mA 30 Figure 7. Relative luminous intensity vs. forward current. 35 RθJA = 585 ˚C/W 1.0 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 FORWARD VOLTAGE - V Figure 6. Forward current vs. forward voltage. 1.2 1.035 1.030 1.025 GREEN 1.020 1.015 1.010 1.005 BLUE 1.000 0.995 0.990 0.985 0 5 10 15 25 20 FORWARD CURRENT - mA 30 Figure 9. Relative dominant wavelength vs. forward current RELATIVE INTENSITY 1 0.5 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREE Figure 10a. Spatial radiation pattern – major axis for RBG RELATIVE INTENSITY 1 0.5 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREE Figure 10b. Spatial radiation pattern – minor axis for RGB Intensity Bin Limit Table VF bin Table [2] (V at 20mA) Intensity (mcd) at 20 mA Bin ID Min. Max. Bin Min Max VA 2.0 2.2 K 310 400 VB 2.2 2.4 L 400 520 M 520 680 VC 2.4 2.6 Tolerance for each bin limit is ±0.05V. N 680 880 P 880 1150 Q 1150 1500 R 1500 1900 S 1900 2500 T 2500 3200 U 3200 4200 Tolerance for each bin limit is ± 15% 6 Blue Color Bin Table Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 2 3 4 5 464.0 468.0 472.0 476.0 468.0 472.0 476.0 480.0 Tolerance for each bin limit is ±0.5nm Green Color Bin Table Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 2 3 4 5 524.0 528.0 532.0 536.0 528.0 532.0 536.0 540.0 Tolerance for each bin limit is ±0.5 nm Red Color Range Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 622 634 0.6904 0.3094 0.6945 0.2888 0.6726 Tolerance for each bin limit is ±0.5 nm 0.3106 0.7135 0.2865 Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago Technologies representative for further information. 2. VF bin table only available for those AlInGaP Red devices with options –xxTxx. 7 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Condition: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. • Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through holes size for LED component leads. • Recommended soldering condition: Manual Solder Wave Soldering Dipping − Pre-heat temperature 105 °C Max. Preheat time 30 sec Max − Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max LED component ead size Diagonal Plated through hole diameter 0.457 x 0.457mm (0.018 x 0.018inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508mm (0.020 x 0.020inch) 0.718 mm (0.028 inch) 1.049 to 1.150mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. Recommended Wave Soldering Profile LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 200 TEMPERATURE - ˚C BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 150 FLUXING CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150 C (100 C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 100 50 30 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 0 10 20 30 40 50 TIME - SECONDS 60 70 80 90 100 For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.Obsoletes 5989-1697EN 5989-4142EN - May 29, 2006