HLMP-LD15, HLMP-LM17, HLMP-LB17
Precision Optical Performance Red, Green and Blue
4mm Standard Oval LEDs
Data Sheet
Description
Features
These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high
luminous intensity ensure that these devices are excellent
for wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
These lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the
sign. High efficiency LED material is used in these lamps:
Aluminum Indium Gallium Phosphide (AlInGaP II) for red
and Indium Gallium Nitride for blue and green. Each lamp
is made with an advanced optical grade epoxy offering
superior high temperature and high moisture resistance
in outdoor applications.
• Well defined spatial radiation pattern
The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct
sunlight.
Applications
• High brightness material
• Available in red, green and blue color.
- Red AlInGaP 630mm
- Green InGaN 525nm
- Blue InGaN 470nm
• Superior resistance to moisture
• Tinted and diffused
Benefits
• Viewing angle designed for wide filed of view applications
• Superior performance for outdoor environments
• Full color signs
• Commercial outdoor advertising.
Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
A
21.0
MIN.
0.827
6.3
0.248
9.65
0.380
1.0
MIN.
0.038
1.25
0.049
2.9
0.114
CATHODE LEAD
2.54±0.3
0.100±0.012
3.7
0.146
0.8
0.016 MAX. EPOXY MENISCUS
0.4±0.1
0.016±0.004
0.45±0.10
0.018±0.004
B
6.4±0.2
1.0MIN.
0.038
21.0MIN.
0.827
0.252±0.008
9.10±0.20
2.4±0.2
.094±.008
1.25±0.20
0.049±0.008
0.358±0.008
CATHODE LEAD
3.87±0.2
0.152±0.008
2.54±0.3
0.100±0.012
0.8MAX. EPOXY MENISCUS
0.016
0.4±0.1
0.016±0.004
0.45±0.10
0.018±0.004
Note:
1. Dimension in millimeters (inches).
2. Tolerance is ±0.2mm unless otherwise noted.
3. For InGaN Blue and Green (package B), if heat-sinking application is required, the terminal for heat sink is anode.
Device Selection Guide
Part Number
Color and Dominant
Wavelength ld (nm) Typ.
HLMP-LD15-MQTxx
Luminous Intensity Iv
(mcd) at 20 mA
Min
Max
Tinting Type
Package Drawing
Red 630
520
1500
Red
A
HLMP-LD15-NRTxx
Red 630
680
1900
Red
A
HLMP-LM17-SV0xx
Green 525
1900
5500
Green
B
HLMP-LB17-LP0xx
Blue 470
400
1150
Blue
B
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package
2. The tolerance for intensity limit is ±15%
3. The optical axis is closely aligned with the package mechanical axis
4. The dominant wavelength, λd, is derived from the Chromaticity Diagram and represents the color of the lamp.
Part Numbering System
H L M P - L X 1X - X X X XX
Packaging Options
00: Bulk
DD: Ammo Pack
YY: Flexi-Bin, Bulk
ZZ: Flexi-Bin, Ammo pack
Color Bin Options
0: No color bin limitation
T: Red Color with max VF of 2.6V
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Color
D: 630nm Red
M: 525nm Green
B: 470nm Blue
Package
L: 4mm standard Oval
Note: Please refer to AB 5337 for complete information about part numbering system.
Absolute Maximum Rating (TA = 25oC)
Parameter
Red
Blue and Green
Unit
DC Forward Current [1]
50
30
mA
Peak Forward Current
100[2]
100[3]
mA
Power Dissipation
130
116
mW
Reverse Voltage
5 (IR = 100 mA)
5 (IR = 10 mA)
V
LED Junction Temperature
130
130
oC
Operating Temperature Range
-40 to +100
-40 to +85
oC
Storage Temperature Range
-40 to +100
-40 to +100
oC
Notes:
1. Derate linearly as shown in Figure 4 and Figure 8.
2. Duty Factor 30%, frequency 1KHz.
3. Duty Factor 10%, frequency 1KHz.
Electrical/Optical Characteristics
Parameter
Symbol
Forward Voltage
Red [1]
Blue
Green
VF
Reverse Voltage
Red
Blue
Green
VR
Peak Wavelength
Red
Blue
Green
lpeak
Dominant wavelength [2,3]
Red
Green
Blue
ld
Spectral Half width
Red
Blue
Green
Dl1/2
Capacitance
Red
Blue
Green
C
Thermal Resistance [4]
RqJ-PIN
Luminous Efficacy [5]
Red
Blue
Green
hv
Min.
2.0
2.8
2.8
Typ.
2.3
3.2
3.3
Max.
Units
Test Condition
V
IF = 20 mA
2.6
3.85
3.85
V
IR = 100 mA
IR = 10 mA
IR = 10 mA
5
5
5
nm
Peak of wavelength of spectral
distribution at IF = 20 mA
nm
IF = 20 mA
nm
Wavelength width at spectral distribution 1/2 power point at
IF = 20 mA
pF
VF = 0, F = 1 MHz
oC/W
LED Junction-to-pin
lm/W
Emitted luminous power/emitted
radiant power
639
464
516
622
520
460
630
525
470
634
540
480
17
23
32
40
65
64
240
155
75
520
Luminous Flux
Red
Green
Blue
jV
1300
3000
600
mlm
IF = 20 mA
Luminous Efficiency [6]
Red
Green
Blue
he
30
50
10
lm/W
Luminous Flux/Electrical Power
IF = 20 mA
Notes:
1. For option -xxTxx, VF maximum is 2.6V. Refer to VF bin table.
2. Tolerance for each color bin limit is ± 0.5 nm
3. The dominant wavelength λd is derived from the Chromaticity Diagram and represents the color of the lamp.
4. For AlInGaP Red, thermal resistance applied to LED junction to cathode lead, and for InGaN Blue and Green, thermal resistance applied to LED
junction to anode lead.
5. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/ηv where Iv is the luminous intensity in candelas and ηv is the
luminous efficacy in lumens/watt.
6. he = jV / IF x VF , where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
AlInGaP Red
RELATIVE INTENSITY
1.0
0.5
0
500
550
600
WAVELENGTH – nm
650
700
2.5
50
2.0
40
30
20
10
0
0
0.5
1.0
1.5
2.0
2.5
IF MAX - MAXIMUM FORWARD CURRENT - mA
60
RELATIVE INTENSITY
(NORMALIZED AT 20 mA)
DC FORWARD CURRENT - mA
Figure 1. Relative intensity vs. wavelength
1.5
1.0
0.5
0
3.0
0
10
20
30
50
40
60
50
40
30
20
10
0
0
20
40
60
80
TA - AMBIENT TEMPERATURE - oC
FORWARD CURRENT - mA
FORWARD VOLTAGE - V
Figure 2. Forward current vs. forward voltage
Figure 3. Relative luminous intensity vs. forward current
100
Figure 4. Forward current vs. ambient temperature
InGaN Blue and Green
FORWARD CURRENT - mA
RELATIVE INTENSITY
0.80
GREEN
BLUE
0.60
0.40
0.20
0
350
1.6
30
1.4
25
20
15
10
5
0
400
450
500
550
WAVELENGTH - nm
Figure 5. Relative intensity vs. wavelength
35
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
1.00
600
650
0
1
2
3
FORWARD VOLTAGE - V
Figure 6. Forward current vs. forward voltage.
4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
30
DC FORWARD CURRENT - mA
Figure 7. Relative luminous intensity vs. forward current.
1.020
30
1.015
25
RELATIVE DOMINANT
WAVELENGTH
IF - MAXIMUM FORWARD CURRENT - mA
35
20
15
10
0
20
40
60
80
100
0
0
30
60
90
120
150
180
150
180
ANGULAR DISPLACEMENT - DEGREES
Figure 10a. Spatial radiation pattern – major axis for RGB
1
0.5
0
0
30
20
30
Figure 9. Relative dominant wavelength vs. forward current
0.5
0
10
FORWARD CURRENT, mA
1
NORMALIZED INTENSITY
BLUE
1.000
0.995
0
Figure 8. Forward current vs. ambient temperature.
NORMALIZED INTENSITY
GREEN
1.005
5
TA - AMBIENT TEMPERATURE - o C
60
90
120
ANGULAR DISPLACEMENT - DEGREES
Figure 10b. Spatial radiation pattern – minor axis for RGB
1.010
Intensity Bin Limit Table
Blue Color Bin Table
Intensity (mcd) at 20 mA
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
Bin
Min
Max
1
460.0
464.0
0.1440
0.0297
0.1766
0.0966
L
400
520
0.1818
0.0904
0.1374
0.0374
M
520
680
0.1374
0.0374
0.1699
0.1062
N
680
880
0.1766
0.0966
0.1291
0.0495
P
880
1150
0.1291
0.0495
0.1616
0.1209
Q
1150
1500
0.1699
0.1062
0.1187
0.0671
R
1500
1900
0.1187
0.0671
0.1517
0.1423
S
1900
2500
0.1616
0.1209
0.1063
0.0945
T
2500
3200
0.1063
0.0945
0.1397
0.1728
U
3200
4200
0.1517
0.1423
0.0913
0.1327
V
4200
5500
2
3
4
5
464.0
468.0
468.0
472.0
472.0
476.0
476.0
480.0
Tolerance for each bin limit is ± 0.5nm
Tolerance for each bin limit is ± 15%
Green Color Bin Table
VF bin Table (V at 20mA) [2]
Bin ID
Min.
Max.
VA
2.0
2.2
VB
2.2
2.4
VC
2.4
2.6
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
520.0
524.0
0.0743
0.8338
0.1856
0.6556
0.1650
0.6586
0.1060
0.8292
0.1060
0.8292
0.2068
0.6463
0.1856
0.6556
0.1387
0.8148
0.1387
0.8148
0.2273
0.6344
0.2068
0.6463
0.1702
0.7965
0.1702
0.7965
0.2469
0.6213
0.2273
0.6344
0.2003
0.7764
0.2003
0.7764
0.2659
0.6070
0.2469
0.6213
0.2296
0.7543
2
3
524.0
528.0
528.0
532.0
Tolerance for each bin limit is ±0.05V.
4
5
532.0
536.0
536.0
540.0
Tolerance for each bin limit is ± 0.5nm
Red Color Range
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
622
634
0.6904
0.3094
0.6945
0.2888
0.6726
0.3106
0.7135
0.2865
Tolerance for each bin limit is ± 0.5nm
Note:
1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago Technologies representative for further
information.
2. VF bin table only available for those AlInGaP Red devices with options –xxTxx.
Avago Color Bin on CIE 1931 Chromaticity Diagram
1.000
0.800
Green 1 2 3
4
5
Y
0.600
0.400
Red
0.200
5
4
3
Blue
2
1
0.000
0.000
0.100
0.200
0.300
0.400
0.500
X
Relative Light Output vs Junction Temperature
RELATIVE LIGHT OUTPUT
(NORMALIZED at TJ = 25°C)
10
GREEN
1
RED
BLUE
0.1
-40
-20
0
20
40
60
80
TJ - JUNCTION TEMPERATURE - °C
100
120
0.600
0.700
0.800
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper tool
to precisely form and cut the leads to applicable length
rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Note:
1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature
experienced by the board if same wave soldering setting is used. So,
it is recommended to re-calibrate the soldering profile again before
loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
Avago Technologies LED configuration
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
1.59mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD damage
to the LED component that is ESD sensitive. Do refer
to Avago application note AN 1142 for details. The
soldering iron used should have grounded tip to ensure
electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
Cathode
AlInGaP Device
InGaN Device
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should not
apply weight or force on LED. Non metal material is
recommended as it will absorb less heat during wave
soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
Note:
1) Above conditions refers to measurement with thermocouple mounted
at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
Anode
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to Application Note 5334 for more information about soldering
and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
250
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
200
150
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
100
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
50
PREHEAT
0
10
20
30
40
50
60
TIME (MINUTES)
70
80
90
100
Ammo Packs Drawing
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
10
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE�
FACING UPWARDS.
LABEL ON THIS
SIDE OF BOX
ANODE LEAD LEAVES
THE BOX FIRST.
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 250C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
11
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
Example:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but without
VF bin OR part number with VF bins and no color bin)
OR
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
(ii) Color bin incorporated with VF Bin
BIN: 2VB
(Applicable for part number that have both color bin
and VF bin)
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR
AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS.
CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes AV01-0293EN
AV02-0364EN - September 5, 2008
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