HLMP-LG65-WX0DD

HLMP-LG65-xxxxx Precision Optical Performance Red New 4mm Standard Oval LEDs Data Sheet Description Features This Precision Optical Performance Oval LED is specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight. • Well defined spatial radiation pattern Package Dimensions • Full color signs 7.26±0.20 0.286±0.008 • High brightness material • Superior resistance to moisture • Standoff Package • Red Tinted Diffused • Typical viewing angle 50° x100° Applications 21.0 MIN. 0.827 1.25±0.20 0.049±0.008 CATHODE LEAD NOTE 1 3.80±0.20 0.1496±0.008 10.00±0.50 0.394±0.020 0.80 MAX. EPOXY MENISCUS 0.031 Notes: All dimensions in millimeters (inches). Tolerance is ± 0.20mm unless other specified 2.54±0.30 0.100±0.012 +0.10 0.45 - 0.04 0.018 +0.004 - 0.002 1.0 MIN. 0.039 3.00±0.20 0.118±0.008 Device Selection Guide Luminous Intensity Iv,- (mcd) at 20 mA [1,2,4] Part Number Color and Dominant Wavelength λd (nm) Typ [3] Min. Max. HLMP-LG65-VY0DD Red 626 1150 2400 HLMP-LG65-WX0DD Red 626 1380 1990 HLMP-LG65-WZ0DD Red 626 1380 2900 Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. Tolerance for each bin limit is ± 15%. Absolute Maximum Ratings TJ = 25°C Parameter Red Unit DC Forward Current [1] 50 mA Peak Forward Current 100 [2] mA Power Dissipation 130 mW Reverse Voltage 5 V LED Junction Temperature 130 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 4. 2. Duty Factor 30%, frequency 1KHz. Electrical / Optical Characteristics TJ = 25°C Parameter Symbol Min. Typ. Max. Units Test Conditions Forward Voltage VF 1.8 2.1 2.4 V IF = 20 mA Reverse Voltage VR 5 V IR = 100 µA Dominant Wavelength[1] λd 618 nm IF = 20 mA Peak Wavelength λPEAK 634 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Thermal Resistance RθJ-PIN 240 °C/W LED Junction-to-Anode lead Luminous Efficacy [2] ηV 150 lm/W Emitted Luminous Power/Emitted Radiant Power 626 630 Notes: 1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is the luminous efficacy in lumens/watt. 2 1 100 0.8 80 FORWARD CURRENT - mA RELATIVE INTENSITY AlInGaP Red 0.6 0.4 0.2 600 650 WAVELENGTH - nm RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) I F MAX . - MAXIMUM FORWARD CURRENT - mA 0 20 40 60 DC FORWARD CURRENT - mA 80 100 -30 0 30 ANGULAR DISPLACEMENT-DEGREE NORMALIZED INTENSITY Figure 5. Radiation pattern-Major Axis 1 2 FORWARD VOLTAGE - V 3 60 50 40 30 20 10 0 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE - C Figure 4. Maximum Forward Current vs Ambient Temperature NORMALIZED INTENSITY -60 0 Figure 2. Forward Current vs Forward Voltage Figure 3. Relative Intensity vs Forward Current 3 20 700 Figure 1. Relative Intensity vs Wavelength 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 40 0 0 550 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 60 60 90 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT-DEGREE Figure 6. Radiation pattern-Minor Axis 60 90 0.3 FORWARD VOLTAGE SHIFT - V RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25°C) 10 1 0.1 -40 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE - °C 120 140 -40 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE - °C 120 Figure 7. Relative Light Output vs Junction Temperature Figure 8. Relative Forward Voltage Shift vs Junction Temperature Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio) VF Bin Table (V at 20mA) Intensity (mcd) at 20 mA Bin ID Min Max Bin Min Max VD 1.8 2.0 V 1150 1380 VA 2.0 2.2 W 1380 1660 VB 2.2 2.4 X 1660 1990 Y 1990 2400 Z 2400 2900 Notes: 1. Tolerance for each bin limit is ±0.05V 2. VF binning only applicable to Red color. Tolerance for each bin limit is ± 15% Red Color Range Min Dom Max Dom Xmin Ymin Xmax Ymax 618 630 0.6872 0.3126 0.6890 0.2943 0.6690 0.3149 0.7080 0.2920 Tolerance for each bin limit is ± 0.5nm 140 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260°C and the solder contact time does not exceeding 5sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED Configuration Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105°C Max. - Preheat time 60 sec Max - Peak temperature 260°C Max. 260°C Max. Dwell time 5 sec Max. 5 sec Max Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 5 ANDOE AlInGaP Device Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED 260°C Max TEMPERATURE (°C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) 105°C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) 60 sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.0394 CATHODE 20.5±1.00 0.8071±0.0394 9.125±0.625 0.3593±0.025 18.00±0.50 0.7087±0.0197 12.70±0.30 0.50±0.0118 Ø 0.70±0.20 0.276±0.0079 View A-A Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff 6 4.00±0.20 TYP. 0.1575±0.0079 Packaging Box for Ammo Packs From left side of box adhesive tape must be facing upwards Label on this side of box A + Anod O OGIES G A V A HNOL TEC ode Cath_ e Anode lead leaves the box -rst C el r Lab e Moth Note: For InGaN device, the ammo pack packaging box contain ESD logo Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: 7 (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) (i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) OR (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) (ii) Color bin incorporate with VF Bin BIN: 2VB VB: VF bin “VB” 2: Color bin 2 only DISCLAIMER AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. AV02-1136EN - November 12, 2014