HLMP-LG71-XZ0DD

HLMP-LG71,HLMP-LM71, HLMP-LB71 Red, Green and Blue 4 mm Standard Oval LEDs Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. The package epoxy contains UV inhibitors to reduce the effects of long term exposure to direct sunlight. • Well defined spatial radiation pattern Applications • Billboard signs • Full color signs • High brightness material • Available in red, green and blue color. – Red AlInGaP 626 nm – Green InGaN 525 nm – Blue InGaN 470 nm • Superior resistance to moisture • Standoff Package • Tinted and diffused • Typical viewing angle 40° x 100° CAUTION: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions 21.0 MIN. 0.827 7.26 ± 0.20 0.286 ± 0.008 1.25 ± 0.20 0.049 ± 0.008 1.0 MIN. 0.039 3.00 ± 0.20 0.118 ± 0.008 CATHODE LEAD 2.54 ± 0.30 0.100 ± 0.012 3.80 ± 0.20 0.1496 ± 0.008 10.00 ± 0.50 0.394 ± 0.020 0.80 MAX. EPOXY MENISCUS 0.031 Sq Typ. 0.50 ± 0.10 0.020 ± 0.004 NOTE: 1. MEASURED AT BASE OF LENS. Notes: All dimensions in millimeters (inches). Tolerance is ± 0.20 mm unless other specified Device Selection Guide Color and Dominant Wavelength λd (nm) Typ [3] Luminous Intensity Iv (mcd) at 20 mA [1,2,4] Luminous Intensity Iv (mcd) at 20 mA [1,2,4] HLMP-LG71-VY0DD Red 626 1150 2400 HLMP-LM71-Z30DD Green 525 2400 5040 HLMP-LB71-SV0DD Blue 470 660 1380 Part Number Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. Tolerance for each bin limit is ± 15%. Part Numbering System HLMP-L x 71 – x x x xx Packaging Option DD: Ammopack Color Bin Selection 0 : Full Distribution Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Color B : Blue 470 G : Red 626 M : Green 525 Package L: 4 mm Standard Oval 40° x 100° Note: Please refer to AB 5337 for complete information about part numbering system. 2 Absolute Maximum Ratings TA = 25° C Parameter Red Green/ Blue Unit DC Forward Current [1] 50 30 mA Peak Forward Current 100 [2] 100 [3] mA Power Dissipation 120 110 mW LED Junction Temperature 130 110 °C Operating Temperature Range -40 to +100 Storage Temperature Range -40 to +85 °C -40 to +100 °C Notes: 1. Derate linearly as shown in Figures 4 and 8. 2. Duty Factor 30%, frequency 1 kHz. 3. Duty Factor 10%, frequency 1 kHz. Electrical / Optical Characteristics TA = 25° C Parameter Symbol Forward Voltage Red Green Blue VF Reverse Voltage [1] Red Green and Blue VR 1.8 2.8 2.8 Typ. 2.1 3.1 3.1 Max. Units Test Conditions V IF = 20 mA 2.4 3.6 3.6 V IR = 100 μA IR = 10 μA 5 5 Dominant Wavelength [2] Red Green Blue 618 520 460 Peak Wavelength Red Green Blue λPEAK Thermal Resistance RθJ-PIN Luminous Efficacy [3] ηV 626 525 470 nm IF = 20 mA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA °C/W LED Junction-to-Pin lm/W Emitted Luminous Power/ Emitted Radiant Power lm/W Luminous Flux/Electrical Power 630 540 480 634 517 461 Red Green Blue Luminous Efficiency [4] Red Green Blue Min. 240 190 475 68 ηe 50 60 13 Notes: 1. Indicates product final testing condition, long term reverse bias is not recommended. 2. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. 3. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is the luminous efficacy in lumens/watt. 4. ηe = ϕV / IF x VF, where ϕV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage. 3 1.0 50 0.8 40 FORWARD CURRENT - mA RELATIVE INTENSITY AlInGaP Red 0.6 0.4 0.2 600 650 WAVELENGTH - nm 10 0 700 Figure 1. Relative Intensity vs Wavelength 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 20 40 60 DC FORWARD CURRENT- mA Figure 3. Relative Intensity vs Forward Current 1 2 FORWARD VOLTAGE - V 3 Figure 2. Forward Current vs Forward Voltage IF MAX - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 20 0 0.0 550 4 30 80 100 60 50 40 30 20 10 0 0 20 40 60 80 TA - AMBIENT TEMPERATURE - °C Figure 4. Maximum Forward Current vs Ambient Temperature 100 30 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 25 Blue 430 FORWARD CURRENT - mA RELATIVE INTENSITY InGaN Blue and Green Green 480 530 WAVELENGTH - nm 580 10 5 0 1.4 35 1.2 30 1 0.8 0.6 0.4 0.2 5 10 15 20 25 DC FORWARD CURRENT - mA 30 10 NORMALIZED INTENSITY RELATIVE DOMINANT WAVELENGTH - nm 8 Green Blue 2 0 -2 0 5 10 15 20 FORWARD CURRENT - mA Figure 9. Relative dominant wavelength vs Forward Current 5 5 0 20 40 60 80 TA - AMBIENT TEMPERATURE - °C 100 Figure 8. Maximum Forward Current vs Ambient Temperature 10 -4 4 15 0 12 4 3 20 35 Figure 7. Relative Intensity vs Forward Current 6 2 FORWARD VOLTAGE - V 25 0 0 1 Figure 6. Forward Current vs Forward Voltage IF max. - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 15 0 630 Figure 5. Relative Intensity vs Wavelength 20 25 30 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 HLMP-LM71 HLMP-LB71 HLMP-LG71 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure10. Radiation pattern-Major Axis 90 10 HLMP-LM71 HLMP-LB71 HLMP-LG71 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES RELATIVE LIGHT OUTPUT (NORMALZIED @ TJ = 25° C) NORMALIZED INTENSITY 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 FORWARD VOLTAGE SHIFT - V 0.6 0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 1 0.1 90 Figure 11. Radiation pattern-Minor Axis HLMP-LG71 HLMP-LM71 HLMP-LB71 -40 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE Figure 12. Relative Light Output vs Junction Temperature Red Blue Green -40 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE 120 140 Figure 13. Forward Voltage Shift vs Junction Temperature Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio) VF Bin Table (V at 20 mA) Intensity (mcd) at 20 mA Bin ID Min Max Bin Min Max VD 1.8 2.0 S 660 800 VA 2.0 2.2 2.2 2.4 T 800 960 VB U 960 1150 V 1150 1380 Notes: 1. Tolerance for each bin limit is ±0.05 V 2. VF binning only applicable to Red color. W 1380 1660 X 1660 1990 Y 1990 2400 Z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 Tolerance for each bin limit is ±15% 6 120 140 Red Color Range Min Dom Max Dom 618.0 630.0 Blue Color Bin Table Chromaticity Coordinate x 0.6872 0.3126 0.6890 0.2943 y 0.6690 0.3149 0.7080 0.2920 Bin Min Dom Max Dom 1 460.0 464.0 Tolerance for each bin limit is ± 0.5 nm 2 464.0 468.0 Green Color Bin Table 3 468.0 472.0 Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 2 3 4 5 524.0 528.0 532.0 536.0 528.0 532.0 536.0 540.0 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 4 472.0 5 476.0 476.0 480.0 CIE 1931 - Chromaticity Diagram 1.000 0.800 3 4 5 Green Y 0.600 0.400 Red 0.200 Blue 5 3 2 1 0.000 0.000 0.100 0.200 0.300 0.400 X 7 0.500 Xmax Ymax 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information. Avago Color Bin on CIE 1931 Chromaticity Diagram 4 Ymin Tolerance for each bin limit is ± 0.5 nm Tolerance for each bin limit is ± 0.5 nm 1 2 Xmin 0.600 0.700 0.800 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ AllnGaP high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260° C and the solder contact time does not exceeding 5 sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED. 1.59mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105° C Max. – Preheat time 60 sec Max – Peak temperature 260° C Max. 260° C Max. Dwell time 5 sec Max. 5 sec Max Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 8 CATHODE ANODE AlInGaP Device InGaN Device • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED 260° C Max TEMPERATURE (° C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255° C ± 5° C (maximum peak temperature = 260° C) 105° C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5 sec) 60 sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.0394 CATHODE 20.5±1.00 0.8071±0.0394 9.125±0.625 0.3593±0.025 18.00±0.50 0.7087±0.0197 12.70±0.30 0.50±0.0118 Ø 0.70±0.20 0.276±0.0079 9 VIEW A - A 4.00±0.20 TYP. 0.1575±0.0079 Packaging Box for Ammo Packs FROM LEFT SIDE OF BOX ADHESIVE TAPE MUST BE FACING UPWARDS. LABEL ON THIS SIDE OF BOX ANODE LEAD LEAVES THE BOX FIRST. Note: For InGaN device, the ammo pack packaging box contain ESD logo Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: 10 (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Color Bin DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin (ii) Color bin incorporated with VF Bin BIN: 2VB (Applicable for part number that have both color bin and VF bin) VB: VF bin “VB” 2: Color bin 2 only DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved. AV02-3127EN - July 29, 2011