HLMP-LG75-XY0DD

HLMP-LG75, HLMP-LM75, HLMP-LB75 Red, Green and Blue 4 mm Standard Oval LEDs Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for billboard sign application. The oval shaped radiation pattern with optimal viewing angle and enhance high luminous intensity ensure that these devices are excellent for this outdoor applications. The package epoxy contains UV inhibitor to reduce the effects of long term exposure to direct sunlight. x Well defined spatial radiation pattern x High brightness material x Available in red, green and blue color – Red AlInGaP 626 nm – Green InGaN 530 nm – Blue InGaN 470 nm x Superior resistance to moisture Applications x Standoff Package x Billboard Sign x Tinted and diffused x Full Color Signs x Typical viewing angle 40° x 100° Package Dimensions 21.0 MIN. 0.827 7.26 ± 0.20 0.286 ± 0.008 1.25 ± 0.20 0.049 ± 0.008 1.0 MIN. 0.039 3.00 ± 0.20 0.118 ± 0.008 CATHODE LEAD 2.54 ± 0.30 0.100 ± 0.012 3.80 ± 0.20 0.1496 ± 0.008 10.00 ± 0.50 0.394 ± 0.020 0.80 MAX. EPOXY MENISCUS 0.031 Sq Typ. 0.50 ± 0.10 0.020 ± 0.004 NOTE: 1. MEASURED AT BASE OF LENS. Notes: All dimensions in millimeters (inches). Tolerance is ± 0.20 mm unless other specified Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Device Selection Guide Part Number Color and Dominant Wavelength Od (nm) Typ HLMP-LG75-XY0DD HLMP-LM75-34CDD HLMP-LB75-VWBDD Luminous Intensity Iv (mcd) at 20 mA [1,2,5] Min Max Typical Viewing Angle (°) Red 626 1660 2400 40x100 Green 530 4200 6050 40x100 Blue 470 1150 1660 40x100 Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. T½ is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each bin limit is ± 15%. Part Numbering System H L MP – L x 7 5 – x x x xx Packaging Option DD: Ammopack Color Bin Selection 0 : Full Distribution B : Color Bin 2 and 3 C : Color Bin 3 and 4 Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Color G : Red M : Green B : Blue Package L: 4 mm Standard Oval Note: Please refer to AB 5337 for complete information about part numbering system 2 Absolute Maximum Ratings TJ = 25°C Parameter Red Green/ Blue Unit DC Forward Current [1] 50 30 mA Peak Forward Current 100 [2] 100 [3] mA Power Dissipation 120 114 mW LED Junction Temperature 130 110 °C Operating Temperature Range -40 to +100 Storage Temperature Range -40 to +85 °C -40 to +100 °C Notes: 1. Derate linearly as shown in Figures 4 and 8. 2. Duty Factor 30%, frequency 1 KHz. 2. Duty Factor 10%, frequency 1 KHz. Electrical / Optical Characteristics TJ = 25°C Parameter Symbol Forward Voltage Red Green Blue VF Reverse Voltage [3] Red Green and Blue VR Dominant Wavelength [1] Red Green Blue Od Peak Wavelength Red Green Blue OPEAK Thermal Resistance RTJ-PIN Luminous Efficacy [2] KV Red Green Blue Min. Typ. Max. 1.8 2.8 2.8 2.1 3.2 3.2 2.4 3.8 3.8 Units Test Conditions V IF = 20 mA V IR = 100 PA IR = 10 PA 5 5 618 527 464 626 530 470 nm IF = 20 mA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA °C/W LED Junction-to-Pin lm/W Emitted Luminous Power/ Emitted Radiant Power 630 535 472 634 526 464 240 218 538 65 Notes: 1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/KV where IV is the luminous intensity in candelas and KV is the luminous efficacy in lumens/watt. 3. Indicates product final testing condition. Long term reverse bias is not recommended. 3 1 100 0.8 80 FORWARD CURRENT - mA RELATIVE INTENSITY AlInGaP Red 0.6 0.4 0.2 0 550 600 650 WAVELENGTH - nm 0 20 40 60 DC FORWARD CURRENT-mA Figure 3. Relative Intensity vs Forward Current 4 20 0 1 2 FORWARD VOLTAGE - V 3 Figure 2. Forward Current vs Forward Voltage IF MAX - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 40 0 700 Figure 1. Relative Intensity vs Wavelength 60 80 100 60 50 40 30 20 10 0 0 20 40 60 80 TA - AMBIENT TEMPERATURE - °C Figure 4. Maximum Forward Current vs Ambient Temperature 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 100 BLUE FORWARD CURRENT - mA RELATIVE INTENSITY InGaN Green and Blue GREEN 380 430 480 530 WAVELENGTH - nm 580 630 0 0 35 3.0 30 Green 2.5 2.0 Blue 1.5 1.0 0 20 40 60 80 FORWARD CURRENT-mA 100 120 Figure 7. Relative Intensity vs Forward Current RELATIVE DOMINANT WAVELENGTH-nm 20 3.5 0.0 4 2 0 Blue -2 -4 Green -6 0 20 1 2 3 FORWARD VOLTAGE - V 4 5 40 60 80 TA - AMBIENTTEMPERATURE - °C 100 40 60 80 FORWARD CURRENT-mA 25 20 15 10 5 0 0 20 Figure 8. Maximum Forward Current vs Ambient Temperature 6 Figure 9. Relative Dominant Wavelength vs Forward Current 5 40 Figure 6. Forward Current vs Forward Voltage 0.5 -8 60 IFmax - MAXIMUM FORWARD CURRENT - mA RELATIVE INTENSITY (NORMALIZED AT 20mA) Figure 5. Relative Intensity vs Wavelength 80 100 120 1.0 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY 1.0 0.6 0.4 LG75 Red LM75 LB75 0.2 0.0 -90 -60 -30 0 30 ANGULAR DISPALCEMENT (°) 60 Figure 10. Radiation pattern-Major Axis 0.4 0.2 -90 -60 -30 0 30 ANGULAR DISPALCEMENT (°) 60 90 Figure11. Radiation pattern-Minor Axis 0.5 10 Green Red Blue Green Red Blue 0.4 FORWARD VOLTAGE SHIFT-V RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25°C) 0.6 0.0 90 LG75 Red LM75 LB75 1 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 0.1 -40 -20 0 20 40 60 80 100 TJ -JUNCTION TEMPERATURE 120 -0.4 140 -40 -20 0 20 40 60 80 100 TJ -JUNCTION TEMPERATURE Figure12. Relative Light Output vs Junction Temperature Figure13. Forward Voltage Shift vs Junction Temperature Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio) VF Bin Table (V at 20 mA) Bin Intensity (mcd) at 20 mA Bin ID Min Max Min Max VD 1.8 2.0 V 1150 1380 VA 2.0 2.2 W 1380 1660 VB 2.2 2.4 X 1660 1990 Y 1990 2400 Z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 4 5040 6050 Tolerance for each bin limit is ±15% 6 Notes: 1. Tolerance for each bin limit is ±0.05 V 2. VF binning only applicable to Red color. 120 140 Red Color Range Blue Color Bin Table Min Dom Max Dom Min Bin Dom Max Dom 618.0 630.0 2 468.0 x 0.6872 0.3126 0.6890 0.2943 y 0.6690 0.3149 0.7080 0.2920 Tolerance for each bin limit is r 0.5 nm 3 Green Color Bin Table Min Bin Dom Max Dom 3 531 527 4 531 535 464.0 468.0 472.0 x 0.1305 0.1711 0.1967 0.1625 y 0.8189 0.7218 0.7077 0.8012 x 0.1625 0.1967 0.221 0.1929 y 0.8012 0.7077 0.692 0.7816 1.000 0.800 3 4 Green Y 0.600 0.400 Red 0.200 Blue 7 0.100 0.1766 0.1699 0.1291 0.0966 0.1062 0.0495 x 0.1291 0.1699 0.1616 0.1187 y 0.0495 0.1062 0.1209 0.0671 Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information. Avago Color Bin on CIE 1931 Chromaticity Diagram 0.000 0.000 0.1374 0.0374 Tolerance for each bin limit is r 0.5 nm Tolerance for each bin limit is r 0.5 nm 3 x y 2 0.200 0.300 0.400 X 0.500 0.600 0.700 0.800 Precautions: Lead Forming: x The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. x For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. x If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ AllnGaP high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260° C and the solder contact time does not exceeding 5 sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: x Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. x LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED. 1.59mm x ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. x Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105° C Max. – Preheat time 60 sec Max – Peak temperature 260° C Max. 260° C Max. Dwell time 5 sec Max. 5 sec Max Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. x Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 8 &$7+2'( $12'( $O,Q*D3'HYLFH ,Q*D1'HYLFH x Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. x At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. x If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. x Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) x Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED 260° C Max TEMPERATURE (° C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255° C ± 5° C (maximum peak temperature = 260° C) 105° C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5 sec) 60 sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.0394 CATHODE 20.5±1.00 0.8071±0.0394 9.125±0.625 0.3593±0.025 18.00±0.50 0.7087±0.0197 12.70±0.30 0.50±0.0118 Ø 0.70±0.20 0.276±0.0079 9 VIEW A - A 4.00±0.20 TYP. 0.1575±0.0079 Packaging Box for Ammo Packs FROM LEFT SIDE OF BOX ADHESIVE TAPE MUST BE FACING UPWARDS. LABEL ON THIS SIDE OF BOX ANODE LEAD LEAVES THE BOX FIRST. Note: For InGaN device, the ammo pack packaging box contain ESD logo Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)  3,WHP3DUW1XPEHU 67$1'$5'/$%(//6 5R+6&RPSOLDQW HPD[WHPS& 7/RW/RW1XPEHU  447