HLMP-LM65-Z30ZZ

HLMP-LM65, HLMP-LB65 Precision Optical Performance Green and Blue New 4mm Standard Oval LEDs Data Sheet Description Features This Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight. x Well defined spatial radiation pattern Applications x Tinted and diffused x High brightness material x Available in green and blue color Green InGaN 525nm Blue InGaN 470nm x Superior resistance to moisture x Standoff Package x Typical viewing angle 50° x100° x Full color signs Package Dimensions 21.0 MIN. 0.827 7.26 ± 0.20 0.286 ± 0.008 1.25 ± 0.20 0.049 ± 0.008 1.0 MIN. 0.039 NOTE: 1. MEASURED AT BASE OF LENS. CATHODE LEAD 2.54 ± 0.30 0.100 ± 0.012 3.80 ± 0.20 0.1496 ± 0.008 10.00 ± 0.50 0.394 ± 0.020 0.80 MAX. EPOXY MENISCUS 0.031 Sq Typ. 0.50 ± 0.10 0.020 ± 0.004 Notes: All dimensions in millimeters (inches). Tolerance is ± 0.20mm unless other specified Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. 3.00 ± 0.20 0.118 ± 0.008 Device Selection Guide Part Number Color and Dominant Wavelength Od (nm) Typ Luminous Intensity Iv (mcd) at 20 mA-Min [1] Luminous Intensity Iv (mcd) at 20 mA-Max [1] HLMP-LM65-Z30xx Green 525 2400 5040 HLMP-LB65-RU0xx Blue 470 550 1150 Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. Part Numbering System HLMP - L x 65 - x x x xx Packaging Option DD: Ammo packs ZZ: Flexi Ammopacks Color Bin Selection 0: Full Distribution Maximum Intensity Bin Refer to selection guide Minimum Intensity Bin Refer to Device Selection Guide. Color M: Green 525 B: Blue 470 Package L: 4mm Standard Oval 50°x100° Note: Please refer to AB 5337 for complete information about part numbering system 2 Absolute Maximum Ratings TJ = 25°C Parameter Green/ Blue Unit DC Forward Current [1] 30 mA Peak Forward Current 100 [2] mA Power Dissipation 114 mW Reverse Voltage 5 (IR =10μA) V LED Junction Temperature 110 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 2. 2. Duty Factor 10%, frequency 1KHz. Electrical / Optical Characteristics TJ = 25°C Parameter Symbol Forward Voltage Green Blue VF Reverse Voltage Green Blue VR Dominant Wavelength [1] Green Blue Od Peak Wavelength Green Blue OPEAK Thermal Resistance RTJ-PIN Luminous Efficacy [2] KV Typ. Max. 2.8 2.8 3.2 3.2 3.8 3.8 Units Test Conditions V IF = 20 mA V IR = 10 μA nm IF = 20 mA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA °C/W LED Junction-to-Cathode lead lm/W Emitted Luminous Power/Emitted Radiant Power 5 5 520 460 525 470 540 480 516 464 Green Blue Luminous Efficiency [3] Green Blue Min. 240 530 65 Ke 60 13 Luminous Flux/ Electrical Power IF = 20 mA Notes: 1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/KV where IV is the luminous intensity in candelas and KV is the luminous efficacy in lumens/watt. 3. ηe = φV / IF x VF, where φV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage. 3 InGaN Green 1.0 100 BLUE 0.9 80 0.7 FORWARD CURRENT - mA RELATIVE INTENSITY 0.8 GREEN 0.6 0.5 0.4 0.3 0.2 60 40 20 0.1 0.0 380 430 480 530 WAVELENGTH - nm 580 0 630 Figure 1. Relative Intensity vs Wavelength 0 5 80 100 30 3.0 IF max - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) 4 35 BLUE GREEN 2.5 2.0 1.5 1.0 0.5 25 20 15 10 5 0.0 0 0 20 40 60 80 100 120 Figure 3. Relative Intensity vs Forward Current 8 6 4 2 0 BLUE -4 -6 GREEN -8 -10 0 20 40 60 FORWARD CURRENT - mA Figure 5. Relative dominant wavelength vs Forward Current 20 40 60 Figure 4. Maximum Forward Current vs Ambient Temperature 10 -2 0 T A - AMBIENTTEMPERATURE - °C DC FORWARD CURRENT - mA RELATIVE DOMINANT WAVELENGTH SHIFT - nm 2 3 FORWARD VOLTAGE - V Figure 2. Forward Current vs Forward Voltage 3.5 4 1 80 100 1.0 BLUE GREEN 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY 1.0 0.6 0.4 0.4 0.0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREE -90 90 Figure 6. Radiation Pattern – Major Axis -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREE 90 Figure 7. Radiation Pattern – Minor Axis 0.3 10 BLUE GREEN FORWARD VOLTAGE SHIFT-V RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ =25°C) 0.6 0.2 0.2 0.0 1 0.1 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE - °C 100 Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio) Intensity (mcd) at 20 mA Bin Min Max R 550 660 S 660 800 T 800 960 U 960 1150 V 1150 1380 W 1380 1660 X 1660 1990 Y 1990 2400 Z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 Tolerance for each bin limit isr 15% 120 BLUE GREEN 0.2 0.1 0 -0.1 -0.2 -0.3 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE - °C Figure 9. Relative Forward Voltage vs Junction Temperature Figure 8. Relative Light Output vs Junction Temperature 5 BLUE GREE 0.8 100 120 Green Color Bin Table Blue Color Bin Table Bin Min Dom Max Dom Xmin Ymin Xmax Ymax Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1650 0.6586 0.1060 0.8292 0.1818 0.0904 0.1374 0.0374 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 0.8148 0.2273 0.6344 2 524.0 528.0 3 528.0 532.0 0.1387 0.2068 0.6463 0.1702 0.7965 4 532.0 536.0 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 5 536.0 540.0 Tolerance for each bin limit is r 0.5nm 2 464.0 468.0 3 468.0 472.0 4 472.0 476.0 5 476.0 480.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 Tolerance for each bin limit is r 0.5nm Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information. Avago Color Bin on CIE 1931 Chromaticity Diagram 1.000 0.800 1 Green 2 3 4 5 Y 0.600 0.400 0.200 Blue 5 4 3 2 1 0.000 0.000 6 0.200 0.400 X 0.600 0.800 Precautions: Lead Forming: x The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. x For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. x If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. Avago Technologies LED Configuration Soldering and Handling: x Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. x LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm x ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. x Recommended soldering condition: InGaN Device x Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. x At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. x If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. x Recommended PC board plated through holes (PTH) size for LED component leads. Wave Soldering [1, 2] Manual Solder Dipping LED component lead size Diagonal Plated through hole diameter Pre-heat temperature 105°C Max. - Preheat time 60 sec Max - 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) Peak temperature 260°C Max. 260°C Max. 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) Dwell time 5 sec Max. 5 sec Max Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. x Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 7 CATHODE x Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED 260°C Max TEMPERATURE (°C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) 105°C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) 60 sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.0394 CATHODE 20.5±1.00 0.8071±0.0394 9.125±0.625 0.3593±0.025 18.00±0.50 0.7087±0.0197 12.70±0.30 0.50±0.0118 Ø 0.70±0.20 0.276±0.0079 8 VIEW A - A 4.00±0.20 TYP. 0.1575±0.0079 Packaging Box for Ammo Packs FROM LEFT SIDE OF BOX ADHESIVE TAPE MUST BE FACING UPWARDS. LABEL ON THIS SIDE OF BOX ANODE LEAD LEAVES THE BOX FIRST. Note: For InGaN device, the ammo pack packaging box contain ESD logo Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)  3,WHP3DUW1XPEHU 67$1'$5'/$%(//6 5R+6&RPSOLDQW HPD[WHPS& 7/RW/RW1XPEHU  447