HLMP-NM30-H0000

HLMP-DS25/DM25/NS30/NM31 T-1¾ (5 mm), T-1 (3 mm) InGaN LED Lamps Data Sheet Description Features The blue HLMP-DS25 and HLMP-NS30, and green HLMP-DM25 and HLMP-NM31 LEDs are designed in an industry standard T-1¾ and T-1 pack-ages with clear and nondiffused optics. • Popular T-1¾ and T-1 diameter packages These lamps are ideal for use as indicators and for general purpose lighting. Blue lamps offer color differentiation as blue is attractive and not widely available. • General purpose leads • Reliable and rugged • Binned for color and intensity • Bright InGaN dice Applications • Status indicators • Small message panel • Running and decorative lights for commercial use • Back lighting Package Dimensions • Consumer audio HLMP-NS30/NM31 HLMP-DS25/DM25 4.40 ± 0.30 5.08 (0.200) 4.57 (0.180) 3.10 ± 0.20 3.50 ± 0.30 9.19 (0.352) 8.43 (0.332) 5.85 ± 0.50 2.00 0.65 MAX. 0.89 (0.035) 0.64 (0.025) 23.0 MIN. (0.90) 23.0 MIN. 0.45 (0.018) SQUARE NOMINAL 0.45 + 0.10 – 0.04 1.0 MIN. 1.27 (0.050) NOM. 2.54 ± 0.30 6.10 (0.240) 5.59 (0.220) CATHODE 2.54 (0.100) NOM. 0.44 ± 0.20 CATHODE MARKS 3.40 ± 0.20 NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. EPOXY MENISCUS MAY EXTEND 1 mm (0.040") MAX DOWN THE LEADS. 0.40 + 0.10 –0 CAUTION: Devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. For additional details, refer to Application Note AN-1142. Selection Guide Luminous Intensity Iv (mcd) at 20 mA Package Description Color Part Number Min. Max. T-1¾ Blue HLMP-DS25-F0000 110 – Blue HLMP-DS25-F00DD 110 – Green HLMP-DM25-J0000 240 – Blue HLMP-NS30-J0000 240 – Blue HLMP-NS30-J00DD 240 – Green HLMP-NM31-R0000 1500 – Green HLMP-NM31-R00DD 1500 – T-1 Part Numbering System HLMP – X X XX – X X X XX Mechanical Option 00: Bulk DD: Ammo pack Color Bin Options 0: Full color bin distribution Maximum Iv Bin Options 0: Open (No. max. limit) Minimum Iv Bin Options Please refer to the Iv bin Table Viewing Angle 25: 25 Degree 30/31: 30 Degree Color Options S: Blue M: Green Package Options D: T-1¾ (5 mm) N: T-1 (3 mm) Auto-insertable 2 Absolute Maximum Ratings (TA = 25 °C) Parameter HLMP-DS25/DM25 HLMP-NS30/NM31 Peak Pulsed Forward Current [1] 100 mA 100 mA DC Forward Current [2] 30 mA 30 mA Reverse Voltage Not recommended for reverse bias Power dissipation 116 mW 116 mW LED Junction Temperature 115 °C 115 °C Operating Temperature –40 to +85 °C –40 to +85 °C Storage Temperature –40 to +100 °C –40 to +85 °C Notes: 1. Duty factor = 10%, Frequency = 1 kHz. 2. Derate linearly as shown in Figure 4. Optical Characteristics (TA = 25 °C) Part Number Luminous Intensity IV (mcd) @ IF = 20 mA Min. Color, Dominant Wavelength ld[1] (nm) Typ. Peak Wavelength lPEAK (nm) Typ. Viewing Angle 2q1/2[2] degrees Typ. HLMP-DS25 110 470 468 25 HLMP-DM25 240 527 520 25 HLMP-NS30 240 470 468 30 HLMP-NM31 1500 527 520 30 Notes: 1. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the single wavelength which defines the color of the device. 2. q1/2 is the off-axis angle at which the luminous intensity is half of the axial luminous intensity. Electrical Characteristics Forward Voltage VF (V) IF = 20 mA Speed Response ts (ns) Capacitance C (pF), VF = 0, f = 1 MHz Part Number Min. Typ. Max. Typ. Typ. Thermal Resistance RqJ-PIN (°C/W) Junction to Cathode Lead HLMP-DS25 2.8 3.2 3.8 500 50 260 HLMP-DM25 2.8 3.2 3.8 500 50 260 HLMP-NS30 2.8 3.2 3.8 500 50 290 HLMP-NM31 2.8 3.2 3.8 500 50 290 3 30 25 0.8 0.7 BLUE GREEN FORWARD CURRENT - mA RELATIVE INTENSITY 1.0 0.9 0.6 0.5 0.4 0.3 0.2 20 15 10 5 0.1 0 380 430 480 530 580 WAVELENGTH 630 0 680 Figure 1. Relative intensity vs. wavelength IF – FORWARD CURRENT – mA DC RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 1.2 4 1.0 0.8 0.6 0.4 0.2 0 10 20 30 40 IF – DC FORWARD CURRENT – mA 25 20 15 10 5 0 50 0 10 20 30 50 70 40 60 TA – AMBIENT TEMPERATURE – °C 80 90 Figure 4. Maximum forward current vs. ambient temperature based on TJ max. = 115 °C 0.9 0.8 RELATIVE INTENSITY 3 30 1.0 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGULAR DISPLACEMENT – DEGREES Figure 5. Relative luminous intensity vs. angular displacement for HLMP-DS25 and HLMP-DM25 1.0 0.9 0.8 RELATIVE INTENSITY 2 FORWARD VOLTAGE - V 35 1.6 Figure 3. Relative luminous intensity vs. forward current 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGULAR DISPLACEMENT – DEGREES Figure 6. Relative luminous intensity vs. angular displacement for HLMP-NS30 and HLMP-NM31 4 1 Figure 2. Forward current vs. forward voltage 1.8 0 0 Color Bin Limits (nm at 20 mA) Bin Limits Bin Intensity Range (mcd) Min. Max. Blue Bin ID nm @ 20 mA Min. F 110.0 140.0 1 460.0 464.0 G 140.0 180.0 2 464.0 468.0 H 180.0 240.0 3 468.0 472.0 J 240.0 310.0 4 472.0 476.0 K 310.0 400.0 5 476.0 480.0 L 400.0 520.0 M 520.0 680.0 N 680.0 880.0 P 880.0 1150.0 Green Bin ID nm @ 20 mA Min. Q 1150.0 1500.0 1 520.0 524.0 R 1500.0 1900.0 2 524.0 528.0 S 1900.0 2500.0 3 528.0 532.0 T 2500.0 3200.0 4 532.0 536.0 U 3200.0 4200.0 5 536.0 540.0 Tolerance for each minimum and maximum = ± 15%. Max. Tolerance for each bin limit will be ± 0.5 nm. Mechanical Option Matrix Mechanical Option Code Definition O0 Bulk Packaging, minimum increment 500 pcs/bag DD Ammo Pack, straight leads, minimum increment 2K pcs/pack All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. 5 Max. Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59 mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat Temperature 105°C Max. – Pre-heat Time 60 sec Max. – Peak Temperature 250°C Max. 260°C Max. Dwell Time 3 sec Max. 5 sec Max. Notes: 1. These conditions refer to measurement with thermocouple mounted at the bottom of PCB. 2. To reduce thermal stress experienced by LED, it is recommended that you use only bottom preheaters. 6 • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. Notes: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads: LED Component Lead Size Diagonal Plated ThroughHole Diameter Lead size (typ.) 0.45 × 0.45 mm (0.018 × 0.018 in.) 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) Dambar shearoff area (max.) 0.65 mm (0.026 in) 0.919 mm (0.036 in) Lead size (typ.) 0.50 × 0.50 mm (0.020 × 0.020 in.) 0.707 mm (0.028 in) Dambar shearoff area (max.) 0.70 mm (0.028 in) 0.99 mm (0.039 in) 1.05 to 1.15 mm (0.041 to 0.045 in) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. For more information about soldering and handling of TH LED lamps, refer to application note AN5334. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead-free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 TEMPERATURE (°C) Flux: Rosin flux 200 Solder bath temperature: 245 °C± 5 °C (maximum peak temperature = 250 °C) 150 Dwell time: 1.5 sec – 3.0 sec (maximum = 3 sec) 100 Note: Allow for board to be sufficiently cooled to room temperature before you exert mechanical force. 50 PREHEAT 0 7 10 20 30 40 50 60 TIME (SECONDS) 70 80 90 100 Packing Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Number (1P) Lot: Item:Lot Part Number (Q) QTY: Quantity STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C LPN: (1T) Lot: Lot Number CAT: Intensity Bin (Q) QTY: Quantity (9D)MFG Date: Manufacturing Date LPN: BIN: Bin Bin CAT:Color Intensity (P) Customer (9D)MFG Date:Item: Manufacturing Date BIN: Color Bin (V) Customer Vendor ID:Item: (P) (9D) Date Code: Date Code DeptID: (V) Vendor ID: Made In: Country of Origin (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number Lamps Baby Label (1T) LOT #: Lot Number (1P) PART #: Part Number RoHS Compliant e3 max temp 250C RoHS Compliant e3 max temp 250C (9D)MFG DATE: Manufacturing Date (1T) LOT #: Lot Number QUANTITY: Packing Quantity C/O: Country of Origin (9D)MFG DATE: Manufacturing Date Customer P/N: QUANTITY: Packing Quantity CAT: Intensity Bin C/O: Country of Origin Supplier Code: Customer P/N: Supplier Code: BIN: Color Bin Bin CAT: Intensity DATECODE: Date BIN: Color BinCode DATECODE: Date Code For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. AV02-1029EN - August 20, 2014