HLMP-S501-C0000

Data Sheet HLMP-S100, HLMP-S201, HLMP-S301, HLMP-S400, HLMP-S401, HLMP-S501 2 mm × 5 mm Rectangular LED Lamps Features Description The Broadcom® HLMP-S100, -S201, -S301, -S400, -S401, -S501, are epoxy encapsulated lamps in rectangular packages which are easily stacked in arrays or used for discrete front panel indicators. Contrast and light uniformity are enhanced by a special epoxy diffusion and tinting process.       Rectangular light emitting surface Excellent for flush mounting on panels Choice of five bright colors Long life: solid state reliability AlInGaP LED technology Excellent uniformity of light output Package Dimensions 5.46 (0.215) 4.95 (0.195) 5.18 (0.204) 4.93 (0.194) 0.46 (0.018) SQ. NOMINAL 2.54 (0.100) NOMINAL CATHODE LEAD 25.40 (1.00) MIN. BOTTOM VIEW 8.00 (0.315) 7.37 (0.290) 2.23 (0.088) 1.98 (0.078) 1.27 (0.50) NOMINAL 2.41 (0.100) 2.03 (0.085) NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. AN EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. 3. THERE IS A MXIMUM 1 TAPER FROM BASE TO THE TOP OF LAMP. SIDE VIEW Broadcom AV02-1563EN September 9, 2021 HLMP-S100, HLMP-S201, HLMP-S301, HLMP-S400, HLMP-S401, HLMP-S501 Data Sheet 2 mm × 5 mm Rectangular LED Lamps Device Selection Guide Luminous Intensity IV (mcd) at 20 mA Color Part Number Min. Typ. Max. Deep Red HLMP-S100 3.8 7.5 — Red HLMP-S201 3.8 7.5 — HLMP-S201-D00xx 2.4 3.5 — HLMP-S400 2.4 3.5 — HLMP-S401 3.8 7.5 — HLMP-S301 2.5 4.0 — HLMP-S301-B00xx 1.6 2.1 — HLMP-S301-C00xx 2.5 4.0 — HLMP-S501 4.7 8.0 — HLMP-S501-C00xx 2.9 4.0 — HLMP-S501-D00xx 4.7 8.0 — Orange Yellow Green Absolute Maximum Ratings at TA = 25°C Parameter Deep Red Red/Orange Green/Yellow Unit 300 90 60 mA 20 25 20 mA 30 30 20 mA Peak Forward Current Average Forward Current a DC Currentb 110 110 110 °C Operating Temperature Range LED Junction Temperature –20 to +100 –40 to +100 –40 to +100 °C Storage Temperature Range –40 to +100 –40 to +100 –40 to +100 °C a. See Figure 5 to establish pulsed operating conditions. b. For Deep Red, Red, Orange, and Green series, derate linearly from 50°C at 0.5 mA/°C. For Yellow series, derate linearly from 50°C at 0.34 mA/°C. Broadcom AV02-1563EN 2 HLMP-S100, HLMP-S201, HLMP-S301, HLMP-S400, HLMP-S401, HLMP-S501 Data Sheet 2 mm × 5 mm Rectangular LED Lamps Electrical/Optical Characteristics at TA = 25°C Description Included Angle Between Half Luminous Intensity Points Peak Wavelength Dominant Wavelength Speed of Response Capacitance Thermal Resistance Forward Voltage Symbol 2θ1/2 p d S C RθJ-PIN VF Device HLMP- Min. Typ. Max. Unit All — 110 — Deg. Deep Red — 660 — nm Measurement at Peak Red — 632 — Orange — 610 — Yellow — 590 — Green — 570 — Deep Red — 640 — nm Red — 626 — See Note b Orange — 605 — Yellow — 589 — Green — 569 — Deep Red — 30 — ns Red — 90 — Time const, e–t/s Orange — 280 — Yellow — 90 — Green — 500 — pF VF = 0; f = 1 MHz Deep Red — 30 — Red — 11 — Orange — 4 — Yellow — 15 — Test Conditions IF = 20 mA See Note a Green — 18 — All — 260 — °C/W V IF = 20 mA Deep Red 1.6 2.0 2.4 Red/Orange 1.5 2.0 2.6 Yellow 1.5 2.0 2.6 Green 1.5 2.1 3.0 Junction to Cathode Lead at Seating Plane Reverse Breakdown Voltage VR All 5.0 — — V IR = 100 μA Luminous Efficacy V Deep Red — 65 — Im/W Red — 180 — See Note c Orange — 350 — Yellow — 500 — Green — 640 — a. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. b. The dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the single wavelength that defines the color of the device. c. The radiant intensity, Ie, in watts per steradian, can be found from the equation Ie = lV/V, where IV is the luminous intensity in candelas and V is luminous efficacy in lumens/watt. Broadcom AV02-1563EN 3 HLMP-S100, HLMP-S201, HLMP-S301, HLMP-S400, HLMP-S401, HLMP-S501 Data Sheet 2 mm × 5 mm Rectangular LED Lamps Part Numbering System H L M P - X1 X2 X3 X4 - X5 X6 X7 X8 X9 Code Description Option X1 Package Type S Rectangular 2 mm x 5 mm X2 Color 1 Deep Red 2 Red 3 Yellow 4 Orange 5 Green 00 Less Brightness 01 Higher Brightness X3 X4 Brightness Level X5 Minimum Intensity Bin Refer to Intensity Bin Limits table. X6 Maximum Intensity Bin 0 Open binning (No max IV bin limit) X7 Color Bin Selection 0 Full color bin range X8X9 Packaging Option 00 Bulk 02 Tape and Reel, Straight Leads Broadcom AV02-1563EN 4 HLMP-S100, HLMP-S201, HLMP-S301, HLMP-S400, HLMP-S401, HLMP-S501 Data Sheet 2 mm × 5 mm Rectangular LED Lamps Bin Information Intensity Range (mcd) Intensity Bin Limits Color Bin Min. Max. Yellow B C D E F G H I J K L M N O P Q R S T U V W A B C D E F G H I J K L M N O P Q R S T U V W 1.6 2.5 4.0 6.5 10.3 16.6 26.5 42.3 67.7 108.2 173.2 250.0 360.0 510.0 800.0 1250.0 1800.0 2900.0 4700.0 7200.0 11700.0 18000.0 1.1 1.8 2.9 4.7 7.6 12.0 19.1 30.7 49.1 78.5 125.7 201.1 289.0 417.0 680.0 1100.0 1800.0 2700.0 4300.0 6800.0 10800.0 16000.0 25000.0 2.5 4.0 6.5 10.3 16.6 26.5 42.3 67.7 108.2 173.2 250.0 360.0 510.0 800.0 1250.0 1800.0 2900.0 4700.0 7200.0 11700.0 18000.0 27000.0 1.8 2.9 4.7 7.6 12.0 19.1 30.7 49.1 78.5 125.7 201.1 289.0 417.0 680.0 1100.0 1800.0 2700.0 4300.0 6800.0 10800.0 16000.0 25000.0 40000.0 Intensity Range (mcd) Color Red/Orange Bin Min. Max. D E F G H I J K L M N O P Q R S T U V W X Y Z 2.4 3.8 6.1 9.7 15.5 24.8 39.6 63.4 101.5 162.4 234.6 340.0 540.0 850.0 1200.0 1700.0 2400.0 3400.0 4900.0 7100.0 10200.0 14800.0 21400.0 3.8 6.1 9.7 15.5 24.8 39.6 63.4 101.5 162.4 234.6 340.0 540.0 850.0 1200.0 1700.0 2400.0 3400.0 4900.0 7100.0 10200.0 14800.0 21400.0 30900.0 Green Maximum tolerance for each bin limit is ±18%. Broadcom AV02-1563EN 5 HLMP-S100, HLMP-S201, HLMP-S301, HLMP-S400, HLMP-S401, HLMP-S501 Data Sheet 2 mm × 5 mm Rectangular LED Lamps Color Categories Color Category # Min. Max. Green 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 Yellow Color Category # Min. Max. 1 597.0 599.5 2 599.5 602.0 3 602.0 604.5 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5 Orange Tolerance for each bin limit is ±0.5 nm. Packaging Option Matrix Packaging Option Code Definition 00 Bulk Packaging, minimum increment 500 pieces/bag 02 Tape and Reel, straight leads, minimum increment 1300 pieces/reel NOTE: All categories are established for classification of products. Products might not be available in all categories. Contact your local Broadcom representative for further clarification/information. Figure 1: Relative Intensity vs. Wavelength 1 GREEN RELATIVE INTENSITY 0.9 YELLOW ORANGE 600 620 RED DEEP RED 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 500 520 540 560 580 640 660 680 700 WAVELENGTH - nm Broadcom AV02-1563EN 6 HLMP-S100, HLMP-S201, HLMP-S301, HLMP-S400, HLMP-S401, HLMP-S501 Data Sheet 2 mm × 5 mm Rectangular LED Lamps Figure 2: Forward Current vs. Forward Voltage Figure 3: Relative Luminous Intensity vs. DC Forward Current 1.6 GREEN, ORANGE 1.4 25 GREEN DEEP RED, RED, ORANGE YELLOW 20 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) FORWARD CURRENT - mA 30 15 10 5 DEEP RED 1.2 1 RED, YELLOW 0.8 0.6 0.4 0.2 0 0 1 2 3 0 FORWARD VOLTAGE - V 10 30 4 100 Hz RATIO OF MAXIMUM PEAK CURRENT TO TEMPERATURE DERATED MAXIMUM DC CURRENT ATE – 5 3 1 10 100 z tP – PULSE DURATION – s RED, ORANGE, YELLOW, and GREEN 300 H 1 10,000 1 KHz z 1000 10 KH IPEAK MAX. IDC MAX. 2 3 KHz IPEAK MAX. IDC MAX. 10 9 8 7 6 SH R 1.5 100 25 EFRE z z 100 H z 300 H 1 KHz 3 KHz z 10 KH Hz 30 KH 100 K 2.0 10 20 f–R 3.0 1 15 Figure 5: Maximum Tolerable Peak Current vs. Peak Duration (IPEAK MAX determined from temperature derated IDC MAX.) 4.0 RATIO OF MAXIMUM TOLERABLE PEAK CURRENT TO MAXIMUM TOLERABLE DC CURRENT 5 DC FORWARD CURRENT - mA Figure 4: Maximum Tolerable Peak Current vs. Peak Duration (IPEAK MAX determined from temperature derated IDC MAX.) 1.0 0 1000 10000 tp – PULSE DURATION – s DEEP RED Figure 6: Relative Luminous Intensity vs. Angular Displacement 20 30 40 50 10 0 1.0 0.8 0.6 60 70 80 90 Broadcom 0.4 0.2 10 20 30 40 50 60 70 80 90 100 AV02-1563EN 7 HLMP-S100, HLMP-S201, HLMP-S301, HLMP-S400, HLMP-S401, HLMP-S501 Data Sheet 2 mm × 5 mm Rectangular LED Lamps Precautions  Lead Forming    The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. For better control, use the proper tool to precisely form and cut the leads to applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into the LED package. Use this method for the hand soldering operation, because the excess lead length also acts as small heat sink. Soldering and Handling   Take care during the PCB assembly and soldering process to prevent damage to the LED component. The LED component may be effectively hand soldered to the PCB. However, do this under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED. 1.59 mm   Apply ESD precautions on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Refer to Broadcom application note AN 1142 for details. The soldering iron used must have a grounded tip to ensure electrostatic charge is properly grounded. Recommended soldering condition. Wave Manual Solder Dipping Solderinga, b Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time 105°C max. 60s max. 250°C max. 3s max. — — 260°C max. 5s max. a. The preceding conditions refer to measurement with a thermocouple mounted at the bottom of the PCB. b. Use only bottom pre-heaters to reduce thermal stress experienced by LED. Broadcom Set and maintain wave soldering parameters according to the recommended temperature and dwell time. Perform daily checks on the soldering profile to ensure that it always conforms to the recommended soldering conditions. NOTE: 1. PCBs with different size and design (component density) will have a different heat mass (heat capacity). This might cause a change in temperature experienced by the board if the same wave soldering setting is used. Therefore, recalibrate the soldering profile again before loading a new type of PCB. 2. Take extra precautions during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceed 3s. Overstressing the LED during the soldering process might cause premature failure to the LED due to delamination.  Loosely fit any alignment fixture that is being applied during wave soldering and do not apply weight or force on the LED. Use non-metal material because it will absorb less heat during the wave soldering process.  At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, allow the PCB to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet.  If the PCB board contains both through-hole (TH) LED and other surface-mount components, solder surfacemount components on the top side of the PCB. If the surface mount must be on the bottom side, solder these components using reflow soldering prior to the insertion of the TH LED.  The recommended PC board plated through holes (PTH) size for LED component leads follows. LED Component Lead Size Diagonal Plated Through-Hole Diameter 0.457 × 0.457 mm (0.018 × 0.018 in.) 0.646 mm (0.025 in.) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 in.) 1.049 to 1.150 mm (0.041 to 0.045 inch)  Oversizing the PTH can lead to a twisted LED after clinching. On the other hand, undersizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN1027 for more information about soldering and handling of TH LED lamps. AV02-1563EN 8 HLMP-S100, HLMP-S201, HLMP-S301, HLMP-S400, HLMP-S401, HLMP-S501 Data Sheet 2 mm × 5 mm Rectangular LED Lamps Figure 7: Example of Wave Soldering Temperature Profile for TH LED LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) 100 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 50 PREHEAT Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) 0 Broadcom 10 20 30 40 50 60 TIME (SECONDS) 70 80 90 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. AV02-1563EN 9 Copyright © 2015–2021 Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Inc. and/or its subsidiaries. For more information, go to www.broadcom.com. All trademarks, trade names, service marks, and logos referenced herein belong to their respective companies Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. Lead (Pb) Free RoHS Compliant