HLMP-Y701-G0000

HLMP-Yxxx T-1 (3 mm) AlInGaP LED Lamps Data Sheet Description Features This family of T-1 lamps is widely used in general purpose indicator and back lighting applications. The optical design is balanced to yield superior light output and wide viewing angles. Several intensity choices are available in each color for increased design flexibility. • High luminous intensity output Applications • Status indicator • Backlighting front panels • Light pipe sources • Low power consumption • Choice of bright colors – Deep Red – Red – Red-Orange – Orange – Amber – Green • High efficiency • Lighted switches • Versatile mounting on PCB or panel • I.C. Compatible/low current requirement • Popular T-1 diameter package • Reliable and rugged • RoHS compliant Package Dimension 5.2 0.205 4.1 ± 0.2 0.161 ± 0.008 24.0 (MIN) 0.945 1.0 (MAX) 0.04 CATHODE 3.8 3.5 3.1 ± 0.2 0.15 0.138 0.122 ± 0.008 1.0 (MIN) 0.04 2.54 0.1 0.45 x 0.4 TYP (0.018 x 0.016) Notes: 1. All dimensions are in millimeter (inches). 2. Tolerance is ±0.25mm (.010) unless otherwise stated. 3. Lead spacing is measured where the leads emerge from the package. Selection Guide Luminous Intensity, Iv (mcd) @ 20 mA Color Part Number Package Description Min. Typ. Deep Red HLMP-Y651-G00xx Untinted, Non-diffused 140 300 Red HLMP-Y601-J00xx Untinted, Non-diffused 240 680 Red-Orange HLMP-Y951-K00xx Untinted, Non-diffused 310 680 Yellow Orange HLMP-Y901-J00xx Untinted, Non-diffused 240 680 HLMP-Y902-J00xx Tinted, Non-diffused 240 680 Amber HLMP-Y701-G00xx Untinted, Non-diffused 140 400 Green HLMP-Y802-F00xx Tinted, Non-diffused 110 240 Part Numbering System HLMP - Y x x x - x x x xx Mechanical Options 00: Bulk Color Bin Options 0: Full Color Bin Distribution Maximum IV Bin Options 0: Open (no max. limit) Others: Please refer to the IV Bin Table Minimum IV Bin Options Please refer to the IV Bin Table 2 Max. Viewing Angle, 2θ½ (°) 45 Absolute Maximum Ratings at TA = 25°C Parameter HLMP-Yxxx Units DC Forward Current 20 mA Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) 60 mA Reverse Voltage (IR = 100µA) 5 V Junction Temperature 110 °C Power Dissipation 48 mW Storage Temperature Range -40 to +100 °C Operating Temperature Range -40 to +100 °C Electrical /Optical Characteristic at TA = 25°C Description Symbol Part Number Min. Typ. Peak Wavelength λPEAK HLMP-Y651 HLMP-Y601 HLMP-Y951 HLMP-Y90x HLMP-Y701 HLMP-Y802-F00xx Dominant Wavelength λd HLMP-Y651 HLMP-Y601 HLMP-Y951 HLMP-Y90x HLMP-Y701 HLMP-Y802-F00xx Spectrum Half Width ∆λ HLMP-Y651 HLMP-Y601 HLMP-Y951 HLMP-Y90x HLMP-Y701 HLMP-Y802-F00xx 15 15 17 17 15 11 Forward Voltage VF HLMP-Y651 HLMP-Y601 HLMP-Y951 HLMP-Y90x HLMP-Y701 HLMP-Y802-F00xx 2.0 2.0 2.0 2.0 2.0 2.1 Max. 652 633 622 611 595 575 635.0 620.0 610.0 599.5 582.0 564.5 638.0 627.0 615.0 605.0 592.0 572.0 646.0 635.0 620.0 610.5 597.0 576.5 Units Test Conditions nm Measurement at peak nm Note 1 nm 2.2 2.2 2.2 2.4 2.2 2.4 V Notes: 1. The dominant wavelength, λd, is derived from the Chromaticity Diagram and represents the color of the lamp. 3 IF = 20mA (Figure 1) 1 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) FORWARD CURRENT-mA 20 18 16 14 12 10 8 6 4 2 0 GREEN DEEP RED, RED RED-ORANGE, AMBER YELLOW-ORANGE 0 0.5 1 1.5 FORWARD VOLTAGE-V 2 0.4 0.2 0 0 5 10 15 DC FORWARD CURRENT - mA 1 NORMALIZED INTENSITY 20 15 10 5 0 10 20 30 40 50 60 70 80 90 100 110 AMBIENT TEMPERATURE - °C Figure 3. Ambient Temperature vs. Maximum DC Forward Current. 0.75 0.5 0.25 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 4. Relative Luminous Intensity vs. Angular Displacement for HLMP-Y651, HLMP-Y601, HLMP-Y951 and HLMP-Y701. NORMALIZED INTENSITY 1 0.75 0.5 0.25 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 5. Relative Luminous Intensity vs. Angular Displacement for HLMP-Y90x and HLMP-Y80x. 4 20 Figure 2. Relative Luminous Intensity vs. Forward Current. 25 FORWARD CURRENT - mA 0.6 2.5 Figure 1. Forward Current vs. Forward Voltage. 0 0.8 90 Figure 6. Wavelength vs. Relative Luminous Intensity. 90 Precautions: Intensity Bin Limits Intensity Range (mcd) Assembly method: Bin Min. Max. F 110.0 140.0 G 140.0 180.0 H 180.0 240.0 J 240.0 310.0 K 310.0 400.0 L 400.0 520.0 M 520.0 680.0 N 680.0 880.0 P 880.0 1150.0 Q 1150 1500 This product is not meant for auto-insertion. Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. Tolerance for each bin limit is 15%. Color Bin Limits Table Lambda (nm) Color Category # Min. Max. Red-Orange 1 610.5 613.5 2 613.5 616.5 3 616.5 619.5 2 599.5 602.0 3 602.0 604.5 4 604.5 607.5 5 607.5 610.5 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 7 594.5 597.0 2 573.5 576.5 3 570.5 573.5 4 567.5 570.5 5 564.5 567.5 YellowOrange Amber Green Tolerance for each bin limit is ±1.0 nm. 5 • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • During lead forming, the leads should be bent at a point at least 3mm from the base of the lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering at normal temperature. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Precautions: (cont.) Soldering Conditions: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: Wave Soldering Manual Solder Dipping Pre-heat Temperature 105°C Max. – Pre-heat Time 60 sec Max. – Peak Temperature 250°C Max. 260°C Max. Dwell Time 3 sec Max. 5 sec Max. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. • Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: Diagonal Plated Through Hole Diameter 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 LED Component Lead Size Flux: Rosin flux TEMPERATURE (°C) 200 Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 150 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 50 PREHEAT 0 10 20 30 40 60 50 TIME (SECONDS) 70 80 90 100 Figure 7. Recommended wave soldering profile. Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, fo all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. AV02-1664EN - July 26, 2014