HLMP-Y801-JPP00

HLMP Y601/ Y651/Y701/Y801/ Y802/Y901/Y951 T-1 (3mm) AlInGaP LED Lamps Data Sheet Description Failure Rate Prediction The following cumulative test results have been obtained from testing performed at Avago Technologies in accordance with the latest revision of JEDEC stds. Avago tests parts at the absolute maximum rated conditions recommended for the device. The actual performance you obtain from Avago parts depends on the electrical and environmental characteristics of your application but will probably be better than the performance outlined in Table 1. The junction temperature of the device determines the failure rate of semiconductor devices. The relationship between ambient temperature and actual junction temperature is given by the following: TJ(°C) = TA(°C) + θJAPAVG where TA = ambient temperature in °C θJA = thermal resistance of junction-to-ambient in °C/Watt PAVG = average power dissipated in Watt The estimated MTBF and failure rate at temperatures lower than the actual stress temperature can be determined by using an Arrhenius model for temperature acceleration. Results of such calculations are shown in the table below using activation energy of 0.43V. Table 1. Life Tests Demonstrated Performance Performance in Time (60% confidence) Colors Stress Test Conditions Green/Yellow/Amber/Red/ TA = +75°C DeepRed/Red Orange If = 20mA Total Device Hrs Units Tested Units Failed MTBF[1] Failure Rate (%/1K Hours) 84,000 84 0 91700 1.091 Table 2. Reliability Predictions Demonstrated Performance Performance in Time (60% Confidence) Performance in Time (90% Confidence) Ambient Temperature (°C) Junction Temperature[3] (°C) MTBF [1] Failure Rate [2] (%/1K Hours) MTBF Failure Rate (%/1K Hours) 85 110 86100 1.161 34300 2.915 80 109 88800 1.126 35400 2.825 75 108 91700 1.091 36500 2.740 70 103 109100 0.917 43400 2.304 65 98 130500 0.766 52000 1.923 60 93 156900 0.637 62400 1.603 55 88 189500 0.528 75400 1.326 50 83 230200 0.434 91600 1.092 45 78 281200 0.356 111900 0.894 40 73 345400 0.290 137500 0.727 35 68 426800 0.234 169900 0.589 30 63 530800 0.188 211300 0.473 25 58 664600 0.150 264500 0.378 Notes: [1] The 60% or 90% confidence MTBF represents the minimum level of reliability performance which is expected from 60% or 90% of all samples. The confidence level is established based on the chi-square distribution. [2] Failure rate (%/1K Hours) is 1/MTBF x 105, assuming the failures are exponentially distributed. [3] Data generated based on 55°C, 20mA and θJA = 780°C/W Example of Failure Rate Calculation Assume a device operating 8 hours/day, 5 days/week. The utilization factor, given 168hours/week is: (8hous/day) x (5 days/week) / (168 hours/week) = 0.25 The point failure rate per year (8760 hours) at 75°C ambient temperature is: (1.091% / 1K hours) x 0.25 x (8760 hours/year) = 2.39% per year Similarly, 90% confidence level failure rate per year at 75°C:  (2.74% / 1K hours) x 0.25 x (8760 hours/year) = 6.00% per year. Table 3. Environmental Tests Test Name Test Conditions Units Tested Units Failed Temperature Cycle -55°C/+100°C, 15 mins dwell, 5 mins transfer, 100 cycles 918 0 Low Temperature Operating Life -40°C, 20mA, 1000hrs 84 0 High Humidity and High Temperature Operating Life 85°C/85%RH, 15mA, 1000hrs 84 0 High Humidity and High Temperature Reverse Bias 85°C/85%RH, 5VRB, 500hrs 84 0 High Humidity and High Temperature Storage Life 85°C/85%RH, 1000hrs 84 0 High Temperature Storage Life 100°C, 1000hrs 84 0 Low Temperature Storage Life -55°C, 1000hrs 84 0 Test Name Test Conditions Units Tested Units Failed Solder Heat resistance 260°C for 5 secs 66 0 Solderability 8 hrs steam age, Solder dip at 245+/- 5°C, 5 secs 30 0 Table 4. Other Tests For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0935EN - December 28, 2007