HLPD-B0F0-00000

Data Sheet HLPD-B0F0-00000 Silicon PIN Photodiode Features Applications        5mm radial package Black epoxy package Spectral range of sensitivity (λ0.1) 700nm to 1100nm Broadcom Smart meter Industrial automation Smoke detector Light curtain HLPD-B0F0-DS May 12, 2021 HLPD-B0F0-00000 Data Sheet Silicon PIN Photodiode Figure 1: Package Drawing NOTE: 1. All dimensions in millimeters (mm). 2. Tolerance is ±0.25mm unless otherwise specified. 3. Lead spacing is measured at where the leads emerge from the body. 4. Epoxy meniscus may extend up to maximum 1.00mm down the leads. Broadcom HLPD-B0F0-DS 2 HLPD-B0F0-00000 Data Sheet Silicon PIN Photodiode Device Selection Guide (TJ = 25°C) Reverse Light Current, Ira (µA) Part Number HLPD-B0F0-00000 Test conditions Min. Typ. 35 46 Ee = 1mW/cm2, λ = 940nm, VR = 5V Absolute Maximum Ratings Parameters Rating Unit Reverse Voltage 20 V Power Dissipation 150 mW Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +100 °C Optical and Electrical Characteristics (TJ = 25°C) Parameter Wavelength of Peak Sensitivity Spectral Range of Sensitivity Symbol λS max Min. λ0.1 700 Typ. 960 Max. Units nm Test Conditions 1100 nm 30 nA VR =10V, Ee = 0mW/cm2 ° Angle of Sensitivity φ ±20 Reverse Dark Current Iro 1 Open Circuit Voltage VOC 355 mV Ee = 1mW/cm2, λ = 940nm Short Circuit Current ISC 33 µA Ee = 1mW/cm2, λ = 940nm Temperature coefficient of VOC TCVOC -2.92 mV/°C Ee = 1mW/cm2, λ = 940nm Temperature coefficient of ISC TCISC -0.71 %/°C Ee = 1mW/cm2, λ = 940nm Forward Voltage VF 0.86 V IF =10mA Diode Capacitance CO 6.0 pF VR =0V, f = 1MHz, Ee = 0mW/cm2 Broadcom HLPD-B0F0-DS 3 HLPD-B0F0-00000 Data Sheet Silicon PIN Photodiode Figure 2: Relative Sensitivity vs. Wavelength Figure 3. Relative Sensitivity vs. Angular Displacement. 1 1.0 0.9 0.8 RELATIVE SENSITIVITY RELATIVE SENSITIVITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.6 0.4 0.2 0.1 0 0.0 700 800 900 1000 WAVELENGTH - nm 1100 Figure 4. Reverse Light Current vs Irradiance. -90 REVERSE DARK CURRENT, Iro - nA REVERSE LIGHT CURRENT, Ira -µA 100 100 λ = 940nm VR = 5V 10 1 0.1 0.01 10 Ee = 0mW/cm² 1 0 0 0.1 1 IRRADIANCE, Ee -mW/cm2 10 Figure 6. Reverse Dark Current vs Ambient Temperature 0 5 10 15 REVERSE VOLTAGE, VR- V 20 Figure 7. Relative Reverse Light Current vs Ambient Temperature 1000 1.40 RELATIVE REVERSE LIGHT CURRENT, Ira REVERSE DARK CURRENT, Iro- nA 90 Figure 5. Reverse Dark Current vs Reverse Voltage 1000 100 10 VR = 10V Ee = 0mW/cm² 1 0.1 0 Broadcom -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 20 40 60 AMBIENT TEMPERATURE - °C 80 100 1.20 1.00 VR = 5V Ee = 1mW/cm² λ = 940nm 0.80 0.60 0.40 0.20 0.00 -40 -20 0 20 40 60 AMBIENT TEMPERATURE - °C 80 100 HLPD-B0F0-DS 4 HLPD-B0F0-00000 Data Sheet Silicon PIN Photodiode Figure 8. Diode Capacitance vs Reverse Voltage DIODE CAPACITANCE, CO - pF 8 7 6 5 4 Ee = 0mW/cm² f = 1MHz 3 2 1 0 0.01 Broadcom 0.1 1 10 REVERSE VOLTAGE, VR - V 100 HLPD-B0F0-DS 5 HLPD-B0F0-00000 Data Sheet Silicon PIN Photodiode Precautionary Notes            Set and maintain the wave soldering parameters according to the recommended temperature and dwell time. Perform daily check on the profile to ensure that it is always conforming to the recommended conditions. Exceeding these conditions will over-stress the package and cause premature failures. Use only bottom preheaters to reduce thermal stress experienced by the package. Recalibrate the soldering profile before loading a new type of PCB. PCB with different size and design (component density) will have different heat capacity and might cause a change in temperature experienced by the PCB if the same wave soldering setting is used Do not perform wave soldering more than once. Any alignment fixture used during wave soldering must be loosely fitted and must not apply stress on the package. Use non-metal material as it will absorb less heat during the wave soldering process. At elevated temperature, the package is more susceptible to mechanical stress. Allow the package to be sufficiently cooled to room temperature before handling. Do not apply stress to the package when it is hot. Use wave soldering to solder the package. Use hand soldering only for rework or touch up if unavoidable, but it must be strictly controlled to following conditions: − Soldering iron tip temperature = 315°C max. − Soldering duration = 2sec max. − Number of cycle = 1 only − Power of soldering iron = 50W max. Do not touch the package body with the soldering iron except for the soldering terminals as it may cause damage to the package. Confirm beforehand whether the functionality and performance of the package is affected by soldering with hand soldering. Keep the heat source at least 1.6mm away from the package body during soldering. Design appropriate hole size to avoid problem during insertion or clinching (for auto-insertable devices). Broadcom Figure 9: Recommended PCB Through Hole Size ∅1.05 ±0.05mm 2.54mm Figure 10: Recommended Wave Soldering Profile 5 SEC. MAX. 260°C MAX. TEMPERATURE Soldering and Handling Precautions 105°C MAX. 60 SEC. MAX. TIME NOTE: Refers to measurements with thermocouple mounted at the bottom of the PCB. Lead Forming     To pre-form or cut the leads prior to insertion and soldering onto PCB, use proper tool instead of doing it manually. Do not bend the leads at location less than 3mm from the package body. Do not use the base of the package body as fulcrum for lead bending. Secure the leads properly before bending. If manual lead cutting is unavoidable, cut the leads after soldering to reduce stress to the package body. HLPD-B0F0-DS 6 HLPD-B0F0-00000 Data Sheet Silicon PIN Photodiode Application Precautions   Avoid rapid change in ambient temperature, especially in high-humidity environments, because they cause condensation on the package. If the package is intended to be used in harsh or outdoor environment, protect the pakage against damages caused by rain water, water, dust, oil, corrosive gases, external mechanical stresses, and so on. Broadcom HLPD-B0F0-DS 7 Disclaimer Broadcom’s products and software are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical devices or applications. The customer is solely responsible, and waives all rights to make claims against Broadcom or its suppliers, for all loss, damage, expense, or liability in connection with such use. Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries and/or the EU. Copyright © 2021 by Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Inc. and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. Lead (Pb) Free RoHS compliant