HSMA-C265

AgilentHSMx-C120/C177/C197/C265 High Performance Chip LEDs Data Sheet Description These chip type LEDs utilize Aluminium Indium Galium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available colors in this surface mount series are 592 nm Amber, 605 nm Orange, 626 nm Red and 639 nm Deep Red. All packages are binned by both color and intensity, except for red and deep red color. Features • High brightness AlInGaP material • 0805 or 0603 industry standard footprint with 0.4 mm height for top emitting packages • Also available in right angle emitting and reverse mounting packages • Diffused optics • Operating temperature range of –30°C to +85°C • Compatible with IR soldering • Available in 4 colors • Available in 8 mm tape on 7" diameter reel • Reel sealed in zip locked moisture barrier bags emitting package (HSMx-C120) or in a reverse mount package (HSMx-C265). The right angle ChipLED is suitable for applications such as LCD back lighting. The top emitting ChipLEDs with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. The reverse mount ChipLED is suitable for space saving. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel for HSMxC120/C177/C197 and 3000 units per reel for HSMx-C265. These ChipLEDs come either in low profile top emitting packages (HSMx-C177/C197), in a side These packages are compatible with IR soldering process. Device Selection Guide Dimensions (mm)[1,2] Amber 1.6 x 0.6 x 1.0 HSMA-C120 2.0 x 1.25 x 0.4 HSMA-C177 1.6 x 0.8 x 0.4 HSMA-C197 3.4 x 1.25 x 1.1 HSMA-C265 Red HSMC-C120 HSMC-C177 HSMC-C197 HSMC-C265 Orange HSML-C120 HSML-C177 HSML-C197 HSML-C265 Applications • Membrane switch indicator • LCD backlighting • Push button backlighting • Front panel indicator • Symbol backlighting • Keypad backlighting • Microdisplays • Small message panel signage Deep Red – HSMT-C177 HSMT-C197 HSMT-C265 Package Untinted, Untinted, Untinted, Untinted, Description Non-diffused Diffused Diffused Non-diffused Package Dimensions CATHODE MARK CATHODE MARK LED DIE LED DIE 0.40 (0.016) 1.25 (0.049) 2.00 (0.079) 0.80 (0.031) 0.62 (0.025) POLARITY DIFFUSED EPOXY 1.60 (0.063) POLARITY DIFFUSED EPOXY 0.40 (0.016) 0.40 (0.016) PC BOARD 0.16 (0.006) PC BOARD CATHODE LINE 0.16 (0.006) 0.30 ± 0.15 (0.012 ± 0.006) CATHODE LINE 0.40 ± 0.15 (0.016 ± 0.006) 0.40 ± 0.15 (0.016 ± 0.006) 0.70 (0.028) MIN. 1.10 (0.043) MIN. SOLDERING TERMINAL HSMx-C197 SOLDERING TERMINAL HSMx-C177 3.4 (0.134) CATHODE MARK (ANODE MARK FOR HSMH-C120) LED DIE CATHODE MARK (ETCHED) LED DIE 1.25 (0.049) 0.3 (0.012) 1.6 (0.063) 0.6 (0.024) GREEN SOLDER MASK POLARITY POLARITY 1.2 (0.047) CLEAR EPOXY UNDIFFUSED EPOXY 1.2 (0.047) 1.1 (0.043) 1.0 (0.039) PC BOARD 1.1 (0.043) PC BOARD 0.3 (0.012) 0.5 (0.020) CATHODE LINE 3 – 0.3 (0.012) CATHODE LINE SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C120 HSMx-C265 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 2 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) Absolute Maximum Ratings at TA = 25˚C Parameter HSMx-Cxxx Units 25 mA Peak Pulsing Current[2] 100 mA Power Dissipation 60 mW Reverse Voltage (IR = 100 µA) 5 V LED Junction Temperature 95 ˚C Operating Temperature Range –30 to +85 ˚C Storage Temperature Range –40 to +85 ˚C Soldering Temperature See reflow soldering profile (Figures 8 & 9) DC Forward Current [1] Notes: 1. Derate linearly as shown in Figure 4. 2. Pulse condition of 1/10 duty and 0.1 ms width. Electrical Characteristics at TA = 25˚C Part Number HSMA-C120 HSMA-C177/197 HSMA-C265 HSMC-C120 HSMC-C177/197 HSMC-C265 HSML-C120 HSML-C177/197 HSML-C265 HSMT-C177/197 HSMT-C265 VF Tolerance: ± 0.1 V 3 Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 1.9 2.4 1.9 2.4 1.9 2.4 1.9 2.4 1.9 2.4 1.9 2.4 1.9 2.4 1.9 2.4 1.9 2.4 1.9 2.4 1.9 2.4 Reverse Breakdown VR (Volts) @ IR = 100 µA Min. 5 5 5 5 5 5 5 5 5 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 11 11 11 15 15 15 20 20 20 15 15 Thermal Resistance RθJ–PIN (˚C/W) Typ. 400 300 550 400 300 550 400 300 550 300 550 Optical Characteristics at TA = 25˚C Part Number Color Luminous Intensity IV (mcd) @ 20 mA[1] Min. Typ. HSMA-C120 HSMA-C177/197 HSMA-C265 HSMC-C120 HSMC-C177/197 HSMC-C265 HSML-C120 HSML-C177/197 HSML-C265 HSMT-C177/197 HSMT-C265 Amber Amber Amber Red Red Red Orange Orange Orange Deep Red Deep Red 28.5 28.5 28.5 28.5 28.5 28.5 28.5 28.5 28.5 11.2 11.2 90 90 75 90 90 75 90 90 75 30 25 Color, Peak Wavelength λpeak (nm) Typ. Viewing Dominant Wavelength λd[2] (nm) Typ. Luminous Angle 2 θ1/2 Degrees[3] Typ. Efficacy ηV (lm/w) Typ. 595 595 595 637 637 637 609 609 609 660 660 592 592 592 626 626 626 605 605 605 639 639 155 130 150 155 130 150 155 130 150 130 150 480 480 480 155 155 155 370 370 370 70 70 Notes: 1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4 Color Bin Limits Bin ID A B C D E F Orange Color Bins[1] Dom. Wavelength (nm) Min. 597.0 600.0 603.0 606.0 609.0 612.0 Max. 600.0 603.0 606.0 609.0 612.0 615.0 Amber Color Bins[1] Dom. Wavelength (nm) Min. 582.0 584.5 587.0 589.5 592.0 594.5 Max. 584.5 587.0 589.5 592.0 594.5 597.0 Tolerance: ± 1 nm Bin ID A B C D E F Tolerance: ± 0.5 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Bin ID Min. Max. A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.00 285.00 T 285.00 450.00 U 450.00 715.00 V 715.00 1125.00 W 1125.00 1800.00 X 1800.00 2850.00 Y 2850.00 4500.00 Tolerance: ± 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 5 100 80 AS DEEP RED 70 AS ORANGE 60 50 40 30 20 10 0 500 1.2 600 650 700 AS AlInGaP 10 1 0 550 VF – FORWARD VOLTAGE – V 0.8 AS AMBER 0.6 AS ORANGE, RED, and DEEP RED 0.4 0.2 0 5 10 15 90 25 20 HSMx-C120/177/197 15 HSMx-C265 10 5 80 70 60 50 40 30 20 10 0 0 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 TA – AMBIENT TEMPERATURE – °C 10 20 30 40 50 60 70 80 90 ANGLE Figure 4. Maximum forward current vs. ambient temperature. 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C120. 6 25 30 Figure 3. Luminous intensity vs. forward current. 100 30 20 IF – FORWARD CURRENT – mA Figure 2. Forward current vs. forward voltage. RELATIVE INTENSITY IF MAX – MAXIMUM FORWARD CURRENT – mA 1.0 0 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength. 1.4 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) AS RED AS AMBER 90 IF – FORWARD CURRENT – mA RELATIVE INTENSITY – % 100 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative intensity vs. angle for HSMx-C177/197. 100 80 70 60 10 SEC. MAX. 50 40 TEMPERATURE RELATIVE INTENSITY – % 90 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 230°C MAX. 4°C/SEC. MAX. 140-160°C 10 20 30 40 50 60 70 80 90 OVER 2 MIN. ANGLE Figure 7. Relative intensity vs. angle for HSMx-C265. 3°C/SEC. MAX. 4°C/SEC. MAX. TIME Figure 8. Recommended reflow soldering profile. CENTERING BOARD 1.2 (0.047) 10 to 20 SEC. 255 °C (+5/-0) TEMPERATURE 217 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 100 - 150 °C 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) 60 to 150 SEC. MAX. 120 SEC. Figure 10. Recommended soldering pattern for HSMx-C177. TIME * THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX. CENTERING BOARD 0.8 (0.031) Figure 9. Recommended Pb-free reflow soldering profile. 0.8 (0.031) NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 7 0.7 (0.028) 0.8 (0.031) Figure 11. Recommended soldering pattern for HSMx-C197. 2.2 (0.087) DIA. PCB HOLE 0.4 (0.016) 0.4 (0.016) 0.7 (0.028) 1.25 (0.049) 0.15 (0.006) CENTERING BOARD 0.8 (0.031) 1.2 (0.047) 1.4 (0.055) 0.8 (0.031) Figure 12. Recommended soldering pattern for HSMx-C120. 2.3 (0.091) 1.4 (0.055) Figure 13. Recommended soldering pattern for HSMx-C265. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 14. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 15. Reel dimensions. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 8 6 PS 5.0 ± 0.5 (0.197 ± 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) HSMx-C120 POSITION IN CARRIER TAPE PART NUMBER HSMx-C120 SERIES HSMx-C177 SERIES HSMx-C197 SERIES DIM. A ± 0.10 (0.004) 1.90 (0.075) 2.30 (0.091) 1.80 (0.071) DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) 1.15 (0.045) 0.80 (0.031) 1.40 (0.055) 0.60 (0.024) 0.95 (0.037) 0.60 (0.024) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) HSMx-C120 R 0.5 ± 0.05 (0.020 ± 0.002) 4.00 (0.157) CATHODE 1.50 (0.059) DIM. C (SEE TABLE 1) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) PART NUMBER DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) Figure 16. Tape dimensions. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 9 COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) 1.30 (0.051) END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 17. Tape leader and trailer dimensions. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5988-5501EN April 22, 2004 5989-0551EN MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been open for more than 1 week Baking recommended condition: 60 ± 5°C for 20 hours.