HSMC-A401-U80M1

Data Sheet HSMx-A4xx-xxxxx SMT LED Surface-Mount LED Indicator Description The Broadcom® Power PLCC-4 is an extension of our PLCC2 SMT LEDs. The package can be driven at higher current due to its superior package design. The product is able to dissipate heat more efficiently compared to the conventional PLCC-2 SMT LEDs. In proportion to the increase in driving current, this family of LEDs is able to produce higher light output compared to the conventional PLCC-2 SMT LEDs. These SMT LEDs have higher reliability and better performance and are designed to work under a wide range of environmental conditions. This higher reliability makes them suitable for use under harsh environment and conditions like automotive. In addition, they are also suitable to be used in electronic signs and signals. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin (except for red color), to provide close uniformity. Features            Applications  These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they also can be mounted using through-the-wave soldering process. There are a variety of colors and various viewing angles (30°, 60°, and 120°) available in these SMT LEDs. Ideally, the 30° parts are suitable for light piping where focused intensities are required. As for the 60° and 120°, they are most suitable for automotive interior and exterior lighting and electronic signs applications. Broadcom Industry standard PLCC-4 High reliability LED package High brightness using AlInGaP and InGaN dice technologies High optical efficiency Higher ambient temperature at the same current possible compared to PLCC-2 Available in full selection of colors Super wide viewing angle at 120° Available in 8-mm carrier tape on 7-inch reel Compatible with both IR and TTW soldering process JEDEC MSL 2a High reliability LED package due to enhanced silicone resin material for InGaN family   Interior automotive – Instrument panel backlighting – Central console backlighting – Cabin backlighting – Navigation and audio system – Dome lighting – Push button backlighting Exterior automotive00 – Turn signals – CHMSL – Rear combination lamp – Puddle light Electronic signs and signals – Interior full color sign – Variable message sign AV02-0479EN September 10, 2019 HSMx-A4xx-xxxxx Data Sheet  SMT LED Surface-Mount LED Indicator Office automation, home appliances, industrial equipment – Front panel backlighting – Push button backlighting – Display backlighting Figure 1: Package Dimensions SOURCE 1 SOURCE 2 2.8 ± 0.2 1.9 ± 0.2 2.2 ± 0.2 A 0.1 TYP. C A 0.8 ± 0.1 C 3.2 ± 0.2 3.5 ± 0.2 0.8 ± 0.3 C C C C 0.5 ± 0.1 0.7 ± 0.1 CATHODE MARKING NOTE: CATHODE MARKING All dimensions in millimeters. Electrical connection between all cathodes is recommended. Device Selection Guide Min. IV (mcd)a Max. IV (mcd) Test Current (mA) Dice Technology HSMC-A400-S30M1 180.00 355.00 50 AlInGaP HSMC-A400-V00M1 715.00 — 50 AlInGaP HSMC-A401-U80M1 560.00 1400.00 50 AlInGaP HSMJ-A401-T40M1 285.00 715.00 50 AlInGaP Color Part Number Red Red Orange HSMJ-A401-U40M1 450.00 1125.00 50 AlInGaP HSMJ-A400-W00M1 1125.00 — 50 AlInGaP Orange HSML-A401-U40M1 450.00 1125.00 50 AlInGaP Amber HSMA-A401-U45M1 450.00 1125.00 50 AlInGaP HSMA-A400-V00M1 715.00 — 50 AlInGaP Emerald Green HSME-A401-P4PM1 45.00 112.50 50 AlInGaP Blue HSMN-A400-S8QM2 224.00 560.00 30 InGaN HSMN-A400-S8PM2 224.00 560.00 30 InGaN HSMN-A400-S4QM2 180.00 450.00 30 InGaN HSMN-A400-T8PM2 355.00 900.00 30 InGaN Green HSMM-A400-W8QM2 1400.00 3550.00 30 InGaN HSMM-A400-W8YM2 1400.00 3550.00 30 InGaN a. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. IV tolerance = ±12%. Broadcom AV02-0479EN 2 HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Part Numbering System HSM x1 – A x2 x3x4 – x5x6 x7 x8x9 Packaging Option Color Bin Selection Intensity Bin Select Device Specific Configuration Package Type LED Chip Color Absolute Maximum Ratings (TA = 25°C) Parameters a HSMC/J/L/A/E 70 DC Forward Current mAb, c HSMZ/V/U 70 mAb, c HSMM/N 30 mA Peak Forward Current 200 mA 200 mA 90 mA Power Dissipation 180 mW 240 mW 114 mW d Reverse Voltage Junction Temperature 5V 110°C Operating Temperature –40°C to +100°C Storage Temperature –40°C to +100°C a. Derate linearly as shown in Figure 6. b. Drive current between 10 mA and 70 mA is recommended for best long-term performance. c. Operation at currents below 5 mA is not recommended. d. Duty factor = 10%, Frequency = 1 kHz. Broadcom AV02-0479EN 3 HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Optical Characteristics (TA = 25°C) Peak Wavelength λPEAK (nm) Color Red Red Orange Orange Amber Part Number Typ. HSMC 635 Dominant Viewing Angle Wavelength λDa 2Θ1/2b (nm) (Degrees) Typ. Typ. 626 120 Luminous Efficacy ηVc (Im/ W) Typ. Luminous Intensity/Total Flux IV (mcd)/ΦV (mIm) Typ. 150 0.45 HSMZ 639 630 120 155 0.45 HSMJ 621 615 120 240 0.45 HSMV 623 617 120 263 0.45 HSML 609 605 120 320 0.45 HSMA 592 590 120 480 0.45 HSMU 594 592 120 500 0.45 Yellow Green HSME 576 575 120 560 0.45 Emerald Green HSME 568 567 120 610 0.45 Green HSMM 518 525 120 500 0.45 Blue HSMN 468 470 120 75 0.45 a. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device. b. Θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. c. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. Electrical Characteristics (TA = 25°C) Forward Voltage VF (Volts) at IF = 50 mA Part Number Reverse Voltage VR at 100 µA Typ. Max. Min. HSMC/J/L/A/E 2.2 2.5 5 HSMZ/V/U 2.8 3.4 5 Forward Voltage VF (Volts) at IF = 30 mA Part Number HSMM/N Broadcom Reverse Voltage VR at 10 µA Typ. Max. Min. 3.8 4.6 5 AV02-0479EN 4 HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Figure 2: Relative Intensity vs. Wavelength 1.0 YELLOW GREEN 0.8 RELATIVE INTENSITY EMERALD GREEN BLUE 0.9 GREEN 0.7 AMBER 0.6 0.5 ORANGE 0.4 RED ORANGE 0.3 RED 0.2 0.1 0 380 430 530 480 580 630 680 730 780 WAVELENGTH (nm) Figure 4: Relative Intensity vs. Forward Current (AlInGaP) 80 1.4 70 1.2 60 HSMC/J/L/A/E RELATIVE INTENSITY (NORMALIZED AT 50 mA) FORWARD CURRENT (mA) Figure 3: Forward Current vs. Forward Voltage HSMZ/V/U 50 40 30 20 10 0 1 2 3 4 0.8 0.6 0.4 0.2 HSMM/N 0 1.0 0 5 0 Figure 5: Relative Intensity vs. Forward Current (InGaN) 40 50 60 70 80 Figure 6: Maximum Forward Current vs. Ambient Temperature, Derated Based on TJmax = 110°C (AlInGaP) 1.2 80 MAXIMUM FORWARD CURRENT (mA) RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 30 mA) 30 FORWARD CURRENT (mA) FORWARD VOLTAGE (V) 1.0 0.8 0.6 0.4 0.2 0 20 10 0 5 10 15 20 25 30 35 70 60 300˚C/W 350˚C/W 50 40 470˚C/W 30 20 10 0 0 20 40 60 80 100 120 AMBIENT TEMPERATURE (˚C) FORWARD CURRENT (mA) Broadcom AV02-0479EN 5 HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Figure 7: Maximum Forward Current vs. Ambient Temperature, Derated Based on TJmax = 110°C (InGaN) Figure 8: Dominant Wavelength vs. Forward Current – InGaN Devices 540 30 DOMINANT WAVELENGTH (nm) MAXIMUM FORWARD CURRENT (mA) 35 300˚C/W 25 350˚C/W 20 470˚C/W 15 10 5 0 0 20 40 60 80 100 530 510 500 490 480 InGaN BLUE 470 460 120 InGaN GREEN 520 0 5 AMBIENT TEMPERATURE (˚C) 10 15 20 25 30 35 CURRENT (mA) Figure 9: Radiation Pattern 1.0 0.9 RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 –90 –70 –50 –30 –10 10 30 50 70 90 ANGLE (DEGREES) Broadcom AV02-0479EN 6 HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Figure 10: Recommended Soldering Pad Pattern X 2.60 (0.103) X 0.40 (0.016) 1.10 (0.043) 0.50 (0.020) Y 4.50 (0.178) 1.50 (0.059) Y DIMENSIONS IN mm (INCHES). SOLDER RESIST REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS Figure 11: Recommended Soldering Pad Pattern (TTW) X X 0.5 (0.020) 6.1 (0.240) 2.8 (0.110) Y 2.0 (0.079) 6.0 (0.236) 1.0 (0.039) 2.0 (0.079) 3.0 (0.118) DIMENSIONS IN mm (INCHES). Broadcom Y REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS AV02-0479EN 7 HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Figure 12: Recommended Pb-Free Reflow Soldering Profile 10 to 20 SEC. +5°C 255 °C –0°C TEMPERATURE 217°C 3°C/SEC. MAX. 125°C ±25°C 6°C/SEC. MAX. 60 to 150 SEC. MAX. 120 SEC. TIME * THE TIME FROM 25°C TO PEAK TEMPERATURE = 6 MINUTES MAX. NOTE: For detailed information on reflow soldering of Broadcom surface-mount LEDs, refer to Application Note AN 1060, Surface Mounting SMT LED Indicator Components. Figure 13: Tape Leader and Trailer Dimensions TRAILER 200 mm MIN. FOR Ø180 REEL. 200 mm MIN. FOR Ø330 REEL. COMPONENT LEADER 480 mm MIN. FOR Ø180 REEL. 960 mm MIN. FOR Ø330 REEL. C A USER FEED DIRECTION Broadcom AV02-0479EN 8 HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Figure 14: Tape Dimensions Ø1.5 +0.1 –0 4 ±0.1 2 ±0.05 B 3.6 ±0.1 1.75 ±0.1 5.5 ±0.05 A C C C A A 3.8 ±0.1 12 Ø1 8 ±0.1 +0.1 –0 +0.3 –0.1 B 0.229 ±0.01 3.45 ±0.1 VIEW B-B VIEW A-A ALL DIMENSIONS IN mm. Figure 15: Recommended Pb-Free Reflow Soldering Profile USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Broadcom AV02-0479EN 9 HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Bin Information Intensity Bin Select (X5X6) Intensity Bin Limits Individual reel will contain parts from one half bin only. X5 Min. IV Bin X6 0 Full Distribution 2 2 half bins starting from X51 3 3 half bins starting from X51 4 4 half bins starting from X51 5 Bin ID N1 Min. (mcd) 28.50 Max. (mcd) 35.50 N2 35.50 45.00 P1 45.00 56.00 P2 56.00 71.50 Q1 71.50 90.00 Q2 90.00 112.50 R1 112.50 140.00 R2 140.00 180.00 S1 180.00 224.00 5 half bins starting from X51 S2 224.00 285.00 6 2 half bins starting from X52 T1 285.00 355.00 7 3 half bins starting from X52 T2 355.00 450.00 8 4 half bins starting from X52 U1 450.00 560.00 9 5 half bins starting from X52 U2 560.00 715.00 V1 715.00 900.00 V2 900.00 1125.00 W1 1125.00 1400.00 Broadcom W2 1400.00 1800.00 X1 1800.00 2240.00 X2 2240.00 2850.00 Y1 2850.00 3550.00 Y2 3550.00 4500.00 Z1 4500.00 5600.00 Z2 5600.00 7150.00 11 7150.00 9000.00 12 9000.00 11250.00 AV02-0479EN 10 HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Color Bin Select (X7) Emerald Green Individual reel will contain parts from one half bin only. Min. (nm) Max. (nm) A 552.5 555.5 B 555.5 558.5 X7 C 558.5 561.5 0 Full Distribution D 561.5 564.5 Z A and B only Y B and C only W C and D only Yellow Green Min. (nm) Max. (nm) V D and E only A 564.5 567.5 U E and F only B 567.5 570.5 T F and G only C 570.5 573.5 S G and H only D 573.5 576.5 Q A, B, and C only P B, C, and D only N C, D, and E only M D, E, and F only A L E, F, and G only B 584.5 587.0 K F, G, and H, only C 587.0 589.5 1 A, B, C, and D only D 589.5 592.0 2 E, F, G, and H only E 592.0 594.5 3 B, C, D, and E only F 594.5 597.0 4 C, D, E, and F only 5 A, B, C, D, and E only 6 B, C, D, E, and F only Amber/Yellow 582.0 Orange A Color Bin Limits Blue A Min. (nm) 460.0 Max. (nm) 465.0 B 465.0 470.0 C 470.0 475.0 D 475.0 480.0 Green Min. (nm) Max. (nm) 584.5 Min. (nm) 597.0 Max. (nm) 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 Red Orange Min. (nm) Max. (nm) A 611.0 616.0 B 616.0 620.0 Max. (nm) A 515.0 520.0 B 520.0 525.0 C 525.0 530.0 D 530.0 535.0 Broadcom Min. (nm) Red Min. (nm) Max. (nm) Full Distribution NOTE: Tolerance of each bin limit = ±1 nm. AV02-0479EN 11 HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Forward Voltage Bin Table For HSMZ/V/U – A4xx-xxxxx only. Bin Min. Max. VA 1.9 2.2 VB 2.2 2.5 VC 2.5 2.8 VD 2.8 3.1 VE 3.1 3.4 Precautionary Notes Handling Precautions The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Special handling precautions need to be observed during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions for additional information.      Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond. Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs. The surface of the silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting much pressure on the silicone. Ultrasonic cleaning is not recommended. For automated pick and place, Broadcom has tested the following nozzle size to work well with this LED. However, due to the possibility of variations in other parameters, such as pick and place machine maker/ model and other settings of the machine, verify that the nozzle selected will not cause damage to the LED. Broadcom ID OD ID = 1.7 mm OD = 3.5 mm Handling of Moisture-Sensitive Devices This product has a Moisture Sensitive Level 2arating per JEDEC J-STD-020. Refer to Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures.    Before use: – An unopened moisture barrier bag (MBB) can be stored at < 40°C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, it is safe to reflow the LEDs per the original MSL rating. – Do not open the MBB d prior to assembly (IQC for example). Control after opening the MBB: – Read the HIC immediately upon opening the MBB. – Keep the LEDs at