HSMC-A461-V00M1

HSMx-A46x-xxxxx SMT LED Surface Mount LED Indicator Data Sheet Description Features The Power PLCC-4 SMT LED with Lens are high performance PLCC-4 package size SMT LEDs targeted mainly in Automotive & Electronics Signs and Signals (ESS) markets. These top-mount single-chip packages with focused radiation offer high brightness in beam direction and are excellent for interior automotive, indoor and outdoor sign and industrial applications. With additional lens in 50° variants, these products are especially fitting to applications for Mono-color Text Display, CHMSL and displays. • Industry standard PLCC-4 The PLCC-4 package family is able to dissipate heat better compared to the PLCC-2 packages. In proportion to this increase in driving current, this family of LEDs is able to produce higher light output compared to the conventional PLCC-2 SMT LEDs. • Interior automotive As an extension of the standard flat top PLCC-4 SMT LEDs, the Power PLCC-4 with Lens device is able to provide focused beams within narrow viewing angles (50°) meeting the market’s requirements for focused radiation and high brightness in beam directions. The Power PLCC-4 SMT LED with 50° is ideal for panel, push button, general backlighting, automotive interior & exterior (cluster backlighting, side repeaters, brake lights), sign and symbol illumination, office equipment, industrial equipment and home appliances applications. This package design coupled with careful selection of component materials allow the Power PLCC-4 SMT LED with Lens to perform with higher reliability in a larger temperature range -40°C to 100°C. This high reliability feature is crucial to allow the Power PLCC-4 SMT LED with Lens to do well in harsh environments such as its target Automotive & ESS markets. • High reliability LED package • High brightness using AlInGaP and InGaN dice technologies • High optical efficiency • Narrow Viewing angle at 50° • Available in 8mm carrier tape on 7-inch reel Applications – Instrument panel backlighting – Central console backlighting – Cabin backlighting – Navigation and audio system – Dome lighting – Push button backlighting • Exterior automotive – Turn signals – CHMSL – Rear combination lamp – Side repeaters • Office automation, home appliances, industrial equipment – Front panel backlighting – Push button backlighting – Display backlighting Package Drawing 3.87 max 2.8±0.2 2.2±0.2 3.2±0.2 0.80±0.1 0.1TYP 3.5±0.2 0.8±0.3 Package marking Pin HSMx-A46x Lead Configuration 1 Cathode 2 Anode 3 Cathode 4 Cathode 0.7±0.1 Note: 1. All Dimensions in millimeters. 2. Terminal Finish: Ag plating 3. Electrical connection between all cathode is recommended Figure 1. Package Drawing Table 1. Device Selection Guide Luminous Intensity, lV [1] (mcd) Color Part Number Min. Iv (mcd) Typ. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology Amber HSMA-A460-W50M1 1125 2100 3550 50 AlInGaP Amber HSMA-A461-X83M1 2240 3300 5600 50 AlInGaP Red HSMC-A460-U30M1 450 580 900 50 AlInGaP Red HSMC-A461-V00M1 715 1750 - 50 AlInGaP Orange HSML-A461-W40M1 1125 1850 2850 50 AlInGaP Red Orange HSMJ-A461-W40M1 1125 1850 2850 50 AllnGaP Green HSMM-A460-V70M1 900 1250 1800 30 InGaN Blue HSMN-A461-U30M1 450 680 900 30 InGaN Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. Tolerance = ±12% Part Numbering System H S M x 1 − A x 2 x3 x4 − x5 x6 x7 x8 x9 Packaging Option Color Bin Selection Intensity Bin Selection Device Specific Configuration Package Type LED Chip Color  Table 2. Absolute Maximum Ratings (TA = 25 °C) Parameters HSMA/C/L/J HSMM/N DC Forward Current [1] 70 mA 30 mA Peak Forward Current [2] 200 mA 90 mA Power Dissipation 180 mW 140 mW Reverse Voltage 5V Junction Temperature 110°C Operating Temperature -40°C to +100°C Storage Temperature -40°C to +100°C Notes: 1. Derate Linearly as shown in Figure 7. 2. Duty Factor = 10%, Frequency = 1kHz Table 3. Optical Characteristics (TA = 25 °C) Dice Technology Peak Wavelength lPEAK (nm) Dominant Wavelength lD [1] (nm) Viewing Angle 2q½ [2] (Degrees) Luminous Efficacy hv [3] (lm/W) Luminous Efficiency he (lm/W) Total Flux /Luminous Intensity [4] FV (lm)/IV (cd) Typ. Typ. Typ. Typ. Typ. Typ. Color Part Number Amber HSMA-A46x AlInGaP 592 590 50 480 22 0.70 Red HSMC-A46x AlInGaP 635 626 50 150 19 0.90 Orange HSML-A46x AlInGaP 609 605 50 320 23 0.95 Red Orange HSMJ-A46x AllnGaP 621 615 50 240 15 0.95 Green HSMJ-A46x InGaN 518 525 50 500 10 0.85 Blue HSMJ-A46x InGaN 468 470 50 75 7 1.15 Notes: 1. The dominant wavelength, lD, is derived from the CIE Chromaticity diagram and represents the color of the device. 2. q½ is the off-axis angle where the luminous intensity is ½ the peak intensity. 3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / hv, where IV is the luminous intensity in candelas and hv is the luminous efficacy in lumens / watt. 4. FV is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. Table 4. Electrical Characteristics (TA = 25 °C) Forward Voltage VF (Volts) @ IF=50mA Reverse Voltage VR @ 100µA Part Number Min. Typ. Max. Min. Thermal Resistance RΘJ-P (°C/W) HSMA/C/L/J 1.9 2.2 2.5 5 110 Forward Voltage VF (Volts) @ IF=30mA Reverse Voltage VR @ 10µA Part Number Min. Typ. Max. Min. Thermal Resistance RΘJ-P (°C/W) HSMM/N 2.8 3.8 4.6 5 110  RELATIVE INTENSITY 1 0.9 InGaN Blue 0.8 InGaN Green 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 430 AllnGaP Red Orange AllnGaP Orange AllnGaP Amber AllnGaP Red 480 530 580 630 WAVELENGTH - nm 680 730 780 Figure 2. Relative Intensity Vs. Wavelength 1.6 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 50 mA) 70 60 HSMA/C/J/L 50 40 30 HSMM/N 20 10 0 0 1 2 3 FORWARD VOLTAGE - V 4 Figure 3. Forward Current Vs. Forward Voltage RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 30 mA) 1 0.8 0.6 0.4 0.2 0 5 10 15 20 25 DC FORWARD CURRENT - mA Figure 5. Relative Intensity Vs. Forward Current (InGaN)  1.2 1.0 0.8 0.6 0.4 0.2 0 10 20 30 40 50 60 DC FORWARD CURRENT - mA 70 80 Figure 4. Relative Intensity Vs. Forward Current (AlInGaP) 1.2 0 HSMC/L HSMA/J 1.4 0 5 30 35 NORMALIZED LUMINOUS INTENSITY FORWARD CURRENT - mA 80 2.5 2 AlInGaP Amber AlInGaP Orange AlInGaP Red Orange AlInGaP Red InGaN Green 1.5 1 InGaN Blue 0.5 0 -50 -25 0 25 50 75 AMBIENT TEMPERATURE - °C Figure 6. Relative Intensity Vs. Temperature 100 125 MAXIMUM FORWARD CURRENT - mA Rθ JA = 300°C/W Rθ JA = 350°C/W 40 Rθ JA = 470°C/W 20 0 20 40 60 80 AMBIENT TEMPERATURE - °C 100 60 40 20 0 120 30 Rθ JA = 300°C/W Rθ JA = 350°C/W Rθ JA = 470°C/W 15 10 5 0 120 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 35 20 0 20 40 60 80 100 AMBIENT TEMPERATURE - °C 610 AlInGaP Orange 605 600 595 AlInGaP Amber 590 585 0 10 20 30 40 50 60 FORWARD CURRENT - mA Figure 8a. Dominant Wavelength Vs. Forward Current (AlInGaP)  70 30 30 25 20 15 10 5 0 20 40 60 80 100 SOLDER POINT TEMPERATURE (°C) 540 AlInGaP Red Orange 615 35 120 550 DOMINANT WAVELENGTH - nm 620 120 Figure 7d. Maximum Forward Current Vs. Solder Point Temperature. Derated Based on TJMAX = 110°C, RqJ-P =110°C/W (InGaN) AlInGaP Red 625 40 60 80 100 SOLDER POINT TEMPERATURE (°C) 35 0 120 Figure 7c. Maximum Forward Current Vs. Ambient Temperature. Derated Based on TJMAX = 110°C, RqJ-A = 300°C/W, 350°C/W and 470°C/W (InGaN) 630 20 Figure 7b. Maximum Forward Current Vs. Solder Point Temperature. Derated Based on TJMAX = 110°C, RqJ-P = 110°C/W (AlInGaP) Figure 7a. Maximum Forward Current Vs. Ambient Temperature. Derated Based on TJMAX = 110°C, RqJ-A = 300°C/W, 350°C/W and 470°C/W (AlInGaP) 25 0 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 80 60 0 DOMINANT WAVELENGTH - nm 00 80 80 InGaN Green 530 520 510 500 490 480 InGaN Blue 470 460 0 5 10 15 20 25 FORWARD CURRENT - mA Figure 8b. Dominant Wavelength Vs. Forward Current (InGaN) 30 35 25 20 15 10 5 0 0 1 0.9 0.2 NORMALIZED INTENSITY FORWARD VOLTAGE SHIFT - V 0.3 InGaN 0.1 AllnGaP 0 -0.1 -0.2 -0.3 -50 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -25 0 25 50 75 JUNCTION TEMPERATURE - °C 0 -90 100 Figure 9. Forward Voltage Shift Vs. Temperature -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 10. Radiation Pattern TEMPERATURE 10 to 20 SEC. 255 ˚C +5˚C -0˚C 217˚C -6˚C/SEC MAX. 3˚C/SEC MAX. 125˚C +/- 25˚C 60-150 SEC. MAX. 120 SEC. TIME Figure 11a. Recommended SnPb Reflow Soldering Profile. Figure 11b. Recommended Pb-free Reflow Soldering Profile Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. X 2.60 (0.103) X 0.40 (0.016) 1.10 (0.043) 0.50 (0.020) Y 4.50 (0.178) 1.50 (0.059) DIMENSIONS IN mm (INCHES). Figure 12. Recommended Soldering Pad Patter  Y SOLDER RESIST REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS Thermal Resistance Solder pad area (xy) 300°C/W >16mm2 350°C/W >12mm2 470°C/W >8mm2 Figure 13. Soft Tip Vacuum Pick-up Tool for extracting SMT LED Components from Carrier Tape TRAILER 200 mm MIN. FOR ∅ 180 REEL. 200 mm MIN. FOR ∅ 330 REEL. COMPONENT LEADER 480 mm MIN. FOR ∅ 180 REEL. 960 mm MIN. FOR ∅ 330 REEL. C A USER FEED DIRECTION Figure 14. Tape Leader and Trailer Dimensions Figure 15. Tape Dimensions  USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 16. Reeling Orientation Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at