HSMC-C265

HSMx-C120, HSMx-C177, HSMx-C197 and HSMx-C265 High Performance Chip LEDs Data Sheet Description Features These chip type LEDs utilize Aluminium Indium Galium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available colors in this surface mount series are 592 nm Amber, 605 nm Orange, 626 nm Red and 639 nm Deep Red. All packages are binned by both color and intensity, except for red and deep red color. These ChipLEDs come either in low profile top emitting packages (HSMx-C177/C197), in a side emitting package (HSMx-C120) or in a reverse mount package (HSMx-C265). The right angle ChipLED is suitable for applications such as LCD back lighting. The top emitting ChipLEDs with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. The reverse mount ChipLED is suitable for space saving. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel for HSMx-C120/C177/C197 and 3000 units per reel for HSMx-C265. These packages are compatible with IR soldering process. x High brightness AlInGaP material x 0805 or 0603 industry standard footprint with 0.4 mm height for top emitting packages x Also available in right angle emitting and reverse mounting packages x Diffused optics x Operating temperature range of –40°C to +85°C x Compatible with IR soldering x Available in 4 colors x Available in 8 mm tape on 7" diameter reel x Reel sealed in zip locked moisture barrier bags Applications x x x x x x x x Membrane switch indicator LCD backlighting Push button backlighting Front panel indicator Symbol backlighting Keypad backlighting Microdisplays Small message panel signage Device Selection Guide Dimensions (mm) [1,2] Amber Red Orange Deep Red Package Description 1.6 x 1.0 x 0.6 HSMA-C120 HSMC-C120 HSML-C120 – Untinted, Non-diffused 2.0 x 1.25 x 0.4 HSMA-C177 HSMC-C177 HSML-C177 HSMT-C177 Untinted, Diffused 1.6 x 0.8 x 0.4 HSMA-C197 HSMC-C197 HSML-C197 HSMT-C197 Untinted, Diffused 3.4 x 1.25 x 1.1 HSMA-C265 HSMC-C265 HSML-C265 HSMT-C265 Untinted, Non-diffused CAUTION: HSMA-Cxxx, HSMC-Cxxx, HSML-Cxxx and HSMT-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions CATHODE MARK CATHODE MARK 1.25 (0.049) 2.00 (0.079) 0.80 (0.031) POLARITY DIFFUSED EPOXY 1.60 (0.063) 0.40 (0.016) POLARITY DIFFUSED EPOXY PC BOARD 0.40 (0.016) 0.16 (0.006) PC BOARD 0.16 (0.006) CATHODE LINE CATHODE LINE 0.40 ± 0.15 (0.016 ± 0.006) 0.40 ± 0.15 (0.016 ± 0.006) 0.30 ± 0.15 (0.012 ± 0.006) 1.10 (0.043) MIN. 0.70 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C177 HSMx-C197 3.4 (0.134) CATHODE MARK (ETCHED) LED DIE CATHODE MARK (ANODE MARK FOR HSMH-C120) LED DIE 1.25 (0.049) 0.3 (0.012) 1.6 (0.063) GREEN SOLDER MASK 0.6 (0.024) POLARITY UNDIFFUSED EPOXY POLARITY 1.2 (0.047) 1.1 (0.043) 1.2 (0.047) CLEAR EPOXY 1.1 (0.043) PC BOARD 1.0 (0.039) PC BOARD 0.3 (0.012) 0.5 (0.020) CATHODE LINE 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) SOLDERING TERMINAL HSMx-C265 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 2 CATHODE LINE SOLDERING TERMINAL HSMx-C120 3 – 0.3 (0.012) Absolute Maximum Ratings at TA = 25˚C Parameter HSMx-Cxxx Units DC Forward Current [1] 25 mA Power Dissipation 60 mW Reverse Voltage (IR = 100 μA) 5 V LED Junction Temperature 95 ˚C Operating Temperature Range –40 to +85 ˚C Storage Temperature Range –40 to +85 ˚C Soldering Temperature See reflow soldering profile (Figures 8 & 9) Notes: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at TA = 25˚C Forward Voltage VF (Volts) @ IF = 20 mA Part Number Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 μA Capacitance C (pF), VF = 0, f = 1 MHz Thermal Resistance RTJ–PIN (˚C/W) Min. Typ. Typ. HSMA-C120 1.9 2.4 5 11 400 HSMA-C177/197 1.9 2.4 5 11 300 HSMA-C265 1.9 2.4 5 11 550 HSMC-C120 1.9 2.4 5 15 400 HSMC-C177/197 1.9 2.4 5 15 300 HSMC-C265 1.9 2.4 5 15 550 HSML-C120 1.9 2.4 5 20 400 HSML-C177/197 1.9 2.4 5 20 300 HSML-C265 1.9 2.4 5 20 550 HSMT-C177/197 1.9 2.4 5 15 300 HSMT-C265 1.9 2.4 5 15 550 VF Tolerance: ± 0.1 V 3 Optical Characteristics at TA = 25˚C Luminous Intensity IV (mcd) @ 20 mA[1] Part Number Color Min. Typ. Color, Peak Wavelength Opeak (nm) Dominant Wavelength Od[2] (nm) Viewing Angle 2 T1/2 Degrees[3] Luminous Efficacy KV (lm/w) Typ. Typ. Typ. Typ. HSMA-C120 Amber 28.5 90 595 592 155 480 HSMA-C177/197 Amber 28.5 90 595 592 130 480 HSMA-C265 Amber 28.5 75 595 592 150 480 HSMC-C120 Red 28.5 90 637 626 155 155 HSMC-C177/197 Red 28.5 90 637 626 130 155 HSMC-C265 Red 28.5 75 637 626 150 155 HSML-C120 Orange 28.5 90 609 605 155 370 HSML-C177/197 Orange 28.5 90 609 605 130 370 HSML-C265 Orange 28.5 75 609 605 150 370 HSMT-C177/197 Deep Red 11.2 30 660 639 130 70 HSMT-C265 Deep Red 11.2 25 660 639 150 70 Notes: 1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3.  T1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4 Color Bin Limits Bin ID Orange Color Bins[1] Dom. Wavelength (nm) Min. Max. Bin ID Intensity (mcd) Min. Max. A 597.0 600.0 A 0.11 0.18 B 600.0 603.0 B 0.18 0.29 C 603.0 606.0 C 0.29 0.45 D 606.0 609.0 D 0.45 0.72 E 609.0 612.0 E 0.72 1.10 F 612.0 615.0 F 1.10 1.80 Light Intensity (Iv) Bin Limits[1] Tolerance: ± 1 nm Bin ID Amber Color Bins[1] Dom. Wavelength (nm) Min. Max. A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 E 592.0 594.5 F 594.5 597.0 Tolerance: ± 1 nm Red Color Bins [1] 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.00 285.00 T 285.00 450.00 U 450.00 715.00 V 715.00 1125.00 W 1125.00 1800.00 X 1800.00 2850.00 Y 2850.00 4500.00 Tolerance: ± 15% Dom. Wavelength (nm) Bin ID Min. Max. - 620.0 635.0 Tolerance: ±1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 5 G Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 2. The Iv binning specification set-up is for lowest allowable Iv binning only. There are no upper Iv bin limits. AS DEEP RED 70 AS ORANGE 60 50 40 30 20 0 500 550 600 650 10 AS AlInGaP 1 1.0 0.8 AS AMBER 0.6 AS ORANGE, RED and DEEP RED 0.4 0.2 0 5 10 15 Figure 2. Forward current vs. forward voltage. 20 HSMx-C120/177/197 15 HSMx-C265 10 RELATIVE INTENSITY 90 25 5 80 70 60 50 40 30 20 10 0 0 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 TA – AMBIENT TEMPERATURE – °C 10 20 30 40 50 60 70 80 90 ANGLE Figure 4. Maximum forward current vs. ambient temperature. 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C120. 6 25 30 Figure 3. Luminous intensity vs. forward current. 100 30 20 IF – FORWARD CURRENT – mA VF – FORWARD VOLTAGE – V WAVELENGTH – nm 1.2 0 0 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 700 Figure 1. Relative intensity vs. wavelength. LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 80 10 IF MAX – MAXIMUM FORWARD CURRENT – mA 1.4 100 AS RED AS AMBER 90 IF – FORWARD CURRENT – mA RELATIVE INTENSITY – % 100 RELATIVE INTENSITY – % 100 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative intensity vs. angle for HSMx-C177/197. RELATIVE INTENSITY – % 100 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 7. Relative intensity vs. angle for HSMx-C265. 10 SEC. MAX. TEMPERATURE 230°C MAX. 4°C/SEC. MAX. 140-160°C 4°C/SEC. MAX. TEMPERATURE 10 SEC. MAX. 217 C 200 C 255 - 260 C 3 C/SEC. MAX. 6 C/SEC. MAX. 150 C 3 C/SEC. MAX. 3°C/SEC. MAX. 60 SEC. MAX. 60 - 120 SEC. OVER 2 MIN. TIME TIME Figure 8. Recommended reflow soldering profile. CENTERING BOARD Figure 9. Recommended Pb-free reflow soldering profile. CENTERING BOARD 0.8 (0.031 1.2 (0.047 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) Figure 10. Recommended soldering pattern for HSMx-C177. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 7 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) Figure 11. Recommended soldering pattern for HSMx-C197. 2.2 (0.087) DIA. PCB HO 0.4 (0.016) 0.4 (0.016) 0.7 (0.028) 1.25 (0.049 0.15 (0.006) CENTERING BOARD 0.8 (0.031) 1.2 (0.047) 1.4 (0.055) 0.8 (0.031) Figure 12. Recommended soldering pattern for HSMx-C120. 2.3 (0.091) 1.4 (0.055) Figure 13. Recommended soldering pattern for HSMx-C265. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 14. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.0 10.50 ± 1.0 (0.413 ± 0 Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020)6 PS Figure 15. Reel dimensions. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 8 5.0 ± 0.5 (0.197 ± 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.00 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) HSMx-C120 POSITION IN CARRIER TAPE PART NUMBER HSMx-C120 SERIES HSMx-C177 SERIES HSMx-C197 SERIES DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) 1.90 (0.075)1.15 (0.045)0.75 (0.030) 2.30 (0.091)1.40 (0.055)0.60 (0.024) 1.75 (0.069)0.95 (0.037)0.60 (0.024) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) HSMx-C120 R 0.5 ± 0.05 (0.020 ± 0.002) 4.00 (0.157) CATHODE 1.50 (0.059) DIM. C (SEE TABLE 1) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C265 SERIES Figure 16. Tape dimensions. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 9 COVER TAPE DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 17. Tape leader and trailer dimensions. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60% RH max. Baking is required under the condition: a) Humidity Indicator Card is >10% when read at 23 ± 5°C b) Device exposed to factory conditions