HSMD-Cxxx, HSMG-Cxxx, HSMH-Cxxx,
HSMS-Cxxx, HSMY-Cxxx,
Surface Mount Chip LEDs
Data Sheet
HSMx-C110/ HSMx-C120/HSMx-C150/HSMx-C170/HSMx-C177/
HSMx-C190/HSMx-C191/HSMx-C197/HSMx-C265
Description
Features
These chip LEDs are designed in an industry standard
package for ease of handling and use. Various different
LED colors are available in nine compact, single color
packages.
Small size
The HSMx-C150 has the industry standard 3.2 x 1.6
mm footprint that is excellent for all around use. The
HSMx-C170 has the widely used 2.0 x 1.25 mm foot-print
with 0.8 mm profile. The HSMx-C177 has the widely
used 2.0 x 1.25 mm footprint with 0.4 mm profile. The
HSMx-C19x series has the industry standard 1.6 x 0.8 mm
footprint with varying profile to suit designers needs,
the HSMx-C190 has 0.8 mm profile, the HSMx-C191 has a
low profile of 0.6 mm, and the HSMx-C197 has the ultra
low profile of 0.4 mm. This family with its thin profile and
wide viewing angle makes this LED exceptional for backlighting applications.
The HSMx-C110 is a right angle package with the universally accepted dimensions of 3.2 x 1.0 x 1.5 mm. The
HSMx-C120 is a smaller right angle package with industry
standard 1.6 x 0.6 x 1.0 mm. HSMx-C265 is a reverse
mount package with dimensions of 3.4 x 1.25 x 1.1 mm.
These devices are ideal for LCD backlighting and sidelighting applications.
In order to facilitate pick and place operation, these
chip LEDs are shipped in tape and reel with 4000 units
per reel for HSMx-C120, C170, C177, C190, C191, C197
packages, and 3000 units per reel for HSMx-C110, C150,
C265 packages.
All packages are compatible with IR reflow solder
processes. The small size and wide viewing angle make
these LEDs prime choices for backlighting applications
and front panel illumination especially where space is a
premium.
Industry standard footprint
Compatible with IR solder
Diffused optics
Operating temperature range of -40°C to +85°C
Right angle & reverse mount package available
Various colors available
Available in 8 mm tape on 7 in. (178 mm) diameter
reels
Applications
Keypad backlighting
Push-button backlighting
LCD backlighting
Symbol backlighting
Front panel indicator
Device Selectiion Guide
GaP
Green
HER
Orange
Yellow
Description
HSMG-C110
HSMS-C110
HSMD-C110
HSMY-C110
Untinted, Non-Diffused
HSMG-C120
HSMS-C120
HSMD-C120
–
Untinted, Non-Diffused
HSMG-C150
HSMS-C150
HSMD-C150
HSMY-C150
Untinted, Diffused
HSMG-C170
HSMS-C170
HSMD-C170
HSMY-C170
Untinted, Diffused
HSMG-C177
HSMS-C177
HSMD-C177
HSMY-C177
Untinted, Diffused
HSMG-C190
HSMS-C190
HSMD-C190
HSMY-C190
Untinted, Diffused
HSMG-C191
HSMS-C191
HSMD-C191
HSMY-C191
Untinted, Diffused
HSMG-C197
HSMS-C197
HSMD-C197
HSMY-C197
Untinted, Diffused
HSMG-C265
–
–
–
Untinted, Non-Diffused
As AlGaAs
Red
Description
HSMH-C110
Untinted, Non-Diffused
HSMH-C120
Untinted, Non-Diffused
HSMH-C150
Untinted, Diffused
HSMH-C170
Untinted, Diffused
HSMH-C190
Untinted, Diffused
HSMH-C191
Untinted, Diffused
HSMH-C265
Untinted, Non-Diffused
Package Dimensions
CATHODE
MARK
CATHODE
MARK
(ANODE MARK FOR
HSMH-C150)
1.25 (0.049)
1.6 (0.063)
2.0 (0.079 )
3.2 (0.126 )
DIFFUSED
EPOXY
POLARITY[3]
2.0 (0.079)
0.6 (0.024)
DIFFUSED
EPOXY
POLARITY[3]
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
PC BOARD
0.8 (0.031)
CATHODE LINE
(ANODE LINE
FOR HSMH-C170)
0.3 (0.012)
0.4 ± 0.15
(0.016 ± 0.006)
0.4 ± 0.15
(0.016 ± 0.006)
SOLDERING
TERMINAL
HSMx-C150
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specified.
3. Polarity for HSMH-Cxxx will be the opposite of what is shown on above drawings.
2
1.4
(0.055)
0.3 (0.012)
1.1 (0.043)
PC BOARD
CATHODE LINE
(ANODE LINE
FOR HSMH-C150)
0.50 ± 0.2
(0.020 ± 0.008)
(ANODE MARK FOR
HSMH-C170)
SOLDERING
TERMINAL
HSMx-C170
CATHODE MARK
(ANODE MARK FOR HSMH-C190)
CATHODE
LINE
LED DIE
(ANODE MARK
FOR HSMH-C110)
1.0 (0.039)
0.8 (0.031)
2.6 (0.102 )
1.6
(0.063 )
3.2 (0.126 )
1.0
(0.039)
[3]
POLARITY
POLARITY[3]
CLEAR
EPOXY
1.5 (0.059)
0.3 (0.012)
PC BOARD
DIFFUSED EPOXY
PC BOARD
1.6 (0.063 )
0.8 (0.031)
0.3 (0.012)
CATHODE LINE
(ANODE LINE
FOR HSMH-C190)
0.3 ± 0.15
(0.012 ± 0.006)
0.5 (0.020)
3.2 (0.126 )
0.3 ± 0.15
(0.012 ± 0.006)
CATHODE LINE
(ANODE LINE
FOR HSMH-C110)
0.8 (0.031)
1.0 (0.039)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C190
HSMx-C110
CATHODE MARK
CATHODE MARK
(ANODE MARK FOR HSMH-C191)
0.8 (0.031)
1.25
(0.049)
1.6
(0.063 )
2.00 (0.079)
1.0
(0.039)
POLARITY[3]
POLARITY
DIFFUSED EPOXY
0.3 (0.012)
0.40 (0.016)
DIFFUSED EPOXY
PC BOARD
PC BOARD
CATHODE LINE
(ANODE LINE
FOR HSMH-C191)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.16 (0.006)
0.6 (0.023)
0.3 (0.012)
0.40 ± 0.15
(0.016 ± 0.006)
0.40 ± 0.15
(0.016 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
HSMx-C191
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specified.
3. Polarity for HSMH-Cxxx will be the opposite of what is shown on above drawings.
3
1.10 (0.043) MIN.
SOLDERING
TERMINAL
HSMx-C177
3.4 (0.134)
CATHODE
MARK (ETCHED)
[ANODE MARK FOR HSMH-C265]
LED DIE
CATHODE MARK
1.25 (0.049)
0.80
(0.031)
1.60
(0.063)
GREEN SOLDER MASK
POLARITY
[3]
POLARITY
1.2
(0.047)
UNDIFFUSED
EPOXY
DIFFUSED
EPOXY
1.1 (0.043)
1.1 (0.043)
PC BOARD
CATHODE LINE
(ANODE LINE
FOR HSMH-C265)
0.40 (0.016)
PC BOARD
0.16 (0.006)
0.3 (0.012)
CATHODE LINE
0.50 ± 0.15
(0.020 ± 0.006)
0.50 ± 0.15
(0.020 ± 0.006)
0.30 ± 0.15
(0.012 ± 0.006)
0.70 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C265
HSMx-C197
CATHODE MARK
(ANODE MARK FOR HSMH-C120)
LED DIE
0.3 (0.012)
0.6 (0.024)
1.6 (0.063)
POLARITY[3]
1.2 (0.047)
CLEAR EPOXY
1.0 (0.039)
PC BOARD
0.5 (0.020)
CATHODE LINE
(ANODE LINE
FOR HSMH-C120)
3 – 0.3 (0.012)
SOLDERING
TERMINAL
HSMx-C120
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specified.
3. Polarity for HSMH-Cxxx will be the opposite of what is shown on above drawings.
4
Absolute Maximum Ratings for GaP at TA=25°C
Parameter
C110/150/265
C120/170/177/190/191/197
Units
DC Forward Current[1]
25
20
mA
Power Dissipation
65
52
mW
Reverse Voltage (IR=100 μA)
5
5
V
LED Junction Temperature
95
95
°C
Operating Temperature Range
-40 to +85
-40 to +85
°C
Storage Temperature Range
-40 to +85
-40 to +85
°C
Soldering Temperature
See reflow soldering profile (Figure 9 & 10)
Absolute Maximum Ratings for AlGaAs at TA=25°C
Parameter
C110/150
C120/170/190/191/265
Units
DC Forward Current[1]
30
25
mA
Power Dissipation
78
65
mW
Reverse Voltage (IR=100μA)
5
5
V
LED Junction Temperature
95
95
°C
Operating Temperature Range
-40 to +85
-40 to +85
°C
Storage Temperature Range
-40 to +85
-40 to +85
°C
Soldering Temperature
See reflow soldering profile (Figure 9 & 10)
Note:
1. Derate linearly as shown in Figure 4 for temperature above 25°C.
Electrical Characteristics at TA=25°C
Part Number
5
Color
Forward Voltage
VF(Volts)
@ IF = 20 mA
Typ.
Max.
Reverse
Breakdown
VR(Volts)
@ IR = 100 μA
Min.
Capacitance
C(pF),
@ VF = 0 V,
f = 1 MHz
Typ.
Thermal
Resistance
RJ-P (°C/W)
Typ.
HSMS-C110/150
HSMS-C120
HSMS-C170/177/190/191/197
HER
2.1
2.6
5
5
400
350
250
HSMD-C110/150
HSMD-C120
HSMD-C170/177/190/191/197
Orange
2.2
2.6
5
7
400
350
250
HSMY-C110/150
HSMY-C170/177/190/191/197
Yellow
2.1
2.6
5
6
400
250
HSMG-C110/150
HSMG-C120
HSMG-C170/177/190191/197/265
Green
2.2
2.6
5
9
400
350
250
HSMH-C110/150
HSMH-C120
HSMH-C170/190/191/265
AlGaAs
1.8
2.6
5
18
460
400
300
Optical Characteristics at TA=25°C
Part Number
Color
Luminous
Intensity[1]
Iv(mcd)@20mA
Min.
Typ.
Peak
Wavelength
peak(nm)
Typ.
Dominant
Wavelength
d(nm)
Typ.
HSMG-C110/177/197
HSMG-C120
HSMG-C150/170/190/191/265
Green
4.5
15.0
570
572
130
155
170
HSMS-C110/177/197
HSMS-C120
HSMS-C150/170/190/191
HER
2.8
10.0
630
626
130
155
170
HSMD-C110/177/197
HSMD-C120
HSMD-C150/170/190/191
Orange
2.8
8.0
605
604
130
155
170
HSMY-C110/177/197
HSMY-C150/170/190/191
Yellow
2.8
8.0
589
586
130
170
HSMH-C110
HSMH-C120
HSMH-C150/170/190/191/265
AlGaAs
7.2
17.0
660
639
130
155
170
Viewing
Angle 21/2(°)[2]
Typ.
Notes:
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of
the lamp package.
2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Color Bin Limits[1]
Green Color Bins[1]
Yellow Color Bins[1]
Bin ID
Dom. Wavelength (nm)
Min.
Max.
Bin ID
Dom. Wavelength (nm)
Min.
Max.
A
561.5
564.5
A
582.0
584.5
B
564.5
567.5
B
584.5
587.0
C
567.5
570.5
C
587.0
589.5
D
570.5
573.5
D
589.5
592.0
E
573.5
576.5
E
592.0
594.5
F
594.5
597.0
Tolerance: ±1 nm
Tolerance: ±1 nm
Orange Color Bins[1]
Bin ID
Dom. Wavelength (nm)
Min.
Max.
A
597.0
600.0
B
600.0
603.0
C
603.0
606.0
D
606.0
609.0
E
609.0
612.0
F
612.0
615.0
Tolerance: ±1 nm
6
Light Intensity (Iv) Bin Limits[1]
Bin ID
Intensity (mcd)
Min.
Max.
Bin ID
Intensity (mcd)
Min.
Max.
A
0.11
0.18
N
28.50
45.00
B
0.18
0.29
P
45.00
71.50
C
0.29
0.45
Q
71.50
112.50
D
0.45
0.72
R
112.50
180.00
E
0.72
1.10
S
180.00
285.00
F
1.10
1.80
T
285.00
450.00
G
1.80
2.80
U
450.00
715.00
H
2.80
4.50
V
715.00
1125.00
J
4.50
7.20
W
1125.00
1800.00
K
7.20
11.20
X
1800.00
2850.00
L
11.20
18.00
Y
2850.00
4500.00
M
18.00
28.50
Note:
1. Bin categories are established for classification of products. Products may not be
available in all categories. Please contact
your Avago representative for information
on currently available bins.
2. The Iv binning specification set-up is for
lowest allowable Iv binning only. There is
no upper Iv bin limits.
Tolerance: ±15%
1.0
RELATIVE INTENSITY
GREEN
AlGaAs
YELLOW
0.5
ORANGE
0
500
HER
550
600
650
700
750
WAVELENGTH – nm
1.6
AlGaAs
HER
AlGaAs
GREEN
10
1
YELLOW
0.1
1.7
1.9
2.1
2.3
VF – FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage.
7
1.2
0.8
0.4
GaP
ORANGE
1.5
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
IF – FORWARD CURRENT – mA
100
0
0
10
20
30
IF – FORWARD CURRENT – mA
Figure 3. Luminous intensity vs. forward
current.
40
IF MAX. – MAXIMUM FORWARD CURRENT – mA
Figure 1. Relative intensity vs. wavelength.
35
C110/C150 AlGaAs
30
C110/C150/C265
HER, ORANGE,
YELLOW, GREEN
C120/C170/C177/
C190/C191/C197/
C265 AlGaAs
25
20
10
5
0
RqJ-A =
600°C/W
C120/C170/
C177/C190/
C191/C197
HER,
ORANGE,
YELLOW,
GREEN
15
0
20
RqJ-A =
800°C/W
40
60
80
100
TA – AMBIENT TEMPERATURE – °C
Figure 4. Maximum forward current vs. ambient
temperature.
1.00
RELATIVE INTENSITY – %
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
1.00
RELATIVE INTENSITY – %
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C110.
100
90
RELATIVE INTENSITY
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
100
90
RELATIVE INTENSITY
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 6. Relative intensity vs. angle for HSMx-C120.
8
100
90
RELATIVE INTENSITY – %
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 7. Relative intensity vs. angle for HSMx-C177 and C197.
1.00
0.90
RELATIVE INTENSITY – %
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 8. Relative intensity vs. angle for HSMx-C150, C170, C190, C191 and C265.
TEMPERATURE
10 SEC. MAX.
TEMPERATURE
10 SEC. MAX.
230°C MAX.
4°C/SEC. MAX.
140-160°C
217 C
200 C
6 C/SEC. MAX.
150 C
3 C/SEC. MAX.
60 SEC. MAX.
60 - 120 SEC.
3°C/SEC. MAX.
4°C/SEC.
MAX.
255 - 260 C
3 C/SEC. MAX.
OVER 2 MIN.
TIME
TIME
Figure 10. Recommended Pb-free reflow soldering profile.
Figure 9. Recommended reflow soldering profile.
0.8 (0.031)
1.5 (0.059)
1.2 (0.047)
1.2
(0.047)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
Figure 11. Recommended soldering pattern
for HSMx-C150.
9
1.2
(0.047)
0.9
(0.035)
Figure 12. Recommended soldering
pattern for HSMx-C170 and C177.
0.8
(0.031)
0.8
(0.031)
0.7
(0.028)
Figure 13. Recommended soldering pattern
for HSMx-C190, C191 and C197.
5.0 (0.200)
0.4 (0.016)
0.9 (0.035)
0.4 (0.016)
0.9 (0.035)
0.7 (0.028)
1.0 (0.039)
0.2 (0.008)
0.15 (0.006)
CENTERING
BOARD
1.5
(0.059)
2.0
(0.079)
CENTERING
BOARD
1.2
(0.047)
0.8
(0.031)
1.5
(0.059)
Figure 14. Recommended soldering pattern for HSMx-C110.
0.8
(0.031)
Figure 15. Recommended soldering pattern for HSMx-C120.
USER FEED DIRECTION
2.2 (0.087) DIA. PCB HOLE
CATHODE SIDE
1.25 (0.049)
1.4
(0.055)
2.3
(0.091)
1.4
(0.055)
PRINTED LABEL
Figure 16. Recommended soldering pattern for HSMx-C265.
Figure 17. Reeling orientation.
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
Figure 18. Reel dimensions.
Note: All dimensions in millimeters (inches).
10
6
PS
5.0 ± 0.5
(0.197 ± 0.020)
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
HSMx-C110/C120
POSITION IN
CARRIER TAPE
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
1.20 (0.047)
3.40 (0.134) 1.70 (0.067)
0.75 (0.030)
1.90 (0.075) 1.15 (0.045)
1.27 (0.050)
3.50 (0.138) 1.88 (0.074)
0.95 (0.037)
2.30 (0.091) 1.45 (0.057)
0.60 (0.024)
2.30 (0.091) 1.40 (0.055)
0.90 (0.035)
1.75 (0.069) 0.90 (0.035)
0.87 (0.034)
1.86 (0.073) 0.89 (0.035)
0.60 (0.024)
1.75 (0.069) 0.95 (0.037)
PART NUMBER
HSMx-C110 SERIES
HSMx-C120 SERIES
HSMx-C150 SERIES
HSMx-C170 SERIES
HSMx-C177 SERIES
HSMx-C190 SERIES
HSMx-C191 SERIES
HSMx-C197 SERIES
DIM. A
(SEE TABLE 1)
DIM. B
(SEE TABLE 1)
CARRIER TAPE
USER FEED
DIRECTION
R 1.0 ± 0.05
(0.039 ± 0.002)
R 0.5 ± 0.05
(0.020 ± 0.002)
4.00 (0.157)
CATHODE
1.50 (0.059)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
8.00 ± 0.30
(0.315 ± 0.012)
4.00 (0.157)
HSMx-C265 SERIES
11
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
PART NUMBER
Figure 19. Tape dimensions.
CARRIER TAPE
USER FEED
DIRECTION
DIM. A
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
3.70 (0.146)
1.45 (0.057)
1.30 (0.051)
END
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
START
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Figure 20. Tape leader and trailer dimensions.
Convective IR Reflow Soldering
For more information on IR reflow
soldering, refer to Application Note
1060, Surface Mounting SMT LED
Indicator Components.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.)unless otherwise specified.
For product information and a complete list of distributors, please go to our website:
Storage Condition: 5 to 30˚ C
@ 60% RH max.
Baking is required under the
condition:
a) Humidity Indicator Card is
>10% when read at 23 ± 5°C.
b) Device exposed to factory
conditions
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