HSME-C170

HSME-Cxxx AlInGaP Green ChipLED Data Sheet HSME-C110/C120/C150/C170/C177/C190/ C191/C197/C265 Description Features This chip-type LED utilizes Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output. • Small size These chipLEDs come in top mounting, top emitting packages (HSMx-C150/170/177/190/191/197), top mounting, side emitting packages (HSMx-C110/120) or reverse mounting, top emitting package (HSMx-C265). All packages are binned by both color and intensity. In order to facilitate pick and place operation, these chipLEDs are shipped in Tape & Reel, with 4000 units per reel for HSMx-C120/170/ 177/190/191/197 and 3000 units per reel for HSMx-C110/C150/265. These packages are compatible with reflow soldering process. • Industry standard footprint • Operating temperature range of –40°C to +85°C • Compatible with IR soldering • Available in 8 mm tape on 7” diameter reel • Reel sealed in zip-locked moisture barrier bags Applications • Membrane switch indicator • LCD backlighting • Pushbutton backlighting • Front panel indicator • Symbol backlighting • Keypad backlighting CAUTION: HSME-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Avago reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product(s) at anytime. Package Dimensions CATHODE LINE LED DIE CATHODE MARK 1.0 (0.039) 1.25 (0.049) 2.6 (0.102 ) 3.2 (0.126 ) 2.00 (0.079 ) POLARITY CLEAR EPOXY 1.5 (0.059) PC BOARD 1.40 (0.055) DIFFUSED EPOXY POLARITY 0.30 (0.012) PC BOARD 1.6 (0.063 ) 0.80 (0.031) 0.30 (0.012) 0.5 (0.020) CATHODE LINE 3.2 (0.126 ) 0.8 (0.031) CATHODE LINE 0.40 ± 0.15 (0.016 ± 0.006) 0.40 ± 0.15 (0.016 ± 0.006) 1.0 (0.039) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C110 HSMx-C170 CATHODE MARK CATHODE MARK 0.8 (0.031) 0.8 (0.031) 1.6 (0.063 ) 1.6 (0.063 ) 1.0 (0.039) 1.0 (0.039) POLARITY 0.3 (0.012) 0.3 (0.012) DIFFUSED EPOXY DIFFUSED EPOXY PC BOARD POLARITY PC BOARD 0.8 (0.031) 0.3 (0.012) CATHODE LINE CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.6 (0.023) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. 0.7 (0.028) MIN. SOLDERING TERMINAL HSMx-C190 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 In.) unless otherwise specified. 2 SOLDERING TERMINAL HSMx-C191 Package Dimensions, continued CATHODE MARK 3.40 (0.134) CATHODE MARK (ETCHED) LED DIE 1.6 (0.063) 1.25 (0.049) 3.2 (0.126 ) DIFFUSED EPOXY POLARITY 2.0 (0.079) 0.6 (0.024) 1.1 (0.043) PC BOARD 0.5 (0.020) CATHODE LINE 2– 1.10 (0.043) 1.10 (0.043) PC BOARD 0.30 (0.012) 0.5 ± 0.2 (0.020 ± 0.008) 0.5 ± 0.2 (0.020 ± 0.008) POLARITY 1.20 (0.047) UNDIFFUSED EPOXY CATHODE LINE 2– 0.50 ± 0.15 (0.020 ± 0.006) SOLDERING TERMINAL HSMx-C150 HSMx-C265 CATHODE MARK CATHODE MARK LED DIE 0.6 (0.024) 0.80 (0.031) 1.6 (0.063) 1.60 (0.063) POLARITY DIFFUSED EPOXY CLEAR EPOXY 0.3 (0.012) POLARITY 1.2 (0.047) 0.40 (0.016) PC BOARD 0.16 (0.006) 0.5 (0.020) PC BOARD 0.30 ± 0.15 (0.012 ± 0.006) CATHODE LINE 3 – 0.3 (0.012) CATHODE LINE 0.70 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C197 HSMx-C120 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 In.) unless otherwise specified. 1.0 (0.039) Package Dimensions, continued CATHODE MARK 1.25 (0.049) 2.00 (0.079) POLARITY DIFFUSED EPOXY 0.40 (0.016) PC BOARD 0.16 (0.006) 0.40 ± 0.15 (0.016 ± 0.006) CATHODE LINE 1.10 (0.043) SOLDERING TERMINAL HSMx-C177 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 In.) unless otherwise specified. Device Selection Guide Package Dimension (mm) [1,2] AlInGaP Green Package Description 1.6 (L) x 0.8 (W) x 0.6 (H) HSME-C191 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.4 (H) HSME-C197 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.8 (H) HSME-C190 Untinted, Diffused 2.0 (L) x 1.25 (W) x 0.8 (H) HSME-C170 Untinted, Diffused 2.0 (L) x 1.25 (W) x 0.4 (H) HSME-C177 Untinted, Diffused 1.6 (L) x 1.0 (W) x 0.6 (H) HSME-C120 Untinted, Non-diffused 3.2 (L) x 1.5 (W) x 1.0 (H) HSME-C110 Untinted, Non-diffused 3.2 (L) x 1.6 (W) x 1.1 (H) HSME-C150 Untinted, Diffused 3.4 (L) x 1.25 (W) x 1.1 (H) HSME-C265 Untinted, Non-diffused Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted. Absolute Maximum Ratings at TA = 25°C Parameter HSME-C110/120/170/177/ 190/191/197/150/265 Units DC Forward Current [1,2] 20 mA Power Dissipation 52 mW Reverse Voltage (IR = 100 µA) 5 V LED Junction Temperature 95 °C Operating Temperature Range –40 to +85 °C Storage Temperature Range –40 to +85 °C Soldering Temperature See reflow soldering profile (Figures 6 & 7) Notes: 1. Derate linearly as shown in Figure 4. 2. Drive current above 5 mA is recommended for best long term performance. Electrical Characteristics at TA = 25°C Forward Voltage VF (Volts) @ IF = 20 mA Reverse Breakdown VR (Volts) @ IR = 100 µA Capacitance C (pF), VF = 0, f = 1 MHz Thermal Resistance RθJ–PIN (°C/W) Part Number Typ. Max. Min. Typ. Typ. HSME-C110/120 2.1 2.6 5 18 550 HSME-C150/170/177/190/191/197 2.1 2.6 5 15 450 HSME-C265 2.1 2.6 5 16 450 Optical Characteristics at TA = 25°C Luminous Intensity IV (mcd) @ 20 mA[1] Peak Wavelength λpeak (nm) Color, Dominant Wavelength λd[2] (nm) Viewing Angle 2θ1/2 Degrees[3] Luminous Efficacy ηV (lm/w) Part Number Min. Typ. Typ. Typ. Typ. Typ. HSME-C110 18 52 570 572 130 570 HSME-C120 18 52 570 572 155 570 HSME-150/170/ 190/191 18 50 570 572 170 570 HSME-C177/197 18 50 570 572 130 570 HSME-C265 18 50 570 572 150 570 Notes: 1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Green Color Bin Limits[1] Light Intensity (IV) Bin Limits[1] Dom. Wavelength (nm) Intensity (mcd) Bin ID Min. Max. Bin ID Min. Max. A 561.5 564.5 A 0.11 0.18 B 564.5 567.5 B 0.18 0.29 C 567.5 570.5 C 0.29 0.45 D 570.5 573.5 D 0.45 0.72 E 573.5 576.5 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.00 285.00 T 285.00 450.00 U 450.00 715.00 Tolerance: ± 1 nm Tolerance: ± 15% Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 2. The Iv binning specification set-up is for lowest allowable Iv binning only. There are no upper Iv bin limits. 100 80 70 60 50 40 30 20 10 0 400 450 500 550 600 650 1.2 LUMINOUS INTENSITY (NORMALIZED @ 20 mA) 90 IF – FORWARD CURRENT – mA RELATIVE INTENSITY – % 100 10 1 0.1 1.5 1.6 700 1.7 1.8 1.9 2.0 Figure 1. Relative intensity vs. wavelength. 0.6 0.4 0.2 0 5 10 15 20 Figure 2. Forward current vs. forward voltage. HSME-C110 fig 2 HSME-C110 fig 3 90 RELATIVE INTENSITY – % IF MAX. – MAXIMUM FORWARD CURRENT – mA 100 20 15 10 5 80 70 60 50 40 30 20 10 0 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 TA – AMBIENT TEMPERATURE – °C HSME-C110 fig 5a 100 90 RELATIVE INTENSITY – % 10 20 30 40 50 60 70 80 90 Figure 5a. Relative intensity vs. angle for HSMx-C170, HSMx-C190, HSMx-C191, and HSMx-C150. HSME-C110 fig 4 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 ANGLE Figure 4. Maximum forward current vs. ambient temperature. 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5b. Relative intensity vs. angle for HSMx-C177 and HSMx-C197. HSME-C110 fig 5b 30 Figure 3. Luminous intensity vs. forward current. HSME-C110 fig 1 25 25 IF – FORWARD CURRENT – mA VF – FORWARD VOLTAGE – V WAVELENGTH - nm 0.8 0 2.2 2.1 1.0 RELATIVE INTENSITY – % 100 80 60 40 20 0 -100 -80 -60 -40 -20 0 20 40 60 80 100 40 60 80 100 ANGLE RELATIVE INTENSITY – % 100 HSME-C110 fig 5c-1 80 60 40 20 0 -100 -80 -60 -40 -20 0 20 ANGLE Figure 5c. Relative intensity vs. angle for HSMx-C110. HSME-C110 fig 5c-2 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 100 RELATIVE INTENSITY 90 80 HSME-C110 fig 5d-1 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5d. Relative intensity vs. angle for HSMx-C120. HSME-C110 fig 5d-2 100 80 70 60 10 SEC. MAX. 50 TEMPERATURE RELATIVE INTENSITY – % 90 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 230°C MAX. 4°C/SEC. MAX. 140-160°C –3°C/SEC. 4°C/SEC. MAX. 10 20 30 40 50 60 70 80 90 OVER 2 MIN. TIME ANGLE Figure 5e. Relative intensity vs. angle for HSMx-C265. Figure 6. Recommended reflow soldering profile. HSME-C110 fig 5e TEMPERATURE 10 - 30 SEC. 255 - 260 °C 3 °C/SEC. MAX. 217 °C 200 °C 2.2 (0.087) DIA. PCB HOLE 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. 1.25 (0.049) 1.4 (0.055) TIME 2.3 (0.091) 1.4 (0.055) (Acc. to J-STD-020C) Figure 7. Recommended Pb-free reflow soldering profile. Figure 8. Recommended soldering pattern for HSMx-C265. HSME-C110 fig 7 5.0 (0.200) 0.4 (0.016) 0.9 (0.035) 0.4 (0.016) 0.9 (0.035) 0.7 (0.028) 0.15 (0.006) 0.8 (0.031) 1.2 (0.047) CENTERING BOARD 0.8 (0.031) 1.0 (0.039) 0.2 (0.008) 1.5 (0.059) Figure 9. Recommended soldering pattern for HSMx-C120. 2.0 (0.079) CENTERING BOARD 1.5 (0.059) Figure 10. Recommended soldering pattern for HSMx-C110. HSME-C110 fig 8 0.8 (0.031) HSME-C110 fig 9 1.5 (0.059) 1.2 (0.047) 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) Figure 11. Recommended soldering pattern for HSMx-C170 and HSMx-C177. Note: HSME-C110 fig in 10millimeters (inches). 1. All dimensions 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) Figure 12. Recommended soldering pattern for HSMx-C190, HSMx-C191 and HSMx-C197. HSME-C110 fig 11 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 13. Recommended soldering pattern for HSMx-C150. HSME-C110 fig 12 USER FEED DIRECTION CATHODE SIDE xxx xxxxx xx xx xxxxxx xxxxx xx PRINTED LABEL Figure 14. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 15. Reel dimensions. Note: 1. All dimensions in millimeters (inches). 6 PS 5.0 ± 0.5 (0.197 ± 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) CARRIER TAPE USER FEED DIRECTION 2.00 ± 0.05 (0.079 ± 0.002) 4.00 (0.157) DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004) PART NUMBER HSMx-C110/C120 POSITION IN CARRIER TAPE DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) HSMx-C191 SERIES HSMx-C190 SERIES 1.86 (0.073) 1.75 (0.069) 0.89 (0.035) 0.90 (0.035) 0.87 (0.034) 0.90 (0.035) HSMx-C170 SERIES HSMx-C110 SERIES HSMx-C150 SERIES HSMx-C120 SERIES HSMx-C197 SERIES HSMx-C177 SERIES 2.30 (0.091) 3.40 (0.134) 3.50 (0.138) 1.90 (0.075) 1.75 (0.069) 2.30 (0.091) 1.45 (0.057) 1.70 (0.067) 1.88 (0.074) 1.15 (0.045) 0.95 (0.037) 1.40 (0.055) 0.95 (0.037) 1.20 (0.047) 1.27 (0.050) 0.80 (0.031) 0.60 (0.024) 0.60 (0.024) HSMx-C110 HSMx-C120 R 1.0 ± 0.05 R 0.5 ± 0.05 (0.039 ± 0.002) (0.020 ± 0.002) 4.00 (0.157) CATHODE 1.50 (0.059) DIM. C (SEE TABLE 1) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 8.00 ± 0.30 (0.315 ± 0.012) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C265 SERIES Figure 16. Tape dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 In.) unless otherwise specified. DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) END Convective IR Reflow Soldering START For more information on soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 17. Tape leader and trailer dimensions. Storage Condition: 5 to 30°C @ 60% RH max. Baking is condition: required Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. AV02-0976EN - May 10, 2010 the a) Humidity Indicator Card is >10% when read at 23 ± 5°C b) Device exposed to factory conditions