HSMF-C113

HSMF-C113 and HSMF-C115 Right Angle Tricolor Surface Mount ChipLEDs Data Sheet Description Features The HSMF-C113 / C115 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging for 3 dies. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme. The small size, narrow footprint, and low profile make this LED excellent for back-lighting, status indication, and front panel illumination applications. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 3000 units per reel. The package is compatible with reflow soldering and binned by both color and intensity. • • • • • Common anode Small 2.5 x 1.0 x 1.0 mm package Diffused optics Available in 8 mm tape on 7" diameter reels High brightness using AlInGaP and InGaN die technology • Compatible with reflow soldering Applications • • • • Backlighting Status indicator Front panel indicator Office automation, home appliances, industrial equipment Device Selection Guide Part Number Color Package Description HSMF-C113 AlInGaP Red / AlInGaP Green / InGaN Blue Untinted, Diffused HSMF-C115 AlInGaP Red / InGaN Green / InGaN Blue Untinted, Diffused CAUTION: HSMF-C113 and HSMF-C115 LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Package Dimensions LED Dies 1.00 [.039] 2.50 [.098] R0.50 [.020] 2.10 [.083] 0.50 [.020] 1.00 [.039] Anode Mark 0.50 [.020] 1 0.35 [.014] 2 3 4 0.40 [.016] 0.35 [.014] 0.50 [.020] 0.30 [.012] 0.30 [.012] 0.35 [.014] 0.35 [.014] Notes: 1. All Dimensions in millimeteres (inches) 2. Tolerance is ±0.1mm (±0.004 in) unless otherwise specified POLARITY 2 2 HSMF-C113 HSMF-C115 1 InGaN BLUE InGaN BLUE 3 AlInGaP RED AlInGaP RED 4 AlInGaP GREEN InGaN GREEN Absolute Maximum Ratings at TA = 25°C Parameter AlInGaP Red AlInGaP Green InGaN Green InGaN Blue Units DC Forward Current[1,3] 20 20 20 20 mA Power Dissipation[1] 48 52 78 78 mW DC Forward Current[2] 15 15 15 15 mA Power Dissipation[2] 36 39 59 59 mW Reverse Voltage (IR = 100mA) 5 5 5 5 V LED Junction Temperature 95 95 95 95 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +85 °C Soldering Temperature See IR soldering profile (Figure 6 & 7) Notes: 1. Applies when single LED is lit up. 2. Applies when all 3 LEDs are lit up simultaneously. 3. Derate linearly as shown in Figure 4. 4. Drive currents above 5 mA are recommended for best long term performance. Electrical Characteristics at TA = 25°C Forward Voltage VF (Volts)[1] @ IF = 20mA Reverse Breakdown VR (Volts) @ IR = 100mA Capacitance C(pF), @ VF = 0, f = 1MHz Thermal Resistance RqJ-PIN (°C/W) Part Number Typ. Max. Min. Typ. Typ. AlInGaP Red 1.9 2.0 5 12 550 AlInGaP Green 2.0 2.6 5 15 300 InGaN Green 3.4 3.9 5 65 400 InGaN Blue 3.4 3.9 5 65 400 Notes: 1.Vf tolerance : ±0.1V Optical Characteristics at TA = 25°C Luminous Intensity IV [1] (mcd) @ 20mA Peak Wavelength lpeak (nm) Color, Dominant Wavelength ld [2] (nm) Viewing Angle 2q1/2 [3] (Degrees) Luminous Efficacy hV (lm/W) Part Number Min. Typ. Typical Typical Typical Typical AlInGaP Red 28.5 80.0 637 626 120 155 AlInGaP Green 18.0 50.0 570 572 125 570 InGaN Green 71.5 170.0 523 525 125 443 InGaN Blue 28.5 60.0 468 470 125 89 Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. 3 AlInGaP Red Color Bin Limits[1] CAUTION: 1. The above optical performance specifications are valid in the case when single LED is lit up. 2. The above product specifications DO NOT provide any guarantee on color mixing, color consistency over time, or uniformity in luminous intensity when more than 1 LED is lit. 3. Please refer to Avago Technologies Application Brief AB D-007 for additional details / explanation on driving the part in parallel circuit. Dom. Wavelength (nm) Bin ID Minimum Maximum -- 620.0 635.0 Tolerance : ±1nm AlInGaP Green Color Bin Limits[1] Dom. Wavelength (nm) Light Intensity (IV) Bin Limits[1] Intensity (mcd) Bin ID Minimum Maximum A 561.5 564.5 Bin ID Minimum Maximum B 564.5 567.5 A 0.11 0.18 C 567.5 570.5 B 0.18 0.29 D 570.5 573.5 C 0.29 0.45 E 573.5 576.5 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 Bin ID Minimum Maximum J 4.50 7.20 A 515.0 520.0 K 7.20 11.20 B 520.0 525.0 L 11.20 18.00 C 525.0 530.0 M 18.00 28.50 D 530.0 535.0 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.00 285.00 Bin ID Minimum Maximum T 285.00 450.00 A 460.0 465.0 B 465.0 470.0 C 470.0 475.0 D 475.0 480.0 Tolerance : ±15% Notes: 1. Bin categories are established for classifi-cation of products. Products may not be available in all categories. Please contact your Avago Technologies representative for information on current available bins. 4 Tolerance : ±1nm InGaN Green Color Bin Limits[1] Dom. Wavelength (nm) Tolerance : ±1nm InGaN Blue Color Bin Limits[1] Dom. Wavelength (nm) Tolerance : ±1nm Notes: 1. Bin categories are established for classifi-cation of products. Products may not be available in all categories. Please contact your Avago Technologies representative for information on current available bins. 100 InGaN Blue RELATIVE INTENSITY 90 80 AlInGaP Green InGaN Green AlInGaP Red 70 60 50 40 30 20 10 0 400 450 500 550 WAVELENGTH - nm 600 650 700 Figure 1. Relative intensity vs. wavelength. 1.2 AlInGaP Green AlInGaP Red InGaN Green & Blue 10 LUMINOUS INTENSITY (NORMALIZED AT 20mA) IF - FORWARD CURRENT - mA 100 1 0.1 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 VF - FORWARD VOLTAGE - VOLTS 20 1 RELATIVE INTENSITY 0.6 AlInGaP 0.4 0.2 0 5 10 15 20 IF - FORWARD CURRENT - mA 25 15 10 5 InGaN Blue AlInGaP & InGaN Green AlInGaP Red 0.8 0.6 0.4 0.2 0 10 20 30 40 50 60 70 TA - AMBIENT TEMPERATURE - ˚C 80 90 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 IF MAX - MAX. FORWARD CURRENT - mA 1.2 Figure 4. Maximum forward current vs. ambient temperature. 5 InGaN Figure 3. Luminous intensity vs. forward current. 25 0 0.8 0 3.4 Figure 2. Forward current vs. forward voltage. 1.0 DEGREES (˚) Figure 5. Relative intensity vs. angle. 10 SEC. MAX. 10 - 30 SEC. 4˚C/SEC. MAX. 140-160˚C -3˚C/SEC. 4˚C/SEC. MAX. TEMPERATURE TEMPERATURE 230˚C MAX. 217 °C 200 °C 255 - 260 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. OVER 2 MIN. TIME TIME Figure 6. Recommended reflow soldering profile. (Acc. to J-STD-020C) Figure 7. Recommended Pb-free reflow soldering profile. EMITTING DIRECTION 0.4 0.85 0.10 0.90 0.50 0.45 1.80 Figure 8. Recommended soldering land pattern. Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 9. Reeling orientation. 6 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) Figure 10. Reel dimensions. 4.00 [0.157] DIM. C [SEE TABLE 1] 1.50 [0.059] 0.254 ± 0.05 [0.010 ± 0.002] 1.75 [0.069] 3.50 ± 0.05 [0.138 ± 0.002] DIM. A [SEE TABLE 1] 8.00 ± 0.30 [0.315 ± 0.012] DIM. B [SEE TABLE 1] 2.00 ± 0.05 [0.079 ± 0.002] COVER TAPE 4.00 [0.157] CARRIER TAPE USER FEED DIRECTION Figure 11. Tape dimensions. Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. ANODE PART NUMBER HSMF-C113 HSMF-C115 DIM. A ±0.10 (0.004) DIM. B ±0.10 (0.004) DIM. C ±0.10 (0.004) 2.75 (0.108) 1.20 (0.047) 1.20 (0.047) END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 12. Tape leader and trailer dimensions. Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions