HSMF-C116

HSMF-C116 Ultra Small Surface Mount Tricolor ChipLED Data Sheet Features Applications         LED with AlInGaP and InGaN die Surface mount device with ultra small 1.0 x 1.0mm footprint Suitable for application that requires small pitch size Compatible with reflow soldering Taped in 8mm carrier tape on a 7 inch diameter reel Display Backlighting Indicator Package Dimensions Notes: 1. All dimensions in millimeters. 2. Tolerance is ±0.1mm unless otherwise specified. CAUTION: This LED is class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional details. 1 Absolute Maximum Ratings (TJ = 25°C) Parameter AlInGaP Red InGaN Green InGaN Blue Unit 10 10 10 mA 60 60 60 mA Power Dissipation 22 31 33 mW LED Junction Temperature 95 95 95 °C DC Forward Current [1] Peak Forward Current [2] Operating Temperature Range -40 to 85 °C Storage Temperature Range -40 to 85 °C Notes: 1. Derate linearly as shown in Figure 7. 2. 1/10 duty factor and 0.1ms pulse width. Optical Characteristics (T J = 25°C, R=10mA, G/B=5mA) Color Luminous Intensity, Iv(mcd) [1] Peak Wavelength, λp(nm) Dominant Wavelength, λd (nm) [2] Viewing Angle, 2θ1/2 (°) [3] Min. Typ. Max. Typ. Typ. Typ. Red 63.0 80.0 140.0 631 622 137 Green 140.0 220.0 315.0 520 528 140 Blue 32.0 45.0 71.0 466 471 140 Notes: 1. The luminous intensity is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be aligned with the axis. 2. The dominant wavelength is derived from the CIE chromaticity diagram and represents the perceived color of the device. 3. Θ1/2 is the off axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristics (TJ = 25°C, R=10mA, G/B=5mA) Forward Voltage, VF (V) [1] Reverse Voltage, VR (V)[2] at IR=100μA Min. Max. Min. Red 1.8 2.2 5 Green 2.5 3.1 5 Blue 2.7 3.3 5 Color Notes: 1. Forward voltage tolerance ±0.1V. 2. Reverse voltage indicates product final test. Long term reverse bias is not recommended. 2 Bin Information Intensity Bins (CAT) - Red Color Bins (BIN) - Red Bin ID Luminous Intensity (mcd) Min. Max. P2 Q Q5 Q7 63.0 71.0 80.0 90.0 100.0 112.0 125.0 140.0 Bin ID Dominant Wavelength (nm) Min. Max. 1 615.0 627.0 Tolerance: ±1nm Tolerance: ±15% Intensity Bins (CAT) - Green Color Bins (BIN) - Green Bin ID Luminous Intensity (mcd) Min. Max. R7 R9 S S5 140.0 159.0 180.0 201.0 224.0 250.0 280.0 315.0 Tolerance: ±15% Bin ID Dominant Wavelength (nm) Min. Max. 2 3 4 5 6 523.0 525.0 528.0 530.0 533.0 529.0 531.0 534.0 536.0 539.0 Tolerance: ±1nm Intensity Bins (CAT) - Blue Color Bins (BIN) - Blue Bin ID Luminous Intensity (mcd) Min. Max. N5 N7 N9 P 32.0 36.0 40.0 45.0 50.0 56.0 63.0 71.0 Bin ID Dominant Wavelength (nm) Min. Max. 6 7 8 466.0 468.0 470.0 471.0 473.0 475.0 Tolerance: ±1nm Tolerance: ±15% Caution: 1. The above optical performance specifications are valid in the case where single LED is lit up. 2. The above product specifications DO NOT provide any guarantee on color mixing, color consistency over time or uniformity in luminous intensity when more than 1 LED is lit up. 3 0 Figure 1. Spectral power dissipation 10 20 30 40 If - mA 50 60 Figure 2. Relative intensity vs. forward current 60 50 If - mA 40 30 20 10 0 0 10 20 30 40 If - mA 50 Figure 3. Forward current vs. forward voltage Figure 4. Dominant wavelength shift vs. forward current Figure 5. Radiation pattern Figure 6. Relative intensity vs. temperature 4 60 MAXIMUM FORWARD CURRENT - mA 12 10 8 6 4 2 0 0 20 40 60 80 AMBIENT TEMPE RA TURE - °C 100 Figure 7. Derating curve Figure 8. Recommended soldering land pattern Figure 9. Reel dimensions 5 Figure 10. Carrier tape dimensions Soldering Recommended reflow soldering condition: (a) Reflow soldering must not be done more than 2 times. Do observe necessary precautions of handling moisture sensitive device as stated in below section. (b) Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. (c) It is preferred to use reflow soldering to solder the LED. But if unavoidable (such as rework), manual hand soldering can be used but must be strictly controlled to condition below: Soldering iron tip temperature = 310°C max Soldering duration = 2sec max Number of cycle = 1 only Power of soldering iron = 50W max (d) Do not touch the LED package body with the soldering iron except for the soldering terminals as it may cause damage to the LED. (e) User is advised to confirm beforehand whether the functionality and performance of the LED is affected by hand soldering. 6 PRECAUTIONARY NOTES 1. Handling of moisture sensitive device This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Do refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. (a) Before use - An unopened moisture barrier bag (MBB) can be stored at