HSMF-C150

HSMF-C150/C15A Bi Color Surface Mount ChipLED Data Sheet Caution: This LED is Class 1A ESD sensitive. Please observe appropriate precautions during handling and processing. Package Dimensions Polarity • • HSMF-C150 HSMF-C15A Green Amber Red Red All dimensions are in mm(inches). Tolerance ±0.1mm(±0.004in) unless otherwise specified. Device Selection Guide Part Number HSMF-C150 HSMF-C15A Color AlInGaP Red / AlInGaP Green AlInGaP Red / AlInGaP Amber Package description Untinted, Diffused Untinted, Diffused Absolute Maximum Value at TA=25°C Parameter AlInGaP Red AlInGaP Green AlInGaP Amber Unit Forward current 25 20 25 mA Power dissipation 60 48 60 mW Operating temperature -40 to 85 °C Storage temperature -40 to 85 °C Optical Characteristics at TA=25°C, If=20mA Color Luminous intensity Iv(mcd) Peak wavelength λp(nm) Dominant wavelength λd(nm) Viewing angle 2θ1/2(°) Min Typ Typ Typ Typ AlInGaP Red 18.0 79.0 644 632 170 AlInGaP Green 18.0 45.0 570 572 170 AlInGaP Amber 28.50 55.0 595 592 170 • Luminous intensity tolerance ±15%. Electrical Characteristics at TA=25°C, If=20mA Color Forward voltage Vf(V) Reverse voltage Vr(V) at Ir=100µA Thermal resistance Rθjp(°C/W) Typ Max Min Typ AlInGaP Red 2.0 2.4 5 325 AlInGaP Green 2.1 2.4 5 325 AlInGaP Amber 1.9 2.4 5 325 • • Forward voltage tolerance 0.1V. Reverse voltage Indicates product final testing, long terms reverse bias is not recommended. 1.0 RELATIVE INTENSITY 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 530 550 570 590 610 630 650 670 WAVELENGTH - nm Spectrum FORWARD CURRENT - mA 30 25 20 15 10 5 0 0 0.5 1 1.5 2 2.5 FORWARD VOLTAGE - V Forward current vs Forward voltage Forward current vs Ambient temperature Relative luminous intensity vs Forward current Radiation pattern Recommended Pb free reflow solder profile Reeling orientation Recommended solder pad pattern. Reel dimensions Tape dimensions Tape leader and trailer dimensions Storage condition: 5 to 30°C @60% RH max Baking is required under the condition (a) Humidity indicator card is >10% when read at 23±5°C. (b) Device exposed to factory conditions