HSMF-C157

Data Sheet HSMF-C153/C155/C156/C157/C158 Bicolor Surface-Mount ChipLEDs Features Description The Broadcom® HSMF-C15x series of bicolor chip-type LEDs is an industry-standard package for ease of handling and use. These bicolor LEDs are available as high efficiency red/yellow, high efficiency red/green, yellow/green, orange/ green and green/amber. The HSMF-C15x has the widely used 3.2 mm × 2.7 mm footprint and wide viewing angle that make this LED exceptional for backlighting applications. All packages are compatible with reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel indicators, especially where space is a premium.        Small size Industry-standard footprint Compatible with IR solder Diffused optics Operating temperature range of –40°C to +85°C Five color combinations available: Red/Yellow, Red/Green, Yellow/Green, Orange/Green and Green/Amber. Available in 8-mm tape on 178-mm (7-in.) diameter reels Applications     Push-button backlighting Symbol backlighting Status indicator Front panel indicator Device Selection Guide Part Number Parts per Reel HSMF-C153 3000 Color Package Description AlInGaP Yellow/Red Untinted, Diffused HSMF-C155 3000 AlInGaP Red/Green Untinted, Diffused HSMF-C156 3000 AlInGap Yellow/Green Untinted, Diffused HSMF-C157 3000 AlInGaP Orange/Green Untinted, Diffused HSMF-C158 3000 AlInGaP Green/Amber Untinted, Diffused CAUTION! HSMF-C15x LEDs are Class 1A ESD sensitive per JESD22-A114C.01 standard. Observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Broadcom AV02-0427EN April 28, 2022 HSMF-C153/C155/C156/C157/C158 Data Sheet Bicolor Surface-Mount ChipLEDs Package Dimensions Polarity Broadcom 1 2 3 4 HSMF-C153 HSMF-C155 HSMF-C156 HSMF-C157 HSMF-C158 Yellow Green Green Green Green Red Red Yellow Orange Amber AV02-0427EN 2 HSMF-C153/C155/C156/C157/C158 Data Sheet Bicolor Surface-Mount ChipLEDs Absolute Maximum Ratings at TA = 25°C AlInGaP Red/Yellow/ Orange/Green AlInGaP Amber Unit DC Forward Currenta 20 25 mA Power Dissipationb 52 60 mW Reverse Voltage (IR = 100 µA) 5 5 V LED Junction Temperature 95 95 °C Parameter Operating and Storage Temperature Range –40 to 85 Soldering Temperature °C See reflow soldering profile (Figure 6 and Figure 7) a. Derate linearly as shown in Figure 4 for temperature above 25°C. b. Pulse condition of 1/10 duty and 0.1 ms width Electrical Characteristics (TA = 25°C, IF = 20 mA) Forward Voltage,a VF (V) Part Number Color Reverse Current,b IR (µA) at VR = 5V Thermal Resistance,c RθJ-S (°C/W) Min. Typ. Max. Max. Typ. 1.60 2.10 2.60 100 325 HSMF-C153 AInGaP Yellow AlInGaP Red 1.60 2.10 2.60 100 325 HSMF-C155 AlInGaP Green 1.60 2.20 2.60 100 325 AlInGaP Red 1.60 2.10 2.60 100 325 HSMF-C156 AlInGaP Green 1.60 2.20 2.60 100 325 AlInGaP Yellow 1.60 2.10 2.60 100 325 HSMF-C157 AlInGaP Green 1.60 2.20 2.60 100 325 AlInGaP Orange 1.60 2.20 2.60 100 325 HSMF-C158 AlInGaP Green 1.60 2.10 2.40 100 325 AlInGaP Amber 1.60 1.90 2.40 100 325 a. Forward voltage tolerance is ±0.1V. b. Indicates product final test condition. Long-term reverse bias is not recommended. c. Thermal resistance from LED junction to solder point. Broadcom AV02-0427EN 3 HSMF-C153/C155/C156/C157/C158 Data Sheet Bicolor Surface-Mount ChipLEDs Optical Characteristics (TA = 25°C, IF = 20 mA) Dominant Wavelength, λd b (nm) Peak Wavelength, λp (nm) Viewing Angle 2θ1/2 c(Degrees) Typ. Typ. Typ. Typ. Luminous Intensity, IV a (mcd) Part Number HSMF-C153 HSMF-C155 HSMF-C156 HSMF-C157 HSMF-C158 Color Min. AInGaP Yellow 2.50 8.00 586 589 170 AlInGaP Red 2.50 10.00 626 630 170 AlInGaP Green 4.00 15.00 572 570 170 AlInGaP Red 2.50 10.00 626 630 170 AlInGaP Green 4.00 15.00 572 570 170 AlInGaP Yellow 2.50 8.00 586 589 170 AlInGaP Green 4.00 15.00 572 570 170 AlInGaP Orange 2.50 8.00 604 605 170 AlInGaP Green 28.50 45.00 572 570 170 AlInGaP Amber 28.50 55.00 592 595 170 a. The luminous intensity, IV, is measured at the mechanical axis of the package, and it is tested with a single current pulse condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. b. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. c. Broadcom θ½ is the off-axis angle where the luminous intensity is one half the peak intensity. AV02-0427EN 4 HSMF-C153/C155/C156/C157/C158 Data Sheet Bicolor Surface-Mount ChipLEDs Color Bin Limits1 AlInGaP Green AlInGaP Red Dominant Wavelength (nm) Dominant Wavelength (nm) Bin ID Minimum Maximum — 620.0 635.0 Tolerance: ±1 nm. Dominant Wavelength (nm) Bin ID Minimum Maximum A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 E 592.0 594.5 594.5 Minimum Maximum A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance: ±1 nm. AlInGaP Amber/Yellow F Bin ID 597.0 Tolerance: ±1 nm. AlInGaP Orange Dominant Wavelength (nm) Light Intensity (IV) Bin Limits Intensity (mcd) Bin ID Minimum Maximum A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 600.0 N 28.50 45.00 600.0 603.0 P 45.00 71.50 C 603.0 606.0 Q 71.50 112.50 D 606.0 609.0 R 112.50 180.00 E 609.0 612.0 F 612.0 615.0 S 180.00 285.00 Bin ID Minimum Maximum A 597.0 B Tolerance: ±1 nm. T 285.00 450.00 U 450.00 715.00 V 715.00 1125.00 W 1125.00 1800.00 X 1800.00 2850.00 Y 2850.00 4500.00 Tolerance: ±15%. 1. Broadcom Bin categories are established for classification of products. Products may not be available in all categories. Contact your Broadcom representative for information on current available bins. AV02-0427EN 5 HSMF-C153/C155/C156/C157/C158 Data Sheet Bicolor Surface-Mount ChipLEDs Figure 1: Relative Intensity vs. Wavelength 1.0 Green RELATIVE INTENSITY 0.9 0.8 Yellow/Amber 0.7 0.6 Orange Red 0.5 0.4 0.3 0.2 0.1 0.0 500 520 540 560 580 600 620 640 660 680 700 WAVELENGTH - nm Figure 2: Forward Current vs. Forward Voltage Figure 3: Luminous Intensity vs. Forward Current 1.4 35 Orange 30 1.2 Green LUMINOUS INTENSITY (NORMALIZED AT 20 mA) FORWARD CURRENT - mA Yellow/Amber 25 Red 20 15 10 5 0 1.5 1.7 1.9 2.1 2.3 2.5 FORWARD VOLTAGE - V 1 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 DC FORWARD CURRENT - mA 30 IF MAX. - MAXIMUM FORWARD CURRENT - mA Figure 4: Maximum Forward Current vs. Ambient Temperature 35 30 25 20 RθJ-A = 600°C/W 15 RθJ-A = 800°C/W 10 5 0 0 Broadcom 20 40 60 80 100 TA - AMBIENT TEMPERATURE - °C AV02-0427EN 6 HSMF-C153/C155/C156/C157/C158 Data Sheet Bicolor Surface-Mount ChipLEDs Figure 5: Relative Intensity vs. Angle for HSMF-C153, C155, C156, C157, and C158 1.00 RELATIVE INTENSITY - % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 060 7 9080 ANGLE Figure 6: Recommended Reflow Soldering Profile Figure 7: Recommended Pb-free Reflow Soldering Profile TEMPERATURE 10 SEC. MAX. 10 - 30 SEC. 4°C/SEC. MAX. 140-160°C 3°C/SEC. MAX. 4°C/SEC. MAX. OVER 2 MIN. TIME TEMPERATURE 230°C MAX. 217 °C 200 °C 255 - 260 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME (Acc. to J-STD-020C) Figure 8: Recommended Solder Pad Pattern 1.0 (0.039) 0.4 (0.016) 1.0 (0.039) 1.5 (0.059) NOTE: Broadcom 2.0 (0.079) 1.5 (0.059) All dimensions are in millimeters (inches). AV02-0427EN 7 HSMF-C153/C155/C156/C157/C158 Data Sheet Bicolor Surface-Mount ChipLEDs Figure 9: Reeling Orientation USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 10: Reel Dimensions 8.0 ± 1.0 (0.315 ± 0.039) Ø 20.20 MIN. (Ø 0.795 MIN.) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) NOTE: Broadcom 6 PS 5.0 ± 0.5 (0.197 ± 0.020) All dimensions are in millimeters (inches). AV02-0427EN 8 HSMF-C153/C155/C156/C157/C158 Data Sheet Bicolor Surface-Mount ChipLEDs Figure 11: Tape Dimensions 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMF-C15x SERIES DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) 3.52 (0.139) 3.02 (0.119) 1.40 (0.055) Figure 12: Tape Leader and Trailer Dimensions END START THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. NOTE: MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. All dimensions are in millimeters (inches). Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specified. Broadcom AV02-0427EN 9 HSMF-C153/C155/C156/C157/C158 Data Sheet Bicolor Surface-Mount ChipLEDs Precautionary Notes Soldering      Handling Precautions Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisture-sensitive devices as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: – Soldering iron tip temperature = 310°C maximum. – Soldering duration = 2 seconds maximum. – Number of cycles = 1 only. – Power of soldering iron = 50W maximum. Do not touch the LED package body with the soldering iron, except for the soldering terminals, because it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering. This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. Before use:   An unopened moisture barrier bag (MBB) can be stored at