HSMF-C162

HSMF-C16x Miniature Bi-Color Surface Mount ChipLEDs Data Sheet Description This series of bi-color ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of 1.6 mm x 0.8 mm and a height of only 0.5 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication. They are available in a wide range of color combinations. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel. These parts are compatible with reflow soldering. Features • Small size • 0603 industry standard footprint • Diffused optics • Operating temperature range of –30˚C to +85˚C • Compatible with reflow soldering • Available in various color combination • Available in 8 mm tape on 7" (178 mm) diameter reels Applications • Keypad backlighting • Symbol indicator • LCD backlighting • Pushbutton backlighting • Front panel indicator Device Selection Guide Part Number HSMF-C162 HSMF-C163 HSMF-C164 HSMF-C165 HSMF-C166 HSMF-C167 HSMF-C168 HSMF-C169 Color AlInGaP Red / AlInGaP Amber AlInGaP Red / InGaN Green AlInGaP Red / InGaN Blue High Efficiency Red / GaP Green GaP Yellow / GaP Green GaP Orange / GaP Green InGaN Green / InGaN Blue AlInGaP Amber / InGaN Blue Package Description Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused CAUTION: HSMF-C16x LEDs are class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Package Dimensions CATHODE LINE LED DIES 1 3 2 4 0.8 (0.031) 1.6 (0.063 ) DIFFUSED EPOXY 0.5 (0.020) 0.16 (0.006) PC BOARD 0.4 (0.016) CATHODE LINE 0.3 (0.012) SOLDERING TERMINALS POLARITY HSMF-C162 HSMF-C163 HSMF-C164 HSMF-C165 HSMF-C166 HSMF-C167 HSMF-C168 HSMF-C169 1 3 AMBER GREEN BLUE GREEN GREEN GREEN BLUE BLUE 2 4 RED RED RED RED YELLOW ORANGE GREEN AMBER NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. Absolute Maximum Ratings for Each Die at TA = 25˚C Parameter AlInGaP InGaN GaP Units DC Forward Current[1] 20 10 20 mA Power Dissipation 48 38 52 mW Reverse Voltage 5 5 5 V LED Junction Temperature 95 95 95 ˚C Operating Temperature Range –30 to +85 ˚C Storage Temperature Range –40 to +85 ˚C Soldering Temperature Note: 1. Derate linearly as shown in Figure 4.  See reflow soldering profile (Figure 6 & 7) Electrical Characteristics at TA = 25˚C Forward Voltage VF (Volts) @ IF[1] Color Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Capacitance C (pF), @ VF = 0, f = 1 MHz Typ. Thermal Resistance RθJ-PIN (˚C/W) Typ. AlInGaP Red 20 mA 1.9 2.4 5 15 300 AlInGaP Amber 20 mA 1.9 2.4 5 11 300 AlInGaP Red[2] 10 mA 1.8 2.3 5 15 300 AlInGaP Amber[2] 10 mA 1.8 2.3 5 11 300 InGaN Green 10 mA 3.4 3.8 5 35 500 InGaN Blue 10 mA 3.4 3.8 5 35 500 HER 20 mA 2.1 2.6 5 5 325 GaP Orange 20 mA 2.2 2.6 5 7 325 GaP Yellow 20 mA 2.1 2.6 5 6 325 9 325 GaP Green 20 mA 2.2 2.6 5 Notes: 1. VF Tolerance: ± 0.1 V. 2. The product testing is based on 20 mA. This is for reference only. Optical Characteristics at TA = 25˚C Peak Luminous Intensity Wavelength Iv (mcd) @ IF[1] λpeak (nm) Color Min. Typ. Typ. Color Dominant Wavelength Viewing Angle λd[2] (nm) 2 θ1/2 Degrees[3] Typ. Typ. Luminous Efficacy ηv (lm/W) Typ. AlInGaP Red 20 mA 28.5 90 637 626 120 155 AlInGaP Amber 20 mA 28.5 90 595 592 120 480 AlInGaP Red[4] 10 mA 11.2 35 637 626 120 155 AlInGaP Amber[4] 10 mA 11.2 35 595 592 120 480 InGaN Green 10 mA 18 45 523 525 120 500 InGaN Blue 10 mA 2.8 10 468 470 120 80 HER 20 mA 2.8 10 636 621 120 145 GaP Orange 20 mA 2.8 8 605 604 120 380 GaP Yellow 20 mA 2.8 8 589 586 120 500 GaP Green 20 mA 4.5 15 570 572 120 595 Notes: 1. The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength λd is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4. The product testing is based on 20 mA. This is for reference purpose.  Intensity (Iv) Bin Limits[1] Color Bin Limits[1] Green Color Bins[1] Yellow/Amber Color Bins[1] Dom. Wavelength (nm) Dom. Wavelength (nm) Bin ID Min. Max. Bin ID Min. Max. A 561.5 564.5 A 582.0 584.5 B 564.5 567.5 B 584.5 587.0 C 567.5 570.5 C 587.0 589.5 D 570.5 573.5 D 589.5 592.0 E 573.5 576.5 E 592.0 594.5 F 594.5 597.0 Tolerance: ± 0.5 nm Tolerance: ± 0.5 nm Blue Color Bins[1] Dom. Wavelength (nm) InGaN Green Color Bins[1] Bin ID Min. Max. Dom. Wavelength (nm) A 460.0 465.0 Bin ID Min. Max. B 465.0 470.0 A 515.0 520.0 C 470.0 475.0 B 520.0 525.0 D 475.0 480.0 C 525.0 530.0 D 530.0 535.0 Tolerance: ± 1 nm Orange Color Bins[1] Dom. Wavelength (nm) Bin ID Min. Max. A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 F 612.0 615.0 Tolerance: ± 1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins.  Tolerance: ± 1 nm Bin ID Intensity @ 20 mA (mcd) Min. Max. A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.00 285.00 T 285.00 450.00 U 450.00 715.00 V 715.00 1125.00 W 1125.00 1800.00 X 1800.00 2850.00 Y 2850.00 4500.00 Tolerance: ± 15%. Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 90 InGaN BLUE 80 InGaN GREEN AS AMBER 1.0 AS ORANGE GaP GREEN AS RED 70 RELATIVE INTENSITY RELATIVE INTENSITY – % 100 60 50 40 30 20 GaP YELLOW 0.5 GaP ORANGE HER 10 0 400 450 500 550 600 650 0 500 700 WAVELENGTH – nm 550 600 650 700 750 WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength. HSMF-C16x fig 1 100 IF – FORWARD CURRENT – mA IF – FORWARD CURRENT – mA 100 AS AlInGaP InGaN 10 1 0.1 1.5 2.0 2.5 3.0 3.5 HER 10 GaP ORANGE GaP YELLOW 1 GaP GREEN 0 1.5 1.6 1.7 1.8 1.9 4.0 2.1 2.2 2.3 2 VF – FORWARD VOLTAGE – V VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage. 1.6 1.4 1.2 1.4 1.2 1.0 0.8 0.6 AS AlInGaP 0.4 0.2 0 0 5 10 15 20 25 IF – FORWARD CURRENT – mA 30 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 LUMINOUS INTENSITY (NORMALIZED AT 10 mA) LUMINOUS INTENSITY (NORMALIZED AT 20 mA) HSMF-C16x fig 2 1.2 1.0 0.8 InGaN 0.6 0.4 0.2 0 0 2 4 6 8 10 12 IF – FORWARD CURRENT – mA Figure 3. Luminous intensity vs. forward current. HSMF-C16x fig 3a  14 HSMF-C16x fig 3b 16 1.0 0.8 GaP 0.6 0.4 0.2 0 0 5 10 15 20 25 IF – FORWARD CURRENT – mA 30 90 AlInGaP/GaP 20 RELATIVE INTENSITY – % IF MAX. – MAXIMUM FORWARD CURRENT – mA 100 25 15 InGaN 10 5 80 70 60 50 40 30 20 10 0 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 TA – AMBIENT TEMPERATURE – °C 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 4. Maximum forward current vs. ambient temperature. Figure 5. Relative intensity vs. angle. HSMF-C16x fig 5 10 SEC. MAX. TEMPERATURE 230°C MAX. 4°C/SEC. MAX. 140-160°C 3°C/SEC. MAX. 4°C/SEC. MAX. TIME 255 - 260 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 100 SEC. MAX. TIME Figure 6. Recommended reflow soldering profile. 0.60 (0.024) 0.40 (0.016) 0.30 (0.012) 0.40 (0.016) 0.70 (0.028) Figure 8. Recommended soldering pad pattern. HSMF-C16x fig 7  217 °C 200 °C 60 - 120 SEC. OVER 2 MIN. 0.70 (0.028) TEMPERATURE 10 - 30 SEC. (Acc. to J-STD-020C) Figure 7. Recommended Pb-free reflow soldering profile. USER FEED DIRECTION CATHODE SIDE xxx xxxxx xx xx xxxxxx xxxxx xx PRINTED LABEL Figure 9. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). Figure 10. Reel dimensions. 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 8.00 ± 0.30 (0.315 ± 0.012) CARRIER TAPE USER FEED DIRECTION COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMF-C16x SERIES DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004) 1.75 (0.069) 0.95 (0.037) Figure 11. Tape dimensions. END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 12. Tape leader and trailer dimensions. HSMF-C16x fig 15 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.  MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. 0.60 (0.024) Reflow Soldering For more information on reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30˚C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 ± 5˚C for 20 hours. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies, Limited. All rights reserved. Obsoletes 5989-4810EN AV02-0584EN - July 23, 2007