HSMF-C163

HSMF-C16x Miniature Bi-Color Surface Mount ChipLEDs Data Sheet Description Features This series of bi-color ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of 1.6 mm x 0.8 mm and a height of only 0.5 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication. They are available in a wide range of color combinations. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel. These parts are compatible with reflow soldering. • Small size • 0603 industry standard footprint • Diffused optics • Operating temperature range of –40° C to +85° C • Compatible with reflow soldering • Available in various color combination • Available in 8 mm tape on 7" (178 mm) diameter reels Applications • Keypad backlighting • Symbol indicator • LCD backlighting • Pushbutton backlighting • Front panel indicator Device Selection Guide Part Number Color Package Description HSMF-C162 AlInGaP Red / AlInGaP Amber Untinted, Diffused HSMF-C163 AlInGaP Red / InGaN Green Untinted, Diffused HSMF-C164 AlInGaP Red / InGaN Blue Untinted, Diffused HSMF-C165 High Efficiency Red / GaP Green Untinted, Diffused HSMF-C166 GaP Yellow / GaP Green Untinted, Diffused HSMF-C167 GaP Orange / GaP Green Untinted, Diffused HSMF-C168 InGaN Green / InGaN Blue Untinted, Diffused HSMF-C169 AlInGaP Amber / InGaN Blue Untinted, Diffused CAUTION: HSMF-C16x LEDs are class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Package Dimensions CATHODE LINE LED DIES 1 3 2 4 0.8 (0.031) 1.6 (0.063†) DIFFUSED EPOXY 0.5 (0.020) 0.16 (0.006) PC BOARD 0.4 (0.016) CATHODE LINE 0.3 (0.012) SOLDERING TERMINALS POLARITY HSMF-C162 HSMF-C163 HSMF-C164 HSMF-C165 HSMF-C166 HSMF-C167 HSMF-C168 HSMF-C169 1 3 AMBER GREEN BLUE GREEN GREEN GREEN BLUE BLUE 2 4 RED RED RED RED YELLOW ORANGE GREEN AMBER Notes: 1. All Dimensions in millimeters (Inches). 2. tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. Absolute Maximum Ratings for Each Die at TA = 25° C Parameter AlInGaP InGaN GaP Units DC Forward Current [1] 20 10 20 mA Power Dissipation 48 38 52 mW Reverse Voltage 5 5 5 V LED Junction Temperature 95 95 95 ˚C Operating Temperature Range Storage Temperature Range Soldering Temperature Note: 1. Derate linearly as shown in Figure 4. 2 –40 to +85 ˚C –40 to +85 ˚C See reflow soldering profile (Figure 6 & 7) Electrical Characteristics at TA = 25° C Forward Voltage VF (Volts) @ IF[1] Color Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Capacitance C (pF), @ VF = 0, f = 1 MHz Typ. Thermal Resistance RθJ-PIN (°C/W) Typ. AlInGaP Red 20 mA 1.9 2.4 5 15 300 AlInGaP Amber 20 mA 1.9 2.4 5 11 300 AlInGaP Red[2] 10 mA 1.8 2.3 5 15 300 AlInGaP Amber[2] 10 mA 1.8 2.3 5 11 300 InGaN Green 10 mA 3.4 3.8 5 35 500 InGaN Blue 10 mA 3.4 3.8 5 35 500 HER 20 mA 1.95 2.6 5 5 325 GaP Orange 20 mA 2.2 2.6 5 7 325 GaP Yellow 20 mA 2.1 2.6 5 6 325 9 325 GaP Green 20 mA 2.2 2.6 5 Notes: 1. VF Tolerance: ± 0.1 V. 2. The product testing is based on 20 mA. This is for reference only. Optical Characteristics at TA = 25° C Color Peak Dominant Luminous Luminous Intensity Wavelength Wavelength Viewing Angle Efficacy Iv (mcd) @ IF[1] λpeak (nm) λd[2] (nm) 2 θ1/2 Degrees[3] ηv (lm/W) Color Min. Typ. Typ. Typ. Typ. Typ. AlInGaP Red 20 mA 28.5 90 637 626 120 AlInGaP Amber 20 mA 28.5 90 595 592 120 155 480 10 mA 11.2 35 637 626 120 AlInGaP Red[4] 155 10 mA 11.2 35 595 592 120 AlInGaP Amber[4] 480 InGaN Green 500 10 mA 18 45 523 525 120 2.8 10 468 470 120 InGaN Blue 10 mA HER 20 mA 2.8 10 636 621 120 145 GaP Orange 20 mA 380 2.8 8 605 604 120 80 GaP Yellow 20 mA 2.8 8 589 586 120 500 GaP Green 595 20 mA 4.5 15 570 572 120 Notes: 1. The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength λd is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4. The product testing is based on 20 mA. This is for reference purpose. 3 Intensity (Iv) Bin Limits[1] Color Bin Limits[1] Green Color Bins[1] Yellow/Amber Color Bins[1] Dom. Wavelength (nm) Dom. Wavelength (nm) Bin ID Min. Bin ID Min. Max. Max. Bin ID Intensity @ 20 mA (mcd) Min. Max. A 0.11 0.18 B 0.18 0.29 A 561.5 564.5 A 582.0 584.5 C 0.29 0.45 B 564.5 567.5 B 584.5 587.0 D 0.45 0.72 C 567.5 570.5 C 587.0 589.5 E 0.72 1.10 D 570.5 573.5 D 589.5 592.0 F 1.10 1.80 E 573.5 576.5 E 592.0 594.5 G 1.80 2.80 Tolerance: ± 0.5 nm F 594.5 597.0 H 2.80 4.50 Tolerance: ± 0.5 nm J 4.50 7.20 Blue Color Bins[1] Dom. Wavelength (nm) InGaN Green Color Bins[1] Bin ID Min. Dom. Wavelength (nm) M 18.00 28.50 A 460.0 465.0 Bin ID Min. N 28.50 45.00 B 465.0 470.0 A 515.0 520.0 P 45.00 71.50 C 470.0 475.0 B 520.0 525.0 Q 71.50 112.50 D 475.0 480.0 C 525.0 530.0 R 112.50 180.00 D 530.0 535.0 S 180.00 285.00 Tolerance: ± 1 nm T 285.00 450.00 U 450.00 715.00 V 715.00 1125.00 W 1125.00 1800.00 X 1800.00 2850.00 Y 2850.00 4500.00 Max. Tolerance: ± 1 nm Orange Color Bins[1] Dom. Wavelength (nm) Bin ID Min. Max. A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 Max. K 7.20 11.20 L 11.20 18.00 Tolerance: ± 15%. D 606.0 609.0 E 609.0 612.0 F 612.0 615.0 Tolerance: ± 1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 4 Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 90 InGaN BLUE 80 InGaN GREEN AS AMBER 1.0 AS ORANGE GaP GREEN AS RED 70 RELATIVE INTENSITY RELATIVE INTENSITY – % 100 60 50 40 30 GaP YELLOW 0.5 GaP ORANGE HER 20 10 0 400 450 550 600 500 WAVELENGTH – nm 650 0 500 700 550 600 650 WAVELENGTH - nm 700 750 Figure 1. Relative intensity vs. wavelength. HSMF-C16x fig 1 100 100 IF – FORWARD CURRENT – mA IF – FORWARD CURRENT – mA AS AlInGaP InGaN 10 1 0.1 1.5 2.5 3.5 2.0 3.0 VF – FORWARD VOLTAGE – V HER 10 GaP ORANGE GaP YELLOW 1 GaP GREEN 0 1.5 4.0 1.7 1.8 1.9 2 2.1 VF – FORWARD VOLTAGE – V 1.6 2.2 2.3 Figure 2. Forward current vs. forward voltage. 1.4 1.6 1.4 1.2 1.4 1.2 0.8 0.6 AS AlInGaP 0.4 0.2 0 1.2 1.0 0.8 InGaN 0.6 0.4 0 5 10 20 25 15 IF – FORWARD CURRENT – mA 30 0 HSMF-C16x fig 3a 1.0 0.8 GaP 0.6 0.4 0.2 0.2 0 2 8 4 6 10 12 14 IF – FORWARD CURRENT – mA Figure 3. Luminous intensity vs. forward current. 5 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.0 LUMINOUS INTENSITY (NORMALIZED AT 10 mA) LUMINOUS INTENSITY (NORMALIZED AT 20 mA) HSMF-C16x fig 2 HSMF-C16x fig 3b 16 0 0 5 10 15 20 25 IF – FORWARD CURRENT – mA 30 100 90 AlInGaP/GaP 20 80 RELATIVE INTENSITY – % IF MAX. – MAXIMUM FORWARD CURRENT – mA 25 15 InGaN 10 5 70 60 50 40 30 20 10 0 0 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 10 20 30 40 50 60 70 80 90 100 TA – AMBIENT TEMPERATURE – °C Figure 4. Maximum forward current vs. ambient temperature. 0 10 ANGLE 20 30 40 50 60 70 80 90 Figure 5. Relative intensity vs. angle. HSMF-C16x fig 5 10 - 30 SEC. TEMPERATURE 230°C MAX. 4°C/SEC. MAX. 140-160°C 3°C/SEC. MAX. 4°C/SEC. MAX. TEMPERATURE 10 SEC. MAX. 217°C 200°C 255 - 260°C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3°C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. OVER 2 MIN. TIME TIME (Acc. to J-STD-020C) Figure 6. Recommended reflow soldering profile. 0.60 (0.024) 0.40 (0.016) 0.30 (0.012) 0.40 (0.016) 0.70 (0.028) 0.70 (0.028) Figure 8. Recommended soldering pad pattern. HSMF-C16x fig 7 6 Figure 7. Recommended Pb-free reflow soldering profile. USER FEED DIRECTION CATHODE SIDE xxx xxxxx xxxxx xxxxx xxxxx xx PRINTED LABEL Figure 9. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Note: 1. All Dimensions in millimeters (Inches). Figure 10. Reel dimensions. 7 6 PS 5.0 ± 0.5 (0.197 ± 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A ± 0.10 (± 0.004) DIM. B ± 0.10 (± 0.004) DIM. C ± 0.10 (± 0.004) HSMF-C16x 1.75 (0.069) 0.95 (0.037) 0.60 (0.024) Figure 11. Tape dimensions. END START THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Notes: 1. All Dimensions in millimeters (Inches). 2. tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. HSMF-C16x fig 15 Figure 12. Tape leader and trailer dimensions. Reflow Soldering For more information on reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30° C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/ transparent color b) the pack has been opened for more than 672 hours. Baking recommended condition: 60 ± 5° C for 20 hours. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-4810EN AV02-0584EN - April 3, 2012