HSMF-C165

Data Sheet HSMF-C16x Miniature Bi-Color Surface Mount ChipLEDs Features Description The Broadcom® HSMF-C16x series of bi-color ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry-standard footprint of 1.6 mm x 0.8 mm and a height of only 0.5 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication. They are available in a wide range of color combinations. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel. These parts are compatible with reflow soldering.        Small size 0603 industry-standard footprint Diffused optics Operating temperature range of –40°C to +85°C Compatible with reflow soldering Available in various color combination Available in 8-mm tape on 7 inch (178 mm) diameter reels Applications      Keypad backlighting Symbol indicator LCD backlighting Pushbutton backlighting Front-panel indicator Device Selection Guide Part Number Color Package Description HSMF-C162 AlInGaP Red/AlInGaP Amber Untinted, Diffused HSMF-C163 AlInGaP Red/InGaN Green Untinted, Diffused HSMF-C164 AlInGaP Red/InGaN Blue Untinted, Diffused HSMF-C165 AlInGaP Red/AlInGaP Green Untinted, Diffused HSMF-C166 AlInGaP Yellow/AlInGaP Green Untinted, Diffused HSMF-C167 AlInGaP Orange/AlInGaP Green Untinted, Diffused HSMF-C169 AlInGaP Amber/InGaN Blue Untinted, Diffused CAUTION! The HSMF-C16x LEDs are Class 1A ESD sensitive per JESD22-A114C.01 standard. Observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Broadcom AV02-0584EN May 13, 2022 HSMF-C16x Data Sheet Miniature Bi-Color Surface Mount ChipLEDs Package Dimensions CATHODE LINE LED DIES 1 3 2 4 0.8 (0.031) 1.6 (0.063†) DIFFUSED EPOXY 0.16 (0.006) PC BOARD 0.5 (0.020) 0.4 (0.016) CATHODE LINE 0.3 (0.012) SOLDERING TERMINALS NOTE:  All Dimensions are in millimeters (inches).  Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. Polarity Broadcom HSMF-C162 HSMF-C163 HSMF-C164 HSMF-C165 HSMF-C166 HSMF-C167 HSMF-C169 Amber Green Blue Green Green Green Blue Red Red Red Red Yellow Orange Amber AV02-0584EN 2 HSMF-C16x Data Sheet Miniature Bi-Color Surface Mount ChipLEDs Absolute Maximum Ratings for Each Die at TA = 25°C Parameter AlInGaP InGaN Unit DC Forward Currenta 20 10 mA Power Dissipation 52 38 mW Reverse Voltage 5 5 V LED Junction Temperature 95 95 °C Operating and Storage Temperature Range –40 to 85 Soldering Temperature °C See reflow soldering profile (Figure 6 and Figure 7) a. Derate linearly as shown in Figure 4. Electrical Characteristics (TA = 25°C) Voltage,a Forward VF (V) Part Number Test Current HSMF-C162 20 mA HSMF-C163 HSMF-C164 HSMF-C165 HSMF-C166 HSMF-C167 HSMF-C169 10 mA 10 mA 20 mA 20 mA 20 mA 10 mA Color Minimum Typical Reverse IR (µA) at VR = 5V Thermal Resistance,c RθJ-S (°C/W) Maximum Typical Current,b Maximum AInGaP Red 1.60 1.90 2.40 100 300 AlInGaP Amber 1.60 1.90 2.40 100 300 AlInGaP Red 1.60 1.80 2.40 100 300 InGaN Green 2.90 3.40 3.70 100 500 AlInGaP Red 1.60 1.80 2.40 100 300 InGaN Blue 2.90 3.40 3.70 100 500 AlInGaP Red 1.60 1.95 2.60 100 325 AlInGaP Green 1.60 2.20 2.60 100 325 AlInGaP Yellow 1.60 2.10 2.60 100 325 AlInGaP Green 1.60 2.20 2.60 100 325 AlInGaP Orange 1.60 2.20 2.60 100 325 AlInGaP Green 1.60 2.20 2.60 100 325 AlInGaP Amber 1.60 1.90 2.40 100 300 InGaN Blue 2.90 3.40 3.70 100 500 a. Forward voltage tolerance is ±0.1V. b. Indicates product final test condition. Long-term reverse bias is not recommended. c. Thermal resistance from LED junction to solder point. Broadcom AV02-0584EN 3 HSMF-C16x Data Sheet Miniature Bi-Color Surface Mount ChipLEDs Optical Characteristics (TA = 25°C) Luminous Intensity, IV a (mcd) Part Number HSMF-C162 HSMF-C163 HSMF-C164 HSMF-C165 HSMF-C166 HSMF-C167 HSMF-C169 Test Current Color 20 mA 10 mA 10 mA 20 mA 20 mA 20 mA 10 mA Minimum Dominant Wavelength, d b (nm) Peak Wavelength, p (nm) Viewing Angle 2θ1/2 c(Degrees) Typical Typical Typical Typical AInGaP Red 28.5 90.0 626 637 120 AlInGaP Amber 28.5 90.0 592 595 120 AlInGaP Red 11.2 35.0 626 637 120 InGaN Green 18.0 45.0 525 523 120 AlInGaP Red 11.2 35.0 626 637 120 InGaN Blue 2.80 10.0 470 468 120 AlInGaP Red 2.80 10.0 621 636 120 AlInGaP Green 4.50 15.0 572 570 120 AlInGaP Yellow 2.80 8.0 586 589 120 AlInGaP Green 4.50 15.0 572 570 120 AlInGaP Orange 2.80 8.0 604 605 120 AlInGaP Green 4.50 15.0 572 570 120 AlInGaP Amber 28.5 90.0 592 595 120 InGaN Blue 2.80 10.0 470 468 120 a. The luminous intensity, IV, is measured at the mechanical axis of the package, and it is tested with a single current pulse condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. b. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. c. ½ is the off-axis angle where the luminous intensity is one half the peak intensity. Color Bin Limits1 Green Color Bins Dominant Wavelength (nm) Bin ID Minimum Maximum A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance: ±0.5 nm. 1. Broadcom Bin categories are established for classification of products. Products may not be available in all categories. Contact your Broadcom representative for information on current available bins. AV02-0584EN 4 HSMF-C16x Data Sheet Miniature Bi-Color Surface Mount ChipLEDs InGaN Blue Color Bins InGaN Green Color Bins Dominant Wavelength (nm) Dominant Wavelength (nm) Bin ID Minimum Maximum Bin ID Minimum Maximum A 460.0 465.0 A 515.0 520.0 B 465.0 470.0 B 520.0 525.0 C 470.0 475.0 C 525.0 530.0 D 475.0 480.0 D 530.0 535.0 Tolerance: ±1 nm. Tolerance: ±1 nm. Orange Color Bins Light Intensity (IV) Bin Limits Dominant Wavelength (nm) Intensity (mcd) Bin ID Minimum Maximum Bin ID Minimum Maximum A 597.0 600.0 B 600.0 603.0 A 0.11 0.18 B 0.18 0.29 C 603.0 D 606.0 606.0 C 0.29 0.45 609.0 D 0.45 0.72 E F 609.0 612.0 E 0.72 1.10 612.0 615.0 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 Tolerance: ±1 nm. Amber/Yellow Color Bins Dominant Wavelength (nm) L 11.20 18.00 M 18.00 28.50 Bin ID Minimum Maximum N 28.50 45.00 A 582.0 584.5 P 45.00 71.50 B 584.5 587.0 Q 71.50 112.50 C 587.0 589.5 R 112.50 180.00 D 589.5 592.0 S 180.00 285.00 285.00 450.00 E 592.0 594.5 T F 594.5 597.0 U 450.00 715.00 V 715.00 1125.00 Tolerance: ±0.5 nm. W 1125.00 1800.00 Red Color Bins X 1800.00 2850.00 Y 2850.00 4500.00 Dominant Wavelength (nm) Bin ID Minimum Maximum – 620.0 635.0 Tolerance: ±15%. Tolerance: ±1 nm Broadcom AV02-0584EN 5 HSMF-C16x Data Sheet Miniature Bi-Color Surface Mount ChipLEDs Figure 1: Relative Intensity versus Wavelength RELATIVE INTENSITY – % 100 90 InGaN BLUE 80 InGaN GREEN 70 60 50 40 30 20 10 0 400 450 550 600 500 WAVELENGTH – nm 650 700 Figure 2: Forward Current versus Forward Voltage IF – FORWARD CURRENT – mA 100 InGaN 10 1 0.1 1.5 2.5 3.5 2.0 3.0 VF – FORWARD VOLTAGE – V 4.0 Figure 3: Luminous Intensity versus Forward Current 1.6 AllnGaP LUMINOUS INTENSITY (NORMALIZED AT 10 mA) 1.4 1.2 1.0 0.8 InGaN 0.6 0.4 0.2 0 Broadcom 0 2 4 6 8 10 12 14 IF – FORWARD CURRENT – mA 16 AV02-0584EN 6 HSMF-C16x Data Sheet Miniature Bi-Color Surface Mount ChipLEDs Figure 4: Maximum Forward Current versus Ambient Temperature 100 25 90 AlInGaP 20 80 RELATIVE INTENSITY – % IF MAX. – MAXIMUM FORWARD CURRENT – mA Figure 5: Relative Intensity versus Angle 15 InGaN 10 60 50 40 30 20 5 0 70 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 TA – AMBIENT TEMPERATURE – °C Figure 6: Recommended Reflow Soldering Profile 0 10 ANGLE 20 30 40 50 60 70 80 90 Figure 7: Recommended Pb-free Reflow Soldering Profile 10 - 30 SEC. TEMPERATURE 230°C MAX. 4°C/SEC. MAX. 140-160°C 3°C/SEC. MAX. 4°C/SEC. MAX. OVER 2 MIN. TEMPERATURE 10 SEC. MAX. 217°C 200°C 255 - 260°C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3°C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME TIME (Acc. to J-STD-020C) Figure 8: Recommended Solder Pad Pattern 0.60 (0.024) 0.40 (0.016) 0.30 (0.012) 0.70 (0.028) NOTE: Broadcom 0.70 (0.028) 0.40 (0.016) All dimensions are in millimeters (inches). AV02-0584EN 7 HSMF-C16x Data Sheet Miniature Bi-Color Surface Mount ChipLEDs Figure 9: Reeling Orientation USER FEED DIRECTION CATHODE SIDE xxx xxxxx xxxxx xxxxx xxxxx xx PRINTED LABEL Figure 10: Reel Dimensions 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) NOTE: Broadcom 6 PS 5.0 ± 0.5 (0.197 ± 0.020) All dimensions are in millimeters (inches). AV02-0584EN 8 HSMF-C16x Data Sheet Miniature Bi-Color Surface Mount ChipLEDs Figure 11: Tape Dimensions 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A ± 0.10 (± 0.004) DIM. B ± 0.10 (± 0.004) DIM. C ± 0.10 (± 0.004) HSMF-C16x 1.75 (0.069) 0.95 (0.037) 0.60 (0.024) Figure 12: Tape Leader and Trailer Dimensions END START THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. NOTE: MOUNTED WITH COMPONENTS. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. All dimensions are in millimeters (inches). Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specified. Broadcom AV02-0584EN 9 HSMF-C16x Data Sheet Miniature Bi-Color Surface Mount ChipLEDs Precautionary Notes Soldering      Handling Precautions Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisture-sensitive devices as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: – Soldering iron tip temperature = 310°C maximum. – Soldering duration = 2 seconds maximum. – Number of cycles = 1 only. – Power of soldering iron = 50W maximum. Do not touch the LED package body with the soldering iron, except for the soldering terminals, because it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering. Figure 13: Recommended Lead-Free Reflow Soldering Profile This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. Before use:  An unopened moisture barrier bag (MBB) can be stored at