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HSMH-C670

HSMH-C670

  • 厂商:

    AVAGO(博通)

  • 封装:

  • 描述:

  • 数据手册
  • 价格&库存
HSMH-C670 数据手册
1 Surface Mount Chip LEDs Technical Data HSMx-C650 HSMx-C670 HSMF-C655 Features Applications • Small Size • Industry Standard Footprint • Low Profile • Tinted, Diffused Optics • Compatible with IR Solder Process • Five Colors and Bicolor Available • Available in 8 mm Tape on 7" (178 mm) Diameter Reels • Push-Button Backlighting • LCD Backlighting • Symbol Backlighting • Front Panel Indicator Description These single and bicolor LEDs are designed in an industry standard package for ease of handling and use. Five different LED colors are available in two compact, low profile, single color packages. The 3.2 x 1.6 mm is an excellent all around package, and the small 2.0 x 1.25 mm package is designed for applications where space is limited. The single color LEDs have tinted diffused optics. The bicolor package is untinted, diffused. The small size, low 1.1 mm profile and wide viewing angle make these LEDs excellent for backlighting applications and front panel illumination. They are compatible with IR reflow soldering processes. Device Selection Guide Footprint (mm) DH AlGaAs Red High Efficiency Red Orange Yellow Green 3.20 x 1.60 HSMH-C650 HSMS-C650 HSMD-C650 HSMY-C650 HSMG-C650 2.00 x 1.25 HSMH-C670 HSMS-C670 HSMD-C670 HSMY-C670 HSMG-C670 3.20 x 2.70 Bicolor HERGreen HSMF-C655 2 CATHODE MARK CATHODE MARK POLARITY POLARITY 2.00 (0.079) 3.20 (0.126) 1.60 (0.063) 1.10 (0.043) 2.00 (0.079) 1.10 (0.043) 1.40 (0.055) 0.50 (0.020) 0.50 (0.020) 0.40 (0.016) 0.50 (0.020) HSMX-C650 Series HSMX-C670 Series [1206] [805] GREEN GREEN CATHODE MARK RED POLARITY RED/ORANGE/YELLOW 3.20 (0.126) 2.70 (0.106) 1.10 (0.043) 2.00 (0.079) 0.50 (0.020) 0.50 (0.020) R 0.25 (0.010) 1.40 (0.055) 0.90 (0.035) HSMF-C655 [1210] 1.25 (0.049) 3 Absolute Maximum Ratings at TA = 25°C HSMX-C650 HSMF-C655 HSMX-C670 Units DC Forward Current[1] 25 20 mA Power Dissipation 65 50 mW Reverse Voltage (IR = 100 µA) 5 5 V LED Junction Temperature 95 95 °C Operating Temperature Range -25 to +80 -25 to +80 °C Storage Temperature Range -30 to +85 -30 to +85 °C Parameter Soldering Temperature See SMT reflow soldering profile, Figure 6 Notes: 1. Derate linearly as shown in Figure 4 for temperatures above 25°C. Optical Characteristics at TA = 25°C Part Number Color Luminous Intensity IV (mcd) @ I F 20 mA[1] Min. Typ. Peak Wavelength λpeak (nm) Typ. Color, Dominant Wavelength λd [2] (nm) Typ. Viewing Angle 2 θ1/2 Degrees[3] Typ. HSMH-C650 HSMH-C670 DH AlGaAs Red 6.3 16.0 650 639 155 HSMS-C650 HSMS-C670 High Efficiency Red 1.6 5.0 639 626 155 HSMD-C650 HSMD-C670 Orange 1.6 4.0 606 604 155 HSMY-C650 HSMY-C670 Yellow 1.6 5.0 584 586 155 HSMG-C650 HSMG-C670 Green 4.0 9.0 566 571 155 HSMF-C655 High Efficiency Red 1.6 5.0 639 626 155 Green 4.0 9.0 566 571 155 Notes: 1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd , is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/ 2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4. Chip LEDs are supplied in 8 mm embossed tape on 178 mm (7 in.) diameter reels, with 3000 devices per reel. Minimum order quantity and order incremenets are in quantity of reels only. 4 Electrical Characteristics at TA = 25°C Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Capacitance C (pF) VF = 0, f = 1 MHz Typ. Thermal Resistance RθJ-PIN (°C/W) Part Number Color HSMH-C650 HSMH-C670 DH AlGaAs Red 1.8 2.2 5 46 460 300 HSMS-C650 HSMS-C670 High Efficiency Red 1.9 2.6 5 4.0 400 250 HSMD-C650 HSMD-C670 Orange 2.1 2.6 5 4.0 400 250 HSMY-C650 HSMY-C670 Yellow 2.1 2.6 5 3.0 400 250 HSMG-C650 HSMG-C670 Green 2.2 2.6 5 8.0 400 250 HSMF-C655 High Efficiency Red 1.9 2.6 5 3.7 325 Green 2.2 3.0 5 6.3 325 1.0 RELATIVE INTENSITY Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. ORANGE GREEN AlGaAs RED HIGH EFFICIENCY RED 0.5 YELLOW 0 500 550 600 650 WAVELENGTH – nm Figure 1. Relative Intensity vs. Wavelength. 700 750 5 1.6 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IE – FORWARD CURRENT – mA 30 YELLOW 25 ORANGE AlGaAs RED 20 15 HER GREEN 10 5 0 1.0 1.5 2.0 2.5 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 3.0 0 Figure 2. Forward Current vs. Forward Voltage. IF – FORWARD CURRENT – mA 35 30 25 20 15 10 5 0 20 40 60 80 100 TA – AMBIENT TEMPERATURE – °C Figure 4. Maximum DC Current vs. Ambient Temperature. 20° 10° 0° 1.0 NORMALIZED INTENSITY 30° 40° .8 50° .6 60° 70° 80° 90° .4 .2 10° 20° 30° 40° 50° 60° 70° 80° 90°100° ANGLE Figure 5. Intensity vs. Angle. 10 15 20 25 Figure 3. Relative Luminous Intensity vs. DC Forward Current. 40 0 5 IDC – DC FORWARD CURRENT – mA VF – FORWARD VOLTAGE – V 6 1.50 (0.059) 1.5 2.0 1.5 (0.059) (0.079) (0.059) 10 SEC. MAX. HSMX-C650 SERIES TEMPERATURE 230°C MAX. 4°C/SEC. MAX. 140-160°C 1.0 (0.039) 3°C/SEC. MAX. 4°C/SEC. MAX. 1.0 (0.039) 0.4 (0.016) 1.5 2.0 1.5 (0.059) (0.079) (0.059) OVER 2 MIN. TIME HSMF-C655 SERIES Figure 6. Recommended SMT Reflow Soldering Profile. 1.2 (0.047) 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) HSMX-C670 SERIES USER FEED DIRECTION Figure 7. Recommended Solder Patterns. CATHODE SIDE PRINTED LABEL 180 Ø (7.08) 21.0 (0.83) Figure 8. Reeling Orientation. 2.0 (0.08) 60.0 Ø (2.36) Ø 13.0 (0.51) LABEL 60° 60° 11.4 (0.45) 9.0 (0.35) Figure 9. Reel Dimensions. NOTE: ALL DIMENSIONS IN MILLIMETERS (INCHES). 7 1.50 + 0.10 0 Ø (0.059 + 0.004) 0 4.00 ± 0.10 (0.157 ± 0.004) 1.30 ± 0.10 (0.051 ± 0.004) CATHODE 0.20 ± 0.05 (0.008 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) USER FEED DIRECTION 4.00 ± 0.10 (0.157 ± 0.004) CARRIER TAPE COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B ± 0.10 (0.004) ± 0.10 (0.004) HSMx-C650 SERIES 3.75 (0.148) 2.10 (0.083) HSMx-C670 SERIES 2.40 (0.094) 1.60 (0.064) HSMF-C655 3.70 (0.146) 3.15 (0.124) Figure 10. Tape Dimensions. END THERE SHALL BE A MINIMUM OF 40 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS Figure 11. Tape Leader and Trailer Dimensions. THERE SHALL BE A MINIMUM OF 40 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. 150 mm-360 mm (5.9 - 14.2 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. 8 www.hp.com/go/led For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright © 1999 Hewlett-Packard Co. Obsoletes 5968-0946E 5968-4934E (4/99)
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