HSMH-H170

Data Sheet HSMH-H170 Mono Color Top Mount ChipLED Features Applications       LED with AlInGaP Red Compatible with reflow soldering Available in 8mm tape and 7” diameter reel 4000 units per reel Indicator Backlighting CAUTION! This LED is Class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional details. Broadcom HSMH-H170 December 8, 2021 HSMH-H170 Data Sheet Mono Color Top Mount ChipLED Figure 1: Package Dimensions NOTE: 1. All dimensions in millimeters. 2. Tolerance is ±0.10mm unless otherwise specified. Broadcom HSMH-H170 2 HSMH-H170 Data Sheet Mono Color Top Mount ChipLED Absolute Maximum Ratings Parameters Value Unit DC Forward Current a 25 mA Power Dissipation 65 mW LED Junction Temperature 95 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +85 °C a. Derate linearly as shown in Figure 6. Optical Characteristics (TJ = 25°C, IF = 20mA) Color Luminous Intensity, IV (mcd) a Dominant Wavelength, d (nm) b Peak Wavelength, p (nm) Viewing Angle 2θ1/2 (Degrees) c Min. Typ. Typ. Typ. 7.2 639 660 170 Red a. The luminous intensity, IV is measured at the mechanical axis of the package and it is tested with a single current pulse condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. b. The dominant wavelength, d is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. c. Θ1/2 is the off axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristics (TJ = 25°C, IF = 20mA) Color Red Forward Voltage, VF (V) a Reverse Current, IR (µA) at VR = 5V b Thermal Resistance RθJ-S (°C/W) c Min. Max. Max. Typ. 1.6 2.6 10 300 a. Forward voltage tolerance is ±0.1V. b. Indicates product final test condition. Long term reverse bias is not recommended. c. Thermal resistance from LED junction to solder point. Broadcom HSMH-H170 3 HSMH-H170 Data Sheet Mono Color Top Mount ChipLED Bin Information Intensity Bin Limits (CAT) Bin ID Luminous Intensity (mcd) Min. Max. K 7.2 11.2 L 11.2 18.0 M 18.0 28.5 N 28.5 45.0 P 45.0 71.5 Q 71.5 112.5 R 112.5 180.0 S 180.0 285.0 T 285.0 450.0 Tolerance = ±15% Color Bin Limits (BIN) Bin ID - Dominant Wavelength (nm) Min. Max. 630 650 Tolerance = ±1.0nm Broadcom HSMH-H170 4 HSMH-H170 Data Sheet Mono Color Top Mount ChipLED Figure 2: Spectral Power Distribution Figure 3: Forward Current vs. Forward Voltage Figure 4: Relative Luminous Intensity vs. Forward Current Figure 5: Radiation Pattern Figure 6: Derating Curve Figure 7: Recommended Soldering Land Pattern NOTE: 1. All dimensions in millimeters. 2. Tolerance is ±0.10mm unless otherwise specified. Broadcom HSMH-H170 5 HSMH-H170 Data Sheet Mono Color Top Mount ChipLED Figure 8: Carrier Tape Dimensions NOTE: 1. All dimensions in millimeters. 2. Tolerance is ±0.10mm unless otherwise specified. Figure 9: Reel Dimensions 9.0 178.5 60.0 PRODUCT LABEL USER FEED DIRECTION NOTE: All dimensions in millimeters. Broadcom HSMH-H170 6 HSMH-H170 Data Sheet Mono Color Top Mount ChipLED Precautionary Notes Soldering Handling Precautions  Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisturesensitive device as stated in the following section.  Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot.  This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices for additional details and a review of proper handling procedures. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: ─ Soldering iron tip temperature = 310°C max. ─ Soldering duration = 2sec max. ─ Number of cycles = 1 only ─ Power of soldering iron = 50W max.  Do not touch the LED package body with the soldering iron except for the soldering terminals, as it may cause damage to the LED.  Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering.   Figure 10: Recommended Lead-Free Reflow Soldering Profile TEMPERATURE 10 SEC. MAX. 217°C 200°C  255 – 260°C 3°C/SEC. MAX. 6°C/SEC. MAX.  Control of assembled boards: If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccator at 30°C/60% RH at any time. ─ The LED’s floor life exceeded 672 hours. The recommended baking condition is: 60±5ºC for 20 hours. 150°C 3°C/SEC. MAX. 60 – 120 SEC. 60 SEC. MAX. TIME Before use: ─ An unopened moisture barrier bag (MBB) can be stored at