HSML-C680

Data Sheet HSMx-C680 Right Angle Surface-Mount ChipLEDs Description The Broadcom® HSMx-C680 series of chip-type LEDs is designed to illuminate at a right angle to the direction of mounting. When mounted on a PC board, these devices emit light in a direction parallel to the board. The small 3.0 mm × 1.0 mm × 2.0 mm footprint of the HSMx-C680 is designed for applications where space is limited. These devices are available in four colors and use untinted, nondiffused optics. The HSMx-C680 series of parts are compatible with only the IR reflow soldering process. Features     Right angle mounting Compatible with IR reflow soldering process Available in a wide variety of colors Available in 8-mm tape on 178-mm (7-in.) diameter reels Applications     LCD backlighting Keypad side/backlighting Light piping Right angle indicator Device Selection Guide Part Number HSMA-C680 Parts per Reel Color 3000 AlInGaP Amber HSMC-C680 3000 AlInGaP Red HSMG-C680 3000 AlInGap Green HSML-C680 3000 AlInGaP Orange HSMS-C680 3000 AlInGaP Red HSMY-C680 3000 AlInGaP Yellow CAUTION! HSMx-C680 LEDs are Class 1A ESD sensitive per JESD22-A114C.01 standard. Observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Broadcom AV02-0481EN May 13, 2022 HSMx-C680 Data Sheet Right Angle Surface-Mount ChipLEDs Package Dimensions 3.0 1.0 0.3 0.3 2.0 2.0 1.0 0.25 0.25 0.88 CATHODE POLARITY MARK ANODE R 0.45 TO REINFORCE SOLDERING (NON-PIN CONNECTION) CATHODE ANODE Absolute Maximum Ratings at TA = 25°C HSMA-C680 HSMC-C680 HSML-C680 HSMG-C680 HSMS-C680 HSMY-C680 Unit DC Forward Current 30 25 mA Power Dissipation 72 65 mW Reverse Voltage (IR Max. 10 µA) 5 5 V LED Junction Temperature 95 95 °C Parameter Operating and Storage Temperature Range Soldering Temperature Broadcom –40 to 85 °C See reflow soldering profile (Figure 6 and Figure 7) AV02-0481EN 2 HSMx-C680 Data Sheet Right Angle Surface-Mount ChipLEDs Electrical Characteristics at TA = 25°C, IF = 20 mA Forward Voltage, VF (V) Part Number Reverse Current, IR (µA) at VR = 5V Thermal Resistance RθJ-S (°C/W) Min. Typ. Max. Max. Typ. HSMA-C680 1.60 2.00 2.40 10 500 HSMC-C680 1.60 2.00 2.40 10 500 HSMG-C680 1.60 2.20 2.60 10 300 HSML-C680 1.60 2.00 2.40 10 500 HSMS-C680 1.60 2.00 2.60 10 300 HSMY-C680 1.60 2.10 2.60 10 300 Optical Characteristics at TA = 25°C, IF = 20 mA Luminous Intensity, IVa (mcd) Part Number Dominant Wavelength, λdb (nm) Peak Wavelength, λp (nm) Viewing Angle 2θ½c (Degrees) Typ. Typ. Typ. Min. Typ. HSMA-C680 28.50 76.90 591 594 115 HSMC-C680 28.50 62.30 630 643 115 HSMG-C680 4.50 13.30 573 568 125 HSML-C680 28.50 108.60 604 611 115 HSMS-C680 2.80 5.10 621 636 125 HSMY-C680 2.80 9.30 589 588 125 a. The luminous intensity, IV, is measured at the mechanical axis of the package, and it is tested with a single current pulse condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. b. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. c. Broadcom θ½ is the off-axis angle where the luminous intensity is one half the peak intensity. AV02-0481EN 3 HSMx-C680 Data Sheet Right Angle Surface-Mount ChipLEDs Color Bin Limits1 AlInGaP Amber/Yellow AlInGaP Orange Dominant Wavelength (nm) Dominant Wavelength (nm) Bin ID Minimum Maximum Bin ID Minimum Maximum A 582.0 584.5 A 597.0 600.0 B 584.5 587.0 B 600.0 603.0 C 587.0 589.5 C 603.0 606.0 D 589.5 592.0 D 606.0 609.0 E 592.0 594.5 E 609.0 612.0 F 594.5 597.0 F 612.0 615.0 Tolerance: ± 1 nm. Tolerance: ± 1 nm. AlInGaP Red Light Intensity (IV) Bin Limits Dominant Wavelength (nm) Intensity (mcd) Bin ID Minimum Maximum Bin ID Minimum Maximum — 620.0 635.0 H 2.80 4.50 Tolerance: ± 1 nm. AlInGaP Green Bin ID Dominant Wavelength (nm) Minimum J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Maximum Q 71.50 112.50 112.50 180.00 180.00 285.00 A 561.5 564.5 R B 564.5 567.5 S C 567.5 570.5 T 285.00 450.00 D 570.5 573.5 U 450.00 715.00 E 573.5 576.5 V 715.00 1125.00 W 1125.00 1800.00 X 1800.00 2850.00 Y 2850.00 4500.00 Tolerance: ± 1 nm. Tolerance: ± 15%. 1. Broadcom Bin categories are established for classification of products. Products may not be available in all categories. Contact your Broadcom representative for information on current available bins. AV02-0481EN 4 HSMx-C680 Data Sheet Right Angle Surface-Mount ChipLEDs Figure 1: Relative Intensity vs. Wavelength Figure 3: Luminous Intensity vs. Forward Current Figure 4: Maximum Forward Current vs. Ambient Temperature, HSMA-C680, HSMC-C680, HSML-C680 Figure 5: Maximum Forward Current vs. Ambient Temperature, HSMG-C680, HSMS-C680, HSMY-C680 35 30 30 25 FORWARD CURRENT – mA MAXIMUM FORWARD CURRENT - mA Figure 2: Forward Current vs. Forward Voltage 25 20 15 10 5 0 0 Broadcom 20 40 60 80 AMBIENT TEMPERATURE - °C 100 20 15 10 5 0 0 20 40 60 80 100 AMBIENT TEMPERATURE – °C AV02-0481EN 5 HSMx-C680 Data Sheet Right Angle Surface-Mount ChipLEDs Figure 6: Recommended Reflow Soldering Profile Figure 7: Recommended Pb-Free Reflow Soldering Profile 10 - 30 SEC. 230 C MAX. 4 C/SEC. MAX. 140-160 C –3 C/SEC. MAX. 4 C/SEC. MAX. OVER 2 MIN. TEMPERATURE TEMPERATURE 10 SEC. MAX. 217 °C 200 °C 255 - 260 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 150 °C TIME 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME (Acc. to J-STD-020C) Figure 8: Recommended Soldering Land Pattern EMITTED DIRECTION NOTE: 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. Figure 9: Reeling Orientation USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Broadcom AV02-0481EN 6 HSMx-C680 Data Sheet Right Angle Surface-Mount ChipLEDs Figure 10: Reel Dimensions 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 20.20 MIN. (Ø 0.795 MIN.) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 5.0 ± 0.5 (0.197 ± 0.020) 6 PS Figure 11: Carrier Tape Dimensions 4.00 ± 0.10 (0.157 ± 0.004) Ø 1.20 1.50 + 0.100 (0.059 + 0.004) CATHODE 0.20 1.75 ± 0.10 (0.069 ± 0.004) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE) DIM. B (SEE TABLE) 8.00 ± 0.30 (0.315 ± 0.012) USER FEED DIRECTION Ø1.1 4.00 ± 0.10 (0.157 ± 0.004) 2.00 ± 0.05 (0.079 ± 0.002) PART NUMBER HSMx-C680 DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) 3.35 (0.132) 2.30 (0.091) 1.20 (0.047) DIMENSIONS IN MILLIMETERS (INCHES) Broadcom AV02-0481EN 7 HSMx-C680 Data Sheet Right Angle Surface-Mount ChipLEDs Precautionary Notes Soldering      Handling Precautions Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisture-sensitive devices as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: – Soldering iron tip temperature = 310°C maximum. – Soldering duration = 2 seconds maximum. – Number of cycles = 1 only – Power of soldering iron = 50W maximum. Do not touch the LED package body with the soldering iron except for the soldering terminals, because it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering. This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. Before use:   An unopened moisture barrier bag (MBB) can be stored at